5.1
40MX and 42MX FPGA Families
Fe a t ur es
High C apaci t y
•
•
•
•
•
•
•
•
•
•
Single-Chip ASIC Alternative
3,000 to 54,000 System Gates
Up to 2.5 kbits Configurable Dual-Port SRAM
Fast Wide-Decode Circuitry
Up to 202 User-Programmable I/O Pins
5.6 ns Clock-to-Out
250 MHz Performance
5 ns Dual-Port SRAM Access
100 MHz FIFOs
7.5 ns 35-Bit Address Decode
• Commercial, Military Temperature and MIL-STD-883
Ceramic Packages
• QML Certification
• Ceramic Devices Available to DSCC SMD
E ase of Int egr at io n
• Mixed Voltage Operation (5.0V or 3.3V I/O)
• Synthesis-Friendly Architecture to Support ASIC Design
Methodologies
• Up to 100% Resource Utilization and 100% Pin Fixing
• Deterministic, User-Controllable Timing
• Unique In-System Diagnostic and Verification Capability
with Silicon Explorer II
• Low Power Consumption
• IEEE Standard 1149.1 (JTAG) Boundary Scan Testing
• 5.0V and 3.3V Programmable PCI-Compliant I/O
High P er f or m ance
HiR el Feat ur es
• Commercial, Industrial, and Military Temperature Plastic
Packages
Pr od uc t P r o f i l e
Device
Capacity
A40MX02
A40MX04
A42MX09
A42MX16
A42MX24
A42MX36
System Gates
SRAM Bits
Logic Modules
3,000
N/A
—
295
—
9.5 ns
N/A
—
147
1
57
No
No
44, 68
100
80
—
—
—
6,000
N/A
—
547
—
9.5 ns
N/A
—
273
1
69
No
No
44, 68, 84
100
80
—
—
—
14,000
N/A
348
336
N/A
5.6 ns
N/A
348
516
2
104
No
No
84
100, 160
100
176
—
—
24,000
N/A
624
608
N/A
6.1 ns
N/A
624
928
2
140
No
No
84
100, 160, 208
100
176
—
—
36,000
N/A
954
912
24
6.1 ns
N/A
954
1,410
2
176
Yes
Yes
84
160, 208
—
176
—
—
54,000
2,560
1,230
1,184
24
6.3 ns
10
1,230
1,822
6
202
Yes
Yes
—
208, 240
—
—
208, 256
272
Sequential
Combinatorial
Decode
Clock-to-Out
SRAM Modules
(64x4 or 32x8)
Dedicated Flip-Flops
Maximum Flip-Flops
Clocks
User I/O
(Maximum)
PCI
Boundary Scan Test (BST)
Packages
(by pin count)
PLCC
PQFP
VQFP
TQFP
CQFP
PBGA
O c t o be r 2 0 0 3
1
© 2003 Actel Corporation
40MX and 42MX FPGA Families
G en er al D e sc r i p t i on
Actel’s 40MX and 42MX families provide a
high-performance, single-chip solution for shortening the
system design and development cycle, offering a
cost-effective alternative to ASICs. The 40MX and 42MX
devices are excellent choices for integrating logic that is
currently implemented in multiple PALs, CPLDs, and
FPGAs. Example applications include high-speed
controllers and address decoding, peripheral bus interfaces,
DSP, and co-processor functions.
The MX device architecture is based on Actel’s patented
antifuse technology implemented in a 0.45µ triple-metal
CMOS process. With capacities ranging from 3,000 to 54,000
system gates, the synthesis-friendly MX devices provide
performance up to 250 MHz, are live on power-up, and
require up to five times lower stand-by power consumption
than any other FPGA device. Actel’s MX FPGAs provide up
to 202 user I/Os and are available in a wide variety of
packages and speed grades.
Actel’s 42MX devices also feature MultiPlex I/Os, which
support mixed voltage systems, enable programmable PCI,
deliver high-performance operation at both 5.0V and 3.3V,
and provide a low-power mode.
The MX PCI-Compliant devices are fully compliant with the
PCI Local Bus Specification (version 2.1). They deliver 200
O r d e r i n g I nf o r m a t i o n
A42MX16
–
PQ
100
MHz on-chip operation and 6.1 ns clock-to-output
performance with capacities spanning from 36,000 to 54,000
system gates. MX devices comply 100 percent to the
electrical and timing specifications detailed in the PCI
specification. However, as with all programmable logic
devices, the performance of the final product depends upon
the user's design and optimization techniques.
The MX24 and MX36 devices also include system-level
features such as IEEE Standard 1149.1 (JTAG) Boudary
Scan Testing, dual-port SRAM, and fast wide-decode
modules. The A42MX36 device offers dual-port SRAM for
implementing fast FIFOs, LIFOs, and temporary data
storage. The large number of storage elements can
efficiently address applications requiring wide datapath
manipulation and can perform transformation functions
such as those required for telecommunications, networking,
and DSP.
All products in the 40MX and 42MX families are available
100 percent tested over the military temperature range. In
addition, the largest member of the family, the A42MX36, is
available in both CQ208 and CQ256 ceramic packages
screened to MIL-STD-883 levels. For easy prototyping and
conversion from plastic to ceramic, the CQ208 and PQ208
devices are pin compatible.
Application (Temperature Range)
Blank = Commercial (0 to +70°C)
I = Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
B = MIL-STD-883
Package Lead Count
Package Type
PL = Plastic Leaded Chip Carrier
PQ = Plastic Quad Flat Pack
TQ = Thin (1.4 mm) Quad Flat Pack
VQ = Very Thin (1.0 mm) Quad Flat Pack
BG = Ball Grid Array
CQ = Ceramic Quad Flat Pack
Speed Grade
Blank = Standard Speed
–1 = Approximately 15% Faster than Standard
–2 = Approximately 25% Faster than Standard
–3 = Approximately 35% Faster than Standard
–F = Approximately 40% Slower than Standard
Part Number
A40MX02=
A40MX04=
A42MX09=
A42MX16=
A42MX24=
A42MX36=
3,000 System Gates
6,000 System Gates
14,000 System Gates
24,000 System Gates
36,000 System Gates
54,000 System Gates
2
v5.1
4 0 M X a n d 4 2 M X F PG A F a m il ie s
Pr od uc t P l a n
Speed Grade
1
Std
A40MX02 Device
44-Pin Plastic Leaded Chip Carrier (PLCC)
68-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Plastic Quad Flat Pack (PQFP)
80-Pin Very Thin Plastic Quad Flat Pack (VQFP)
A40MX04 Device
44-Pin Plastic Leaded Chip Carrier (PLCC)
68-Pin Plastic Leaded Chip Carrier (PLCC)
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Plastic Quad Flat Pack (PQFP)
80-Pin Very Thin Plastic Quad Flat Pack (VQFP)
A42MX09 Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Plastic Quad Flat Pack (PQFP)
160-Pin Plastic Quad Flat Pack (PQFP)
176-Pin Thin Plastic Quad Flat Pack (TQFP)
100-Pin Very Thin Plastic Quad Flat Pack (VQFP)
A42MX16 Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Plastic Quad Flat Pack (PQFP)
160-Pin Plastic Quad Flat Pack (PQFP)
208-Pin Plastic Quad Flat Pack (PQFP)
176-Pin Thin Plastic Quad Flat Pack (TQFP)
100-Pin Very Thin Plastic Quad Flat Pack (VQFP)
A42MX24 Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
160-Pin Plastic Quad Flat Pack (PQFP)
208-Pin Plastic Quad Flat Pack (PQFP)
176-Pin Thin Plastic Quad Flat Pack (TQFP)
A42MX36 Device
208-Pin Plastic Quad Flat Pack (PQFP)
240-Pin Plastic Quad Flat Pack (PQFP)
272-Pin Plastic Ball Grid Array (PBGA)
208-Pin Ceramic Quad Flat Pack (CQFP)
256-Pin Ceramic Quad Flat Pack (CQFP)
✔
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—
—
✔
✔
✔
—
—
–1
–2
–3
–F
=
=
=
=
Application
–F
2
C
I
M
B
–1
–2
–3
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3
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3
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3
✔
3
Contact your Actel sales representative for product availability.
Applications: C = Commercial
Availability:
✔
= Available
*Speed Grade:
I = Industrial
P = Planned
M = Military
— = Not Planned
Approx. 15% faster than Standard
Approx. 25% faster than Standard
Approx. 35% faster than Standard
Approx. 40% slower than Standard
†
Only Std, –1, –2 Speed Grade
•
Only Std, –1 Speed Grade
v5.1
3
40MX and 42MX FPGA Families
D ev el o pm e n t T oo l S up po r t
The MX devices are fully supported by Actel’s line of FPGA
development tools, including the Actel DeskTOP series and
Designer Series tools. The Actel DeskTOP series is an
integrated design environment for PCs that includes design
entry, simulation, synthesis, and place-and-route tools.
Designer Series, Actel’s suite of FPGA development point
tools for PCs and Workstations, includes the ACTgen Macro
Builder, timing-driven place-and-route and analysis tools,
and device programming software.
In addition, the MX devices contain ActionProbe circuitry
that provides built-in access to every node in a design,
Pl a s t i c D e vi c e Re so u r ce s
enabling 100 percent real-time observation and analysis of a
device's internal logic nodes without design iteration. The
probe circuitry is accessed by Silicon Explorer II, an
easy-to-use integrated verification and logic analysis tool
that can sample data at 100 MHz (asynchronous) or 66 MHz
(synchronous). Silicon Explorer II attaches to a PC’s
standard COM port, turning the PC into a fully functional
18-channel logic analyzer. Silicon Explorer II allows
designers to complete the design verification process at
their desks and reduces verification time from several hours
per cycle to only a few seconds.
User I/Os
Device
A40MX02
A40MX04
A42MX09
A42MX16
A42MX24
A42MX36
PLCC
44-Pin
34
34
—
—
—
—
PLCC
68-Pin
57
57
—
—
—
—
PLCC
84-Pin
—
69
72
72
72
—
PQFP
PQFP
PQFP
PQFP
100-Pin 160-Pin 208-Pin 240-Pin
57
69
83
83
—
—
—
—
101
125
125
—
—
—
—
140
176
176
—
—
—
—
—
202
VQFP
80-Pin
57
69
—
—
—
—
VQFP
TQFP
PBGA
100-Pin 176-Pin 272-Pin
—
—
83
83
—
—
—
—
104
140
150
—
—
—
—
—
—
202
Package Definitions
(Contact your Actel sales representative for product availability.)
PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad Flat Pack,
PBGA = Plastic Ball Grid Array
C er a m i c De v i ce R es ou r c es
User I/Os
Device
A42MX36
CQFP
CQFP
208-Pin 256-Pin
176
202
Package Definitions
(Contact your Actel sales representative for product availability.)
CQFP = Ceramic Quad Flat Pack
4
v5.1
4 0 M X a n d 4 2 M X F PG A F a m il ie s
Po w e r R eq ui r em e nt s
40MX
M X Ar ch i t e ct u r a l O ve r vi ew
The 40MX FPGAs will operate in 5.0V-only systems or
3.3V-only systems.
V
CC
5.0V
3.3V
42MX
Input
5.0V
3.3V
Output
5.0V
3.3V
The 42MX FPGAs will operate in 5.0V-only systems,
3.3V-only systems, or mixed 5.0V/3.3V systems.
V
CCA
5.0V
3.3V
5.0V
V
CCI
5.0V
3.3V
3.3V
Input
5.0V
3.3V
3.3V, 5.0V
Output
5.0V
3.3V
3.3V
The 40MX and 42MX devices are composed of fine-grained
building blocks that enable fast, efficient logic designs. All
devices within these families are composed of logic
modules, I/O modules, routing resources, and clock
networks, which are the building blocks for designing fast
logic designs. In addition, the A42MX36 device contains
embedded dual-port SRAM and wide decode modules. The
dual-port SRAM modules are optimized for high-speed
datapath functions such as FIFOs, LIFOs, and scratchpad
memory. The
“Product Profile” on page 1
lists the specific
logic resources contained within each device.
Logi c Modu les
The 40MX logic module is an eight-input, one-output logic
circuit designed to implement a wide range of logic
functions with efficient use of interconnect routing
resources (Figure
1).
The logic module can implement the four basic logic
functions (NAND, AND, OR, and NOR) in gates of two, three,
or four inputs. Each function may have many versions with
different combinations of active LOW inputs. The logic
module can also implement a variety of D-latches,
exclusivity functions, AND-ORs, and OR-ANDs. No dedicated
hard-wired latches or flip-flops are required in the array,
since latches and flip-flops can be constructed from logic
modules wherever needed in the application.
M i xe d Vo l t a ge P ow e r U p an d P o w er
D ow n
When powering up the device in the mixed voltage mode
(V
CCA
= 5.0V and V
CCI
= 3.3V), V
CCA
must be greater than or
equal to V
CCI
throughout the power-up sequence. If V
CCI
is
0.5V greater than V
CCA
when both are above 1.5V, then the
I/Os’ input protection junction on the I/Os will be forward
biased, causing them to draw large amounts of current.
When V
CCA
and V
CCI
are in the 1.5V to 2.0V region and V
CCI
is greater than V
CCA
, all I/Os would momentarily behave as
outputs that are in a logical high state, and I
CC
rises to high
levels. For power down, any sequence with V
CCA
and V
CCI
can be implemented.
Lo w P ow e r M o de
The 42MX devices have a power-saving feature enabled by a
special Low Power pin (LP). In this mode, the device
consumes very minimal power, with standby current as low
as 500µA (see
“Electrical Specifications” on page 13
and
14).
All µ I/Os are tristated, all input buffers are turned off,
and the core of the device is turned off. Since the core is
turned off, the state of the registers and the contents of the
SRAM are lost. The device enters low power mode 800ns
after the LP pin is set High. It will resume normal operation
200µs after the LP pin is driven to a logic Low.
Figure 1 •
40MX Logic Module
v5.1
5
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