Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| Parts packaging code | TSOP2 |
| package instruction | TSOP2, TSOP32,.46 |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 100 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G32 |
| JESD-609 code | e0 |
| length | 20.95 mm |
| memory density | 4194304 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 32 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 512KX8 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP2 |
| Encapsulate equivalent code | TSOP32,.46 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum standby current | 0.00002 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.08 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
| KM684000BLTI-10L | KM684000BLGI-10L | KM684000BLGI-10 | KM684000BLRI-10L | |
|---|---|---|---|---|
| Description | Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32 | Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32 | Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32 | Standard SRAM, 512KX8, 100ns, CMOS, PDSO32, 0.400 INCH, REVERSE, TSOP2-32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
| Parts packaging code | TSOP2 | SOIC | SOIC | TSOP2 |
| package instruction | TSOP2, TSOP32,.46 | SOP, SOP32,.56 | SOP, SOP32,.56 | TSOP2-R, TSOP32,.46 |
| Contacts | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| Maximum access time | 100 ns | 100 ns | 100 ns | 100 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 20.95 mm | 20.47 mm | 20.47 mm | 20.95 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 |
| word count | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP2 | SOP | SOP | TSOP2-R |
| Encapsulate equivalent code | TSOP32,.46 | SOP32,.56 | SOP32,.56 | TSOP32,.46 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 3 mm | 3 mm | 1.2 mm |
| Maximum standby current | 0.00002 A | 0.00002 A | 0.00005 A | 0.00002 A |
| Minimum standby current | 2 V | 2 V | 2 V | 2 V |
| Maximum slew rate | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 10.16 mm | 11.43 mm | 11.43 mm | 10.16 mm |
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