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DH8900CCSLJW2

Description
USB Bus Controller, CMOS, PBGA942, 27 X 27 MM, 0.70 MM PITCH, FCBGA-942
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size10MB,1710 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Environmental Compliance
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DH8900CCSLJW2 Overview

USB Bus Controller, CMOS, PBGA942, 27 X 27 MM, 0.70 MM PITCH, FCBGA-942

DH8900CCSLJW2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerIntel
package instructionFBGA, BGA942(UNSPEC)
Reach Compliance Codecompliant
Bus compatibilityPC-AT; USB; PCI; I2C; LPC; PS/2
maximum clock frequency100 MHz
Maximum data transfer rate300 MBps
Drive interface standardsIEEE 802.3; IEEE 1149.1
JESD-30 codeS-PBGA-B942
length27 mm
Number of terminals942
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA942(UNSPEC)
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
power supply1,1.8,3.3 V
Certification statusNot Qualified
Maximum seat height2.408 mm
Maximum slew rate2000 mA
Maximum supply voltage1.05 V
Minimum supply voltage0.95 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch0.7 mm
Terminal locationBOTTOM
width27 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, UNIVERSAL SERIAL BUS
Intel
®
Communications Chipset 89xx
Series
Datasheet
April 2014
Order Number: 327879-005US

DH8900CCSLJW2 Related Products

DH8900CCSLJW2 DH8900CC
Description USB Bus Controller, CMOS, PBGA942, 27 X 27 MM, 0.70 MM PITCH, FCBGA-942 USB Bus Controller, CMOS, PBGA942, 27 X 27 MM, 0.70 MM PITCH, FCBGA-942
Maker Intel Intel
package instruction FBGA, BGA942(UNSPEC) FBGA,
Reach Compliance Code compliant compli
Bus compatibility PC-AT; USB; PCI; I2C; LPC; PS/2 PC-AT; USB; PCI; I2C; LPC; PS/2
maximum clock frequency 100 MHz 100 MHz
Maximum data transfer rate 300 MBps 300 MBps
Drive interface standards IEEE 802.3; IEEE 1149.1 IEEE 802.3; IEEE 1149.1
JESD-30 code S-PBGA-B942 S-PBGA-B942
length 27 mm 27 mm
Number of terminals 942 942
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA
Package shape SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Maximum seat height 2.408 mm 2.408 mm
Maximum supply voltage 1.05 V 1.05 V
Minimum supply voltage 0.95 V 0.95 V
Nominal supply voltage 1 V 1 V
surface mount YES YES
technology CMOS CMOS
Terminal form BALL BALL
Terminal pitch 0.7 mm 0.7 mm
Terminal location BOTTOM BOTTOM
width 27 mm 27 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, UNIVERSAL SERIAL BUS BUS CONTROLLER, UNIVERSAL SERIAL BUS

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