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STRUCTURE
PRODUCT SERIES
TYPE
FEATURES
Silicon Monolithic Integrated Circuit
Three-Phase Full-Wave Driver for Fan Motor
BD6331FM
PWM operating
Output DMOS driving system
DC and PWM speed control
Lock detection, Automatic restart circuit
○
ABSOLUTE MAXIMUM RATINGS（Ta=25℃）
Parameter
Supply voltage
Output current
Power dissipation
Junction temperature
Operating temperature
Storage temperature
SOUT voltage
SOUT current
VREG output current
Symbol
VCC，VM
IoMAX
Pd
TJMAX
Topr
Tstg
VSOUT
ISOUT
IVREG
Limit
20
*2500
**2200
150
-20½+75
-55½+150
20
10
10
Unit
V
mA
mW
℃
℃
℃
V
mA
mA
*This value is not to exceed Pd, ASO and Tj=150℃.
**On 70mmX70mmX1.6mmglass epoxy board.
**Reduce by 17.6mW／℃ over Ta=25℃.
○
OPERATING CONDITIONS（Ta=25℃）
Parameter
Operating supply voltage range
Hall input voltage range
VTH input voltage range
VMIN input voltage range
Symbol
VCC,VM
VHAR
VTH
VMIN
Limit
8.0½18.0
1.4½VREG
0½VREG
0½VREG
Unit
V
V
V
V
＊This product is not designed for production against radioactive rays.
＊This document may be strategic data subject to COCOM regulations.
REV. A
2/4
〇
ELECTRICAL CHARACTERISTICS（Unless otherwise specified Ta=25℃,VCC=VM=12V）
Parameter
Circuit current１
Circuit current２
【HALL Amp.】
Input bias current
Input level
【VREG】
VREG voltage
【FR】
[L] level voltage range
[H] level voltage range
Input current
Output current
【FGSEL】
[L] level voltage range
[H] level voltage range
Input current
Output current
【VTH】
Input bias current
Open detect voltage
【PS】
[L] level voltage range
[H] level voltage range
Input current
Output current
【Level Amp.】
Input bias current
Output voltage L
Output voltage H
Output Tr. ON voltage range
Output Tr. OFF voltage range
PWM DUTY1
PWM DUTY2
PWM FREQUENCY
【VMIN】
Input bias current
【PWMIN】
[L] level voltage range
[H] level voltage range
Input current
Output current
Input frequency
【Current limit】
Input bias current
Current limit gain
【Output】
ON resistance
【SOUT】
Leak current
Output voltage L
【Lock detection】
ON time
OFF time
Symbol
ICC1
ICC2
IB
VINH
VREG
VFRL
VFRH
IFRI
IFRO
VSELL
VSELH
ISELI
ISELO
IVTH
VDET
PSL
PSH
IPSI
IPSO
ILA
VLAOL
VLAOH
VLAL
VLAH
DPWM1
DPWM2
FPWM
IMIN
VPWML
VPWMH
IPWMI
IPWMO
FPWMIN
ICL
VCL
RON
IFG
VFGL
TON
TOFF
Min.
0
4
-10
50
2.7
0
2.1
22
0
0
2.1
22
0
-1
90
0
2.3
18
0
-1
0
2.79
0
57.4
64
42
30
-1
0
2.1
-1
22
25
-1
0.98
0.7
0
0
0.65
5.25
Limit
Typ.
－
6
－
－
2.8
－
－
28
－
－
－
28
－
－
93
－
－
24
－
－
－
2.8
－
－
79
57
50
－
－
－
－
28
50
－
1.0
1
－
－
1.3
10.5
Max.
10
10
10
100
2.9
0.7
2.8
35
10
0.7
2.8
35
10
1
96
1.3
12
30
10
1
0.3
2.81
51.6
89
94
72
80
1
0.7
2.8
1
35
75
1
1.02
1.3
10
0.3
2.6
21
Unit
μA
mA
μA
mVpp
V
V
V
μA
μA
V
V
μA
μA
μA
％
V
V
μA
μA
μA
V
V
%
%
%
%
KHz
μA
V
V
μA
μA
KHz
μA
V
Ω
μＡ
V
sec
sec
Io=－5mA
Conditions
VCC+VM，PS=0V
VCC+VM
FR=2.8V
FR=0V
FGSEL=2.8V
FGSEL=0V
VTH=0V,LAIN=2.8V
VTH/VREG
PS=12V
PS=0V
LAIN=0V,VTH=2.8V
VTH=0V
VTH=2.8V
VTH/VREG
VTH/VREG
VTH=0.464×VREG
VTH=0.5×VREG
VMIN=0V
PWMIN=2.8V
PWMIN =0V
CL=0V,RNF2=2.8V
RNF2=0.2V
Io=±600mA（Upper＋Lower）
Io=5mA
REV. A
3/4
○PACKAGE OUTLINES
18.85( include. BURR)
BD6331FM
Lot No．
HSOP-M28（ＵNIT: mm）
○BLOCK DIAGRAM
○TERMINAL NAME
VCC
VREG
PS
Lock
Detect
VREG
Hall comp
＋
－
＋
－
OSC
SOUT
VM
H1+
H1-
H2+
H2-
H3+
H3-
FR
PWMIN
FGSEL
PS
CL
PWM Comp
+
-
Hall Amp
＋
－
＋
－
U
+
-
V
logic
Pre
Driver
Driver
W
＋
－
＋
－
+
-
RNF1
TSD
UVLO
+
-
Current Limit
Comp
RNF2
LAOUT
LAIN
VTH
VMIN
+
-
Level
Amp
-
+
Torque Amp
+
-
Open
Detect Comp
+
-
AGC Amp
CAGC
GND
PIN No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Terminal name
V
W
RNF2
FR
FGSEL
VM
GND
VCC
VREG
CL
CAGC
H1+
H1-
H2+
H2-
H3+
H3-
VMIN
VTH
LAOUT
LAIN
PWMIN
SOUT
PS
RNF
N.C.
N.C.
U
REV. A
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○CAUTION ON USE
1) Absolute maximum ratings
There is possibility of destruction in using beyond the absolute maximum rating. In case of destruction, a failure mode can
not be defined (short mode or open mode). Therefore when special mode is envisaged where absolute maximum rating
may be exceeded, please take a physical safety measure such as fuse.
2) Reverse connection of power supply connector
Reverse connection of power supply connector may break IC. Take a measure against reverse connection destruction such
as inserting a diode between power supply and Vcc terminal.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a
capacitor between power supply and GND for routing regenerated current, and fully ensure that the capacitor characteristics
have no problem before determine a capacitor value.
4) GND potential
Ensure that the potential of GND terminal is the minimum potential in any operating condition. Also ensure that all terminals
except GND terminal do not fall below GND voltage including transient characteristics. However, it is possible that the motor
output terminal may deflect below GND because of influence by back electromotive force of motor. Malfunction may
possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation
that no problem is found on operation of IC.
5) Thermal design
Consider the power dissipation under actual use condition and apply thermal design with sufficient margin.
6) Mounting failures
In attaching IC to printed board, pay enough attention to the direction and dislocation of IC. Mounting failures may break IC.
In addition, destruction is also possible when circuit is shorted by foreign substance brought between outputs or between
output and power supply - GND.
7) Operation in strong electromagnetic field
Use in strong electromagnetic field may cause malfunction, please be careful.
8) ASO
Please consider that the output Tr does not exceed the absolute maximum rating and ASO.
9) Thermal shut down circuit
This IC has thermal shut down (TSD) circuit. Operation temperature is 175℃(typ.) and has a hysteresis width of 25℃(typ.).
When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is simply for
the purpose of intercepting IC from overheating, and not for protecting and assuring IC. Therefore do not continue to use IC
thereafter with this circuit operating and do not use IC assuming the operation of this circuit.
10) Inspection with a set board
When connecting a capacitor to a pin with low impedance in inspection on a set board, stress may possibly be applied to IC,
therefore be sure to apply discharging in each process. In attaching to and detaching from jigs in inspection process, be sure
to turn off power before connecting, and turn off power before removing IC. In addition, apply grounding to assembling
process as a measure of anti-static electricity, and use full caution in transporting and storing.
11) GND wiring pattern
When there are small signal GND and large current GND, separate the large current GND pattern from small signal GND
pattern. It is recommended to apply one-point grounding at the reference point of the set in order that resistance of wiring
pattern and large current do not cause change of voltage of small signal GND. Please be cautious not to fluctuate the wiring
pattern of GND of external mounted parts.
12) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND
is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes
mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where
parasitic element is actuated.
13) Measure against VM voltage rise by back electromotive force
The re-circulate current might flow into the VM power supply for the PWM operation. Especially, please note it when rapidly
changing it into a low torque at a high torque. In such case, please connect a zenner diode between VM and GND terminal,
not to exceed the absolute maximum rating voltage.
14) FG output signal
Hall element may be affected by noise or the like depending on the wiring pattern of board. Especially, please note it when
rapidly changing it into a low torque at a high torque. In this case, place a capacitor between the hall input terminals to
decrease the noise of the hall signal, and increase the hall input level.
REV. A
Appendix
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM
CO.,LTD.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you
wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM
upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account when
designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should
you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no respon-
sibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples of
application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or
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whatsoever for any dispute arising from the use of such technical information.
The Products specified in this document are intended to be used with general-use electronic equipment or
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The Products are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or
malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the
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