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LMV1023UR

Description
IC AUDIO PREAMPLIFIER, PBGA6, MICRO, SMD-6, Audio/Video Amplifier
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size624KB,18 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Environmental Compliance
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LMV1023UR Overview

IC AUDIO PREAMPLIFIER, PBGA6, MICRO, SMD-6, Audio/Video Amplifier

LMV1023UR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNational Semiconductor(TI )
package instruction,
Reach Compliance Codecompliant
ECCN codeEAR99
Commercial integrated circuit typesAUDIO PREAMPLIFIER
JESD-30 codeR-PBGA-B6
JESD-609 codee1
Humidity sensitivity level1
Number of terminals6
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
surface mountYES
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED

LMV1023UR Related Products

LMV1023UR LMV1022UR LMV1022URX LMV1023URX
Description IC AUDIO PREAMPLIFIER, PBGA6, MICRO, SMD-6, Audio/Video Amplifier IC AUDIO PREAMPLIFIER, PBGA6, MICRO, SMD-6, Audio/Video Amplifier IC AUDIO PREAMPLIFIER, PBGA6, MICRO, SMD-6, Audio/Video Amplifier IC AUDIO PREAMPLIFIER, PBGA6, MICRO, SMD-6, Audio/Video Amplifier
Is it Rohs certified? conform to conform to conform to conform to
Maker National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
Reach Compliance Code compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Commercial integrated circuit types AUDIO PREAMPLIFIER AUDIO PREAMPLIFIER AUDIO PREAMPLIFIER AUDIO PREAMPLIFIER
JESD-30 code R-PBGA-B6 R-PBGA-B6 R-PBGA-B6 R-PBGA-B6
JESD-609 code e1 e1 e1 e1
Humidity sensitivity level 1 1 1 1
Number of terminals 6 6 6 6
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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