K4D263238M-QC600 datasheet, PDF

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K4D263238M-QC600: DescriptionDDR DRAM, 4MX32, 0.75ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100; Categorystorage storage; File Size281KB，19 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K4D263238M-QC600 Overview

DDR DRAM, 4MX32, 0.75ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100

K4D263238M-QC600 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	QFP
package instruction	TQFP,
Contacts	100
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.75 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-PQFP-G100
length	20 mm
memory density	134217728 bit
Memory IC Type	DDR DRAM
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	100
word count	4194304 words
character code	4000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	65 °C
Minimum operating temperature
organize	4MX32
Package body material	PLASTIC/EPOXY
encapsulated code	TQFP
Package shape	RECTANGULAR
Package form	FLATPACK, THIN PROFILE
Peak Reflow Temperature (Celsius)	240
Certification status	Not Qualified
Maximum seat height	1.2 mm
self refresh	YES
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	14 mm

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K4D263238M

128M DDR SDRAM

128Mbit DDR SDRAM

1M x 32Bit x 4 Banks

Double Data Rate Synchronous RAM

with Bi-directional Data Strobe and DLL

Revision 1.3

August 2001

Samsung Electronics reserves the right to change products or specification without notice.

- 1 -

Rev. 1.3 (Aug. 2001)

K4D263238M-QC600 Related Products

	K4D263238M-QC600	K4D263238M-QC500	K4D263238M-QC550	K4D263238M-QC450
Description	DDR DRAM, 4MX32, 0.75ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100	DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100	DDR DRAM, 4MX32, 0.75ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100	DDR DRAM, 4MX32, 0.7ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, TQFP-100
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	QFP	QFP	QFP	QFP
package instruction	TQFP,	TQFP,	TQFP,	TQFP,
Contacts	100	100	100	100
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	0.75 ns	0.7 ns	0.75 ns	0.7 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
length	20 mm	20 mm	20 mm	20 mm
memory density	134217728 bit	134217728 bit	134217728 bit	134217728 bit
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	32	32	32	32
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	100	100	100	100
word count	4194304 words	4194304 words	4194304 words	4194304 words
character code	4000000	4000000	4000000	4000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	65 °C	65 °C	65 °C	65 °C
organize	4MX32	4MX32	4MX32	4MX32
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TQFP	TQFP	TQFP	TQFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, THIN PROFILE	FLATPACK, THIN PROFILE	FLATPACK, THIN PROFILE	FLATPACK, THIN PROFILE
Peak Reflow Temperature (Celsius)	240	240	240	240
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm
self refresh	YES	YES	YES	YES
Maximum supply voltage (Vsup)	2.625 V	2.625 V	2.625 V	2.625 V
Minimum supply voltage (Vsup)	2.375 V	2.375 V	2.375 V	2.375 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	30	30	30
width	14 mm	14 mm	14 mm	14 mm

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