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5SMY12N4500

Description
Insulated Gate Bipolar Transistor, 55A I(C), 4500V V(BR)CES, N-Channel, 14.30 X 14.30 MM, DIE-1
CategoryDiscrete semiconductor    The transistor   
File Size606KB,4 Pages
ManufacturerABB
Websitehttp://www.abb.com/
Download Datasheet Parametric Compare View All

5SMY12N4500 Overview

Insulated Gate Bipolar Transistor, 55A I(C), 4500V V(BR)CES, N-Channel, 14.30 X 14.30 MM, DIE-1

5SMY12N4500 Parametric

Parameter NameAttribute value
Parts packaging codeDIE
package instructionUNCASED CHIP, S-XUUC-N1
Contacts1
Reach Compliance Codecompli
Maximum collector current (IC)55 A
Collector-emitter maximum voltage4500 V
ConfigurationSINGLE
JESD-30 codeS-XUUC-N1
Number of components1
Number of terminals1
Maximum operating temperature125 °C
Package body materialUNSPECIFIED
Package shapeSQUARE
Package formUNCASED CHIP
Polarity/channel typeN-CHANNEL
Certification statusNot Qualified
surface mountYES
Terminal formNO LEAD
Terminal locationUPPER
transistor applicationsPOWER CONTROL
Transistor component materialsSILICON
Nominal off time (toff)2460 ns
Nominal on time (ton)900 ns
Base Number Matches1
IGBT and Diode dies
ABB Semiconductors
ABB IGBT and Diode dies from state-
of-the-art SPT
planar technology
platform.
Fig.1 Un-sawn wafer, sawn wafer die on frame and pick-and-place dies in waffle-packs
ABB Semiconductor has a well established reputation in the
field of high power semiconductors for switching devices. This
is reflected in the most complete product portfolio by any
supplier of high power semiconductors. The portfolio covers a
wide range of Bipolar and BiMOS devices such as Thyristors,
Diodes, GTOs, IGBTs and IGCTs with operation voltages of up
to 8.5 kV for the Industrial, Traction and Energy Management
markets.
ABB Semiconductor IGBT (Insulated Gate Bipolar Transistor)
high power modules (HiPak
) and press-packs (StakPak
)
are manufactured using SPT
chipsets developed and pro-
duced at our own facilities in Switzerland. The goal is to make
the modules and press-packs from ABB Best-in-Class in terms
of switching performance, ruggedness and reliability. The
SPT
chipsets are available for manufacturers of semicon-
ductor power device packages targeting demanding appli-
cations in the field of power electronics.
1200 V IGBT modules are widely used in household equipment
and in motor drives for renewables (solar & wind), battery
back-ups systems (UPS) and electrical vehicles. The various
requirements in package design and output power is suppor-
ted by the broad number of chipsets for 1200 V offered by
ABB Semiconductors (see table).
1700 V IGBT modules are used in various low and medium
voltage drives (LVD/MVD) mainly for industrial applications and
traction applications. The range of modules serving these
applications is huge. ABB Semiconductors is serving both the
industrial market and the traction market with the largest single
switch; the 1.7 kV / 3.6 kA module rated at 150°C suitable for
instance for high power induction heating and smelting.
Smaller industrial packages are also common and ABB is
serving this part of the 1.7 kV market with planar technology
IGBT and Diode chipsets.
Higher voltage IGBT and Diode chipsets are mainly used in
very high power applications requiring expertise in packaging
and handling of the chips prior to packaging. ABB Semicon-
ductors offer chipsets in the range from 2.5 kV to 6.5 kV in
limited volumes for customer specific applications.
Power and productivity
for a better world

5SMY12N4500 Related Products

5SMY12N4500 5SMY12L4500 5SMY12M3300 5SMX76K1701
Description Insulated Gate Bipolar Transistor, 55A I(C), 4500V V(BR)CES, N-Channel, 14.30 X 14.30 MM, DIE-1 Insulated Gate Bipolar Transistor, 42A I(C), 4500V V(BR)CES, N-Channel, 12.80 X 12.80 MM, DIE-1 Insulated Gate Bipolar Transistor, 62.5A I(C), 3300V V(BR)CES, N-Channel, 13.60 X 13.60 MM, DIE-1 Insulated Gate Bipolar Transistor, 75A I(C), 1700V V(BR)CES, N-Channel, 11.90 X 11.90 MM, DIE-1
Parts packaging code DIE DIE DIE DIE
package instruction UNCASED CHIP, S-XUUC-N1 UNCASED CHIP, S-XUUC-N1 UNCASED CHIP, S-XUUC-N1 UNCASED CHIP, S-XUUC-N1
Contacts 1 1 1 1
Reach Compliance Code compli compliant compliant compliant
Maximum collector current (IC) 55 A 42 A 62.5 A 75 A
Collector-emitter maximum voltage 4500 V 4500 V 3300 V 1700 V
Configuration SINGLE SINGLE SINGLE SINGLE
JESD-30 code S-XUUC-N1 S-XUUC-N1 S-XUUC-N1 S-XUUC-N1
Number of components 1 1 1 1
Number of terminals 1 1 1 1
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape SQUARE SQUARE SQUARE SQUARE
Package form UNCASED CHIP UNCASED CHIP UNCASED CHIP UNCASED CHIP
Polarity/channel type N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
surface mount YES YES YES YES
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location UPPER UPPER UPPER UPPER
transistor applications POWER CONTROL POWER CONTROL POWER CONTROL POWER CONTROL
Transistor component materials SILICON SILICON SILICON SILICON
Maximum operating temperature 125 °C 125 °C 125 °C -
Certification status Not Qualified Not Qualified Not Qualified -
Base Number Matches 1 1 1 -
Maker - ABB ABB ABB
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