EEWORLDEEWORLDEEWORLD

Part Number

Search

EPC1VPI8

Description
Configuration Memory, 130812X8, Serial, MOS, PDIP8, PLASTIC, DIP-8
Categorystorage    storage   
File Size321KB,11 Pages
ManufacturerAltera (Intel)
Download Datasheet Parametric Compare View All

EPC1VPI8 Overview

Configuration Memory, 130812X8, Serial, MOS, PDIP8, PLASTIC, DIP-8

EPC1VPI8 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAltera (Intel)
Parts packaging codeDIP
package instructionDIP, DIP8,.3
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
I/O typeCOMMON
JESD-30 codeR-PDIP-T8
JESD-609 codee0
length9.398 mm
memory density1046496 bit
Memory IC TypeCONFIGURATION MEMORY
memory width8
Number of functions1
Number of terminals8
word count130812 words
character code130812
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize130812X8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height4.318 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

EPC1VPI8 Related Products

EPC1VPI8 EPC1VLC20 EPC1VLI20
Description Configuration Memory, 130812X8, Serial, MOS, PDIP8, PLASTIC, DIP-8 Configuration Memory, 130812X8, Serial, MOS, PQCC20, PLASTIC, LCC-20 Configuration Memory, 130812X8, Serial, MOS, PQCC20, PLASTIC, LCC-20
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Maker Altera (Intel) Altera (Intel) Altera (Intel)
Parts packaging code DIP QLCC QLCC
package instruction DIP, DIP8,.3 QCCJ, LDCC20,.4SQ QCCJ, LDCC20,.4SQ
Contacts 8 20 20
Reach Compliance Code compliant compliant compliant
ECCN code EAR99 EAR99 EAR99
I/O type COMMON COMMON COMMON
JESD-30 code R-PDIP-T8 S-PQCC-J20 S-PQCC-J20
JESD-609 code e0 e0 e0
length 9.398 mm 8.9662 mm 8.9662 mm
memory density 1046496 bit 1046496 bit 1046496 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY
memory width 8 8 8
Number of functions 1 1 1
Number of terminals 8 20 20
word count 130812 words 130812 words 130812 words
character code 130812 130812 130812
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C
Minimum operating temperature -40 °C - -40 °C
organize 130812X8 130812X8 130812X8
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP QCCJ QCCJ
Encapsulate equivalent code DIP8,.3 LDCC20,.4SQ LDCC20,.4SQ
Package shape RECTANGULAR SQUARE SQUARE
Package form IN-LINE CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED 220 220
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 4.318 mm 4.57 mm 4.57 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount NO YES YES
technology MOS MOS MOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE J BEND J BEND
Terminal pitch 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED 30 30
width 7.62 mm 8.9662 mm 8.9662 mm
Inspirational and creative short film: I am also an engineering student
[flash]http://player.youku.com/player.php/sid/XMTkzMDE5ODk2/v.swf[/flash]...
熊猫 Talking
I have an error compiling ACE5.5 for vxworks5.5 with cygwin under WINXP. Can anyone help me?
My environment is winxp (sp2), tornador2.2.1 cygwin perl ace5.5. When I compile, the following error occurs: Thread_Manager.cpp: In method 'int ACE_Thread_Manager::kill_grp(int, int)': Thread_Manager....
xmjianfu Real-time operating system RTOS
I will also show our LPC11XX board
The picture was originally taken very clearly, but it is not clear here....
weboch NXP MCU
How to measure AC impedance?
Delahay systematically discussed the problem of using the alternating current method to study the kinetic model of the photoelectrocatalytic process from a theoretical perspective. The EIS (Electroche...
Jacktang Analogue and Mixed Signal
I always want to take revenge on society.
Recently, I have been having a series of bad luck. Today, when the busy farming season started, I couldn't open the garage shutter door. I've never found that it couldn't be closed or opened smoothly ...
wangfuchong Talking
Studying Things to Gain Knowledge—by maychang
[url=home.php?mod=spaceuid=41670]@maychang[/url] Studying Things to Gain Knowledge 01——Beat Frequency Studying Things to Gain Knowledge 02——The Beat Frequency of Two Light Columns Studying Things to G...
okhxyyo Integrated technical exchanges

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2583  1133  1256  266  2898  53  23  26  6  59 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号