IC,LOGIC MUX,SINGLE,4-INPUT,GAAS,QFL,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| package instruction | QFF, QFL20,.17X.32,40 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XQFP-F20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | MULTIPLEXER |
| Maximum Frequency@Nom-Sup | 2000000000 Hz |
| Number of functions | 1 |
| Number of entries | 4 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -65 °C |
| Package body material | CERAMIC |
| encapsulated code | QFF |
| Encapsulate equivalent code | QFL20,.17X.32,40 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | -2 V |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | GAAS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1 mm |
| Terminal location | QUAD |
| UPG704B-20 | UPG704B-10 | UPG704B-15 | UPG704B-25 | |
|---|---|---|---|---|
| Description | IC,LOGIC MUX,SINGLE,4-INPUT,GAAS,QFL,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,4-INPUT,GAAS,QFL,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,4-INPUT,GAAS,QFL,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,4-INPUT,GAAS,QFL,20PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| package instruction | QFF, QFL20,.17X.32,40 | QFF, QFL20,.17X.32,40 | QFF, QFL20,.17X.32,40 | QFF, QFL20,.17X.32,40 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XQFP-F20 | R-XQFP-F20 | R-XQFP-F20 | R-XQFP-F20 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| Maximum Frequency@Nom-Sup | 2000000000 Hz | 1000000000 Hz | 1500000000 Hz | 2500000000 Hz |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of entries | 4 | 4 | 4 | 4 |
| Number of terminals | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -65 °C | -65 °C | -65 °C | -65 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QFF | QFF | QFF | QFF |
| Encapsulate equivalent code | QFL20,.17X.32,40 | QFL20,.17X.32,40 | QFL20,.17X.32,40 | QFL20,.17X.32,40 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| power supply | -2 V | -2 V | -2 V | -2 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES | YES |
| technology | GAAS | GAAS | GAAS | GAAS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | FLAT | FLAT | FLAT |
| Terminal pitch | 1 mm | 1 mm | 1 mm | 1 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD |