zero-cross turn-on circuitry and is specified with a
blocking voltage of 800V
P
.
In addition, the tightly controlled zero-cross circuitry
ensures low noise switching of AC loads by minimizing
the generation of transients. The optically coupled
input and output circuits provide 5000V
rms
of isolation
between the control and load circuits. As a result, the
CPC1964B is well suited for industrial environments
where electromagnetic interference would disrupt the
operation of plant facility communication and control
systems.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Load Current up to 1.5A
rms
800V
P
Blocking Voltage
5mA Sensitivity
5000V
rms
Input to Output Isolation
Off-State dV/dt: 1000V/s Minimum
12.5mm External Creepage Distance with
Appropriate Layout
Zero-Cross Switching
DC Control, AC Output
Optically Isolated
TTL and CMOS Compatible
Low EMI and RFI Generation
High Noise Immunity
Approvals
• UL 508: Pending
• CSA Industrial Control Switches Approval: Pending
Ordering Information
Applications
•
•
•
•
•
•
•
•
•
•
•
Programmable Control
Process Control
Power Control Panels
Remote Switching
Gas Pump Electronics
Contactors
Large Relays
Solenoids
Motors
Heaters
Meters
Part #
CPC1964B
Description
8-Pin Power SOIC (25/Tube)
Pin Configuration
AC Load
8
7
AC Load
6
5
ZC
1
N/C
2
+ LED
3
– LED
4
N/C
Pb
DS-CPC1964B-R02
e
3
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1
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NTEGRATED
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage (V
DRM
)
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage Input to Output
ESD, Human Body Model
i
2
t for Fusing (1/2 Sine Wave, 50Hz)
Operational Temperature
Storage Temperature
1
2
CPC1964B
Ratings
800
5
50
1
150
2400
5000
4
1.6
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
kV
A
2
s
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 20 mW / ºC
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current, Continuous
Maximum Surge Current
Off State Leakage Current
On-State Voltage Drop
1
Off-State dV/dt
Switching Speeds
Turn-on
Turn-off
Zero-Cross Turn-On Voltage
Holding Current
Latching Current
Operating Frequency
2
Load Power Factor for
Guaranteed Turn-On
3
Input Characteristics
Input Control Current to Activate
4
Input Drop-out Voltage to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
Conditions
V
L
=120-280V
rms
t < 20ms
I
F
=0mA, V
L
=V
DRM
I
F
=5mA, I
L
=1.5A
P
I
F
=0mA
I
F
= 5 mA
1st half cycle
Subsequent half cycle
-
-
-
f=60Hz
f=60Hz, I
L
=1A Resistive
-
I
F
=5mA
V
R
=5V
-
Symbol
I
L
I
P
I
LEAK
-
dV/dt
t
on
t
off
-
-
I
H
I
L
Min
0.1
-
-
-
1000
-
-
-
-
-
-
20
0.25
-
0.8
0.9
-
-
Typ
-
-
-
1.21
-
-
-
5
-
-
-
-
-
-
-
1.2
-
-
Max
1.5
16
100
1.4
-
0.5
0.5
20
5
75
75
500
-
5
-
1.4
10
3
Units
A
rms
A
P
A
P
V
P
V/s
cycles
cycles
V
V
mA
mA
Hz
-
mA
V
V
A
pF
PF
I
F
-
V
F
I
R
C
I/O
Tested at a peak value equivalent.
Zero Cross 1st half cycle @ <100Hz.
3
Snubber circuits may be required at low power factors.
4
For high-noise environments, or for high-frequency operation, use I > 10mA.
F
2
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PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
On-State Forward Voltage Drop
(N=50, I
F
=5mA, I
L
=1.5A)
CPC1964B
35
30
Device Count (N)
35
30
Device Count (N)
25
20
15
10
5
0
25
20
15
10
5
0
First Zero-Cross Turn-On
Voltage Distribution
(N=50, I
F
=5mA)
25
20
15
10
5
0
1.25
1.26
1.27
1.28
1.29
LED Forward Voltage (V)
1.30
Device Count (N)
1.200 1.205 1.210 1.215 1.220 1.225 1.230
Forward Voltage (V
P
)
4.5
5.0
5.5 6.0 6.5 7.0 7.5
Zero Cross Voltage (V)
8.0
30
25
Device Count (N)
Typical I
F
for Switch Operation
Resistive Load
(N=50, I
L
=1.5A, V
L
=120VAC, 60Hz)
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
20
15
10
5
0
0.6
0.8
1.0
1.2
1.4
1.6
LED Forward Current (mA)
1.8
850
865
880
895
910
Blocking Voltage (V
P
)
925
Typical LED Forward Voltage Drop
vs. Temperature
1.6
LED Forward Current (mA)
LED Forward Voltage (V)
1.5
1.4
1.3
1.2
1.1
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
-40
Typical I
F
for Switch Operation
Resistive Load
(I
L
=350mA, 60Hz)
LED Forward Current (mA)
2.85
2.80
2.75
2.70
2.65
2.60
2.55
2.50
2.45
-40
Typical I
F
for Switch Operation
Inductive Load
(I
L
=500mA, 60Hz, 200mH)
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
3.2
LED Forward Current (mA)
3.0
2.8
2.6
2.4
2.2
2.0
0
Typical I
F
for Switch Operation
vs. Load Frequency (Resistive)
(I
L
=4.91A
rms
, V
P
=67V, R
L
=10 )
8.5
First Zero-Cross Turn-On Voltage
(I
F
=5mA, R
L
=120 )
Holding current (mA)
80
70
60
50
40
30
20
Holding Current
(R
L
=1.9 )
Zero-Cross (V)
100
200
300
400
Load Frequency (Hz)
500
8.0
7.5
7.0
6.5
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R02
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IRCUITS
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PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
On-State Voltage vs. Temperature
1.25
On-State Voltage (V
P
)
1.20
1.15
1.10
1.05
1.00
0.95
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
L
=0.5A
Load Current (A)
I
L
=1.5A
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-1.5
CPC1964B
Typical Load Current
vs. Load Voltage
(I
F
=5mA)
Load Current (A
rms
)
@ 85ºC
@ 25ºC
@ -40ºC
1.75
1.50
1.25
1.00
0.75
0.50
-40
Maximum Load Current
vs. Temperature
(I
L
=5mA)
I
L
=1A
-1.0
-0.5
0.0
0.5
1.0
1.5
-20
0
Load Voltage (V)
20
40
60
Temperature (ºC)
80
100
Typical Blocking Voltage
vs. Temperature
1050
Leakage Current ( A)
Blocking Voltage (V
P
)
10
Typical Leakage Current
vs. Temperature
20
V
L
=800V
V
L
=300V
Maximum Surge Current vs. Time
1000
Load Current (A
P
)
1
15
950
0.1
10
900
0.01
5
850
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.001
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0
100 s
1ms
10ms 100ms
1s
Time (ms)
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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Manufacturing Information
Moisture Sensitivity
CPC1964B
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC1964B
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
CPC1964B
Maximum Temperature x Time
245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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