K7R160882B-FC200 datasheet, PDF

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K7R160882B-FC200: DescriptionQDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165; Categorystorage storage; File Size211KB，20 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K7R160882B-FC200 Overview

QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165

K7R160882B-FC200 Parametric

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	LBGA,
Contacts	165
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
length	15 mm
memory density	16777216 bit
Memory IC Type	QDR SRAM
memory width	8
Number of functions	1
Number of terminals	165
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX8
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	13 mm

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Document Title

Preliminary

512Kx36 & 1Mx18 & 2Mx9 & 2Mx8 QDR

II b2 SRAM

512Kx36-bit, 1Mx18-bit, 2Mx9-bit, 2Mx8-bit QDR

II b2 SRAM

Revision History

Rev. No.

0.0

0.1

History

1. Initial document.

1. Change the Boundary scan exit order.

2. Correct the Overshoot and Undershoot timing diagram.

1. Change the JTAG Block diagram

1. Change the DC characteristics table.

1. Correct the JTAG ID register definition

2. Correct the AC timing parameter (delete the tKHKH Max value)

1. Change the Maximum Clock cycle time.

2. Correct the 165FBGA package ball size.

1. Add the power up/down sequencing comment.

2. Update the DC current parameter (Icc and Isb).

1. Update the Stand-by current(Isb)

Draft Date

Oct. 17, 2002

Dec. 16, 2002

Remark

Advance

Preliminary

0.2

0.3

0.4

Dec. 26, 2002

Jan. 27, 2003

Mar. 20, 2003

Preliminary

0.5

April. 4, 2003

Preliminary

0.6

June. 20, 2003

Preliminary

0.7

June. 23, 2003

Preiliminary

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the

specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-

tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.

-1-

June. 2003

Rev 0.6

K7R160882B-FC200 Related Products

	K7R160882B-FC200	K7R160882B-FC250	K7R160882B-FC160
Description	QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165	QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165	QDR SRAM, 2MX8, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
Maker	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	BGA	BGA	BGA
package instruction	LBGA,	LBGA,	LBGA,
Contacts	165	165	165
Reach Compliance Code	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	0.45 ns	0.45 ns	0.5 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165
length	15 mm	15 mm	15 mm
memory density	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	QDR SRAM	QDR SRAM	QDR SRAM
memory width	8	8	8
Number of functions	1	1	1
Number of terminals	165	165	165
word count	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	2MX8	2MX8	2MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	LBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.4 mm	1.4 mm	1.4 mm
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
width	13 mm	13 mm	13 mm

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