BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
235 SERIES
Standard
P/N
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Footprint
Dimensions
in. (mm)
.500 (12.7)
.500 (12.7)
1.000 (25.4)
.500 (12.7)
Mounting
Configuration
Vert./Horiz.
Vertical
Horizontal
Vertical
Solderable
Tab Options
No Tab
01
05
10
235 SERIES
TO-220
Height Above
PC Board
in. (mm)
Mounting
Style
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
40°C @ 2W
40°C @ 2W
40°C @ 2W
40°C @ 2W
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
PATENT 5381041
235-85AB
.850 (21.6) 1.000 (25.4) x
235-85ABE-01 .850 (21.6) 1.000 (25.4) x
235-85ABE-05 .500 (12.7)
.850 (21.6) x
235-85ABE-10 .975 (24.8) 1.000 (25.4) x
Material: Aluminum, Black Anodized
235-85AB
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
235-85AB-05
235-85AB-01
235-85AB-10
Dimensions: in. (mm)
2
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