HYB18T512160AC-3S datasheet, PDF

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HYB18T512160AC-3S: DescriptionDDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, 12.50 X 10 MM, MO-207DK-Z, FBGA-84; Categorystorage storage; File Size2MB，89 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/

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HYB18T512160AC-3S Overview

DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, 12.50 X 10 MM, MO-207DK-Z, FBGA-84

HYB18T512160AC-3S Parametric

Parameter Name	Attribute value
Maker	Infineon
Parts packaging code	DSBGA
package instruction	FBGA,
Contacts	84
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.45 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B84
length	12.5 mm
memory density	536870912 bit
Memory IC Type	DDR DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	84
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	95 °C
Minimum operating temperature
organize	32MX16
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	10 mm

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D a t a S h e e t , V 1. 1 1 , D e c . 2 0 0 3

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s t o p

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HYB18T512160AC-3S Related Products

	HYB18T512160AC-3S	HYB18T512800AC-3S	HYB18T512400AC-3S	HYB18T512800AC-3	HYB18T512400AC-3	HYB18T512160AC-3
Description	DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, 12.50 X 10 MM, MO-207DK-Z, FBGA-84	DDR DRAM, 64MX8, 0.45ns, CMOS, PBGA60, 10.50 X 10 MM, MO-207DJ-Z, FBGA-60	DDR DRAM, 128MX4, 0.45ns, CMOS, PBGA60, 10.50 X 10 MM, MO-207DJ-Z, FBGA-60	DDR DRAM, 64MX8, 0.45ns, CMOS, PBGA60, 10.50 X 10 MM, MO-207DJ-Z, FBGA-60	DDR DRAM, 128MX4, 0.45ns, CMOS, PBGA60, 10.50 X 10 MM, MO-207DJ-Z, FBGA-60	DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, 12.50 X 10 MM, MO-207DK-Z, FBGA-84
Parts packaging code	DSBGA	DSBGA	DSBGA	DSBGA	DSBGA	DSBGA
package instruction	FBGA,	FBGA,	FBGA,	FBGA,	FBGA,	FBGA,
Contacts	84	60	60	60	60	84
Reach Compliance Code	unknown	unknown	unknown	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	0.45 ns	0.45 ns	0.45 ns	0.45 ns	0.45 ns	0.45 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B84	R-PBGA-B60	R-PBGA-B60	R-PBGA-B60	R-PBGA-B60	R-PBGA-B84
length	12.5 mm	10.5 mm	10.5 mm	10.5 mm	10.5 mm	12.5 mm
memory density	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit	536870912 bit
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	16	8	4	8	4	16
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	84	60	60	60	60	84
word count	33554432 words	67108864 words	134217728 words	67108864 words	134217728 words	33554432 words
character code	32000000	64000000	128000000	64000000	128000000	32000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	95 °C	95 °C	95 °C	95 °C	95 °C	95 °C
organize	32MX16	64MX8	128MX4	64MX8	128MX4	32MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA	FBGA	FBGA	FBGA	FBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
Maker	Infineon	-	Infineon	Infineon	Infineon	Infineon

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