IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | not_compliant |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| normal position | NO |
| Number of functions | 4 |
| Number of terminals | 16 |
| Maximum on-state resistance (Ron) | 125 Ω |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| output | SEPARATE OUTPUT |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum connection time | 200 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| DG308ACK | DG309BK | DG308AAK | DG308ABK | DG309CK | |
|---|---|---|---|---|---|
| Description | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V |
| normal position | NO | NC | NO | NO | NC |
| Number of functions | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 |
| Maximum on-state resistance (Ron) | 125 Ω | 125 Ω | 150 Ω | 125 Ω | 125 Ω |
| Maximum operating temperature | 70 °C | 85 °C | 125 °C | 85 °C | 70 °C |
| Minimum operating temperature | - | -25 °C | -55 °C | -25 °C | - |
| output | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | NO | NO | NO | NO |
| Maximum connection time | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | OTHER | MILITARY | OTHER | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Renesas Electronics Corporation | - | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| package instruction | DIP, DIP16,.3 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | - |