2SK2591 datasheet, PDF - EEWORLD Datasheet

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2SK2591: DescriptionPower Field-Effect Transistor, 8A I(D), 500V, 0.6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220CFM, 3 PIN; CategoryDiscrete semiconductor The transistor; File Size6MB，1147 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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2SK2591 Overview

Power Field-Effect Transistor, 8A I(D), 500V, 0.6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220CFM, 3 PIN

2SK2591 Parametric

Parameter Name	Attribute value
Parts packaging code	TO-220CF
package instruction	FLANGE MOUNT, R-PSFM-T3
Contacts	3
Reach Compliance Code	unknow
Shell connection	ISOLATED
Configuration	SINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage	500 V
Maximum drain current (Abs) (ID)	8 A
Maximum drain current (ID)	8 A
Maximum drain-source on-resistance	0.6 Ω
FET technology	METAL-OXIDE SEMICONDUCTOR
JESD-30 code	R-PSFM-T3
Number of components	1
Number of terminals	3
Operating mode	ENHANCEMENT MODE
Maximum operating temperature	150 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	FLANGE MOUNT
Polarity/channel type	N-CHANNEL
Maximum power dissipation(Abs)	35 W
Maximum pulsed drain current (IDM)	32 A
Certification status	Not Qualified
surface mount	NO
Terminal form	THROUGH-HOLE
Terminal location	SINGLE
transistor applications	SWITCHING
Transistor component materials	SILICON
Base Number Matches	1

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CONTENTS

Index...................................................................................................................................................

General Information..........................................................................................................................

Section 1 Lineup by Application........................................................................................................

1.1

1.2

1.3

1.4

1.5

1.6

Power Supply Use ..................................................................................................................

Motor Drive Use......................................................................................................................

Servo Motor/Inverter Application ............................................................................................

Automotive Use ......................................................................................................................

Lamp Inverter Application.......................................................................................................

CRT Display Use ....................................................................................................................

Section 2 Series Lineup ....................................................................................................................

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

D Series Lineup......................................................................................................................

S Series Lineup ......................................................................................................................

Power MOS FET DII Series....................................................................................................

Power MOS FET DIII Series...................................................................................................

Power MOS FET DIV Series ..................................................................................................

Power MOS FET DV Series....................................................................................................

Power MOS FET Array Series................................................................................................

Power MOS FET Modules ......................................................................................................

Line-up of Each Package Outline for Same Die .....................................................................

Section 6 Standard Lead Forming Specification............................................................................... 144

Section 7 Package Information ......................................................................................................... 149

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