834-99-003-10-001 datasheet, PDF

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834-99-003-10-001: DescriptionBoard Connector, 3 Contact(s), 1 Row(s), Female, Straight, Solder Terminal; CategoryThe connector The connector; File Size245KB，2 Pages; ManufacturerMill-Max; Websitehttps://www.mill-max.com

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834-99-003-10-001 Overview

Board Connector, 3 Contact(s), 1 Row(s), Female, Straight, Solder Terminal

834-99-003-10-001 Parametric

Parameter Name	Attribute value
Maker	Mill-Max
Reach Compliance Code	unknown
Other features	OFP, LOW PROFILE
Connector type	BOARD CONNECTOR
Contact point gender	FEMALE
Filter function	NO
Mixed contacts	NO
Installation method	STRAIGHT
Installation type	BOARD
Number of rows loaded	1
Terminal pitch	2.54 mm
Termination type	SOLDER
Total number of contacts	3

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INTERCONNECTS

OFP® Pass Thru Sockets for Ø.030” &

Single and Double Row

•

834/835 Series Pass Thru Sockets have a low

.130” profile and will accept Ø.030” round pin,

as well as industry standard .025” square pin

headers.

•

They are typically used to interconnect two or

more parallel circuit boards.

•

Sockets are designed for hand, wave or reflow*

soldering. The high temp. insulator is compati-

ble with all solder processes.

•

Unique

ORGANIC FIBRE PLUG®

barriers pre-

vent solder, paste or flux from contaminating

the internal spring contacts. After soldering, the

OFP®

barriers are pushed out of the socket

when the mating header is inserted.

•

Mill-Max sockets use a precision machined

brass sleeve with a press-fit beryllium copper

“multi-finger” spring contact.

•

Recommended mounting holes are Ø.046

±.003” PTH (1,2 mm drilled prior to plating).

*Intrusive reflow (also called "pin-in-paste") is a tech-

nique of using conventional thru-hole components

in a reflow soldering process. The pass thru socket

is placed into plated-thru-holes in the circuit board

(solder paste has previously been screen printed on

pads adjacent to the holes) and the board is

reflowed in the same pass as other SMT compo-

nents. Solder will fill the plated-thru-holes and

achieve solder joints as reliable as wave soldering.

The OFP® barrier prevents solder paste from being

picked-up inside the contact during assembly.

Series 834, 835

.025” pins

Typical Application

Patent Pending

Ordering Information

Single Row

OFP® Pass Thru Socket

834-XX-0 _ _-10-001

01-64

Fig. 1

Specify # of pins

Fig. 1

Double Row OFP® Pass Thru Socket

835-XX-0 _ _-10-001

Fig. 2

Specify # of pins

XX= Plating Code

See Below

SPECIFY PLATING CODE XX=

02-72

30μ” Au

200μ”Sn/Pb

Sleeve (Pin)

200μ” Sn/Pb 200μ”Sn/Pb

Fig. 2

Contact (Clip)

(6/04 - 550, 547, 535, 529)

w w w. m i l l - m a x . c o m

516-922-6000

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