
3.2W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC24, LLP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| package instruction | HVQCCN, LCC24,.16X.2,20 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Nominal bandwidth | 20 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| JESD-30 code | R-PQCC-N24 |
| JESD-609 code | e3 |
| length | 5 mm |
| Humidity sensitivity level | 3 |
| Number of channels | 2 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Nominal output power | 3.2 W |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC24,.16X.2,20 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.8 mm |
| Maximum slew rate | 20 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 4 mm |
| LM4866LQX/NOPB | |
|---|---|
| Description | 3.2W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC24, LLP-24 |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| package instruction | HVQCCN, LCC24,.16X.2,20 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Nominal bandwidth | 20 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| JESD-30 code | R-PQCC-N24 |
| JESD-609 code | e3 |
| length | 5 mm |
| Humidity sensitivity level | 3 |
| Number of channels | 2 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Nominal output power | 3.2 W |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC24,.16X.2,20 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.8 mm |
| Maximum slew rate | 20 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 4 mm |