EDO DRAM Module, 2MX32, 70ns, CMOS, SIMM-72
| Parameter Name | Attribute value |
| Maker | IBM |
| Parts packaging code | SIMM |
| package instruction | , |
| Contacts | 72 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | FAST PAGE WITH EDO |
| Maximum access time | 70 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| Spare memory width | 16 |
| JESD-30 code | R-XSMA-N72 |
| memory density | 67108864 bit |
| Memory IC Type | EDO DRAM MODULE |
| memory width | 32 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 72 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2MX32 |
| Output characteristics | 3-STATE |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified |
| refresh cycle | 1024 |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal location | SINGLE |
| IBM11D2325LC-70T | PTN1010L2940FGWI | IBM11D1325LC-70T | IBM11D1325LC-6RT | |
|---|---|---|---|---|
| Description | EDO DRAM Module, 2MX32, 70ns, CMOS, SIMM-72 | Fixed Resistor, Thin Film, 0.5W, 294ohm, 150V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP | EDO DRAM Module, 1MX32, 70ns, CMOS, SIMM-72 | EDO DRAM Module, 1MX32, 60ns, CMOS, SIMM-72 |
| Reach Compliance Code | unknown | compliant | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | ANTI-SULFUR; LASER TRIMMABLE; NON-INDUCTIVE | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| Number of terminals | 72 | 2 | 72 | 72 |
| Maximum operating temperature | 70 °C | 155 °C | 70 °C | 70 °C |
| Package form | MICROELECTRONIC ASSEMBLY | SMT | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| surface mount | NO | YES | NO | NO |
| technology | CMOS | THIN FILM | CMOS | CMOS |
| Maker | IBM | - | IBM | IBM |
| Parts packaging code | SIMM | - | SIMM | SIMM |
| Contacts | 72 | - | 72 | 72 |
| access mode | FAST PAGE WITH EDO | - | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| Maximum access time | 70 ns | - | 70 ns | 60 ns |
| Spare memory width | 16 | - | 16 | 16 |
| JESD-30 code | R-XSMA-N72 | - | R-XSMA-N72 | R-XSMA-N72 |
| memory density | 67108864 bit | - | 33554432 bit | 33554432 bit |
| Memory IC Type | EDO DRAM MODULE | - | EDO DRAM MODULE | EDO DRAM MODULE |
| memory width | 32 | - | 32 | 32 |
| Number of functions | 1 | - | 1 | 1 |
| Number of ports | 1 | - | 1 | 1 |
| word count | 2097152 words | - | 1048576 words | 1048576 words |
| character code | 2000000 | - | 1000000 | 1000000 |
| Operating mode | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| organize | 2MX32 | - | 1MX32 | 1MX32 |
| Output characteristics | 3-STATE | - | 3-STATE | 3-STATE |
| Package body material | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified |
| refresh cycle | 1024 | - | 1024 | 1024 |
| Maximum supply voltage (Vsup) | 5.5 V | - | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | - | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V |
| Temperature level | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | - | NO LEAD | NO LEAD |
| Terminal location | SINGLE | - | SINGLE | SINGLE |
京公网安备 11010802033920号
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