
IC AUDIO PREAMPLIFIER, PBGA6, MICRO, SMD-6, Audio/Video Amplifier
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | National Semiconductor(TI ) |
| package instruction | , |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Commercial integrated circuit types | AUDIO PREAMPLIFIER |
| JESD-30 code | R-PBGA-B6 |
| JESD-609 code | e1 |
| Humidity sensitivity level | 1 |
| Number of terminals | 6 |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| surface mount | YES |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| LMV1023UR | LMV1022UR | LMV1022URX | LMV1023URX | |
|---|---|---|---|---|
| Description | IC AUDIO PREAMPLIFIER, PBGA6, MICRO, SMD-6, Audio/Video Amplifier | IC AUDIO PREAMPLIFIER, PBGA6, MICRO, SMD-6, Audio/Video Amplifier | IC AUDIO PREAMPLIFIER, PBGA6, MICRO, SMD-6, Audio/Video Amplifier | IC AUDIO PREAMPLIFIER, PBGA6, MICRO, SMD-6, Audio/Video Amplifier |
| Is it Rohs certified? | conform to | conform to | conform to | conform to |
| Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Commercial integrated circuit types | AUDIO PREAMPLIFIER | AUDIO PREAMPLIFIER | AUDIO PREAMPLIFIER | AUDIO PREAMPLIFIER |
| JESD-30 code | R-PBGA-B6 | R-PBGA-B6 | R-PBGA-B6 | R-PBGA-B6 |
| JESD-609 code | e1 | e1 | e1 | e1 |
| Humidity sensitivity level | 1 | 1 | 1 | 1 |
| Number of terminals | 6 | 6 | 6 | 6 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES | YES |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL | BALL | BALL | BALL |
| Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |