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DG308ACK

Description
IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC
CategoryAnalog mixed-signal IC    The signal circuit   
File Size158KB,5 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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DG308ACK Overview

IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC

DG308ACK Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
package instructionDIP, DIP16,.3
Reach Compliance Codenot_compliant
Analog Integrated Circuits - Other TypesSPST
JESD-30 codeR-XDIP-T16
JESD-609 codee0
Nominal Negative Supply Voltage (Vsup)-15 V
normal positionNO
Number of functions4
Number of terminals16
Maximum on-state resistance (Ron)125 Ω
Maximum operating temperature70 °C
Minimum operating temperature
outputSEPARATE OUTPUT
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply+-15 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)15 V
surface mountNO
Maximum connection time200 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

DG308ACK Related Products

DG308ACK DG309BK DG308AAK DG308ABK DG309CK
Description IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant
Analog Integrated Circuits - Other Types SPST SPST SPST SPST SPST
JESD-30 code R-XDIP-T16 R-XDIP-T16 R-XDIP-T16 R-XDIP-T16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0 e0
Nominal Negative Supply Voltage (Vsup) -15 V -15 V -15 V -15 V -15 V
normal position NO NC NO NO NC
Number of functions 4 4 4 4 4
Number of terminals 16 16 16 16 16
Maximum on-state resistance (Ron) 125 Ω 125 Ω 150 Ω 125 Ω 125 Ω
Maximum operating temperature 70 °C 85 °C 125 °C 85 °C 70 °C
Minimum operating temperature - -25 °C -55 °C -25 °C -
output SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
power supply +-15 V +-15 V +-15 V +-15 V +-15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 15 V 15 V 15 V 15 V 15 V
surface mount NO NO NO NO NO
Maximum connection time 200 ns 200 ns 200 ns 200 ns 200 ns
switch BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL OTHER MILITARY OTHER COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maker Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
package instruction DIP, DIP16,.3 - DIP, DIP16,.3 DIP, DIP16,.3 -
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