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NS32016D10-MSP

Description
IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size4MB,64 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

NS32016D10-MSP Overview

IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC

NS32016D10-MSP Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
Reach Compliance Codecompliant
bit size32
JESD-30 codeR-XDIP-T48
JESD-609 codee0
Number of terminals48
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP48,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B (Modified)
speed10 MHz
surface mountNO
technologyMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC

NS32016D10-MSP Related Products

NS32016D10-MSP NS32016D-10 NS32016N-10
Description IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible
Maker National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
Reach Compliance Code compliant compliant compliant
bit size 32 32 32
JESD-30 code R-XDIP-T48 R-XDIP-T48 R-PDIP-T48
JESD-609 code e0 e0 e0
Number of terminals 48 48 48
Maximum operating temperature 85 °C 70 °C 70 °C
Package body material CERAMIC CERAMIC PLASTIC/EPOXY
encapsulated code DIP DIP DIP
Encapsulate equivalent code DIP48,.6 DIP48,.6 DIP48,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified
speed 10 MHz 10 MHz 10 MHz
surface mount NO NO NO
technology MOS MOS MOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
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