MSCC4SA-120RM-G datasheet, PDF

Datasheet> All Categories > Passive components> capacitor> MSCC4SA-120RM-G

MSCC4SA-120RM-G: DescriptionFilm Capacitor, 20% +Tol, 20% -Tol, 0.00012uF, Surface Mount, 0404, CHIP; CategoryPassive components capacitor; File Size34KB，1 Pages; ManufacturerMini-Systems Inc (MSI); Websitehttp://www.mini-systemsinc.com; Environmental Compliance

Download Datasheet Parametric View All

MSCC4SA-120RM-G Overview

Film Capacitor, 20% +Tol, 20% -Tol, 0.00012uF, Surface Mount, 0404, CHIP

MSCC4SA-120RM-G Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Mini-Systems Inc (MSI)
package instruction	CHIP
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	0.00012 µF
Capacitor type	FILM CAPACITOR
JESD-609 code	e4
Manufacturer's serial number	MSCC-4
Installation features	SURFACE MOUNT
negative tolerance	20%
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
positive tolerance	20%
size code	0404
surface mount	YES
Terminal surface	Gold (Au)
Terminal shape	ONE SURFACE

Preview

Download Datasheet

View All

MOSSTYLECHIPCAPACITORS

MSCC 2 - MSCC 4

MSCC SERIES

MSCC-2

SIZE

CAPACIT

ACITANCE VALUES

CAPACITANCE VALUES (pF)

0.020" x 0.020" (±0.003") x 0.010" (±0.001")

4.7

5.6

6.8

8.2

4.7 - 10

11 - 20

21 - 51

MSCC 5

TOLERANCES

TOLERANCE(S)

±0.5pF

5%, 10%, 20%

2.5%, 5%, 10%, 20%

MSCC-3

SIZE

CAPACIT

ACITANCE VALUES

CAPACITANCE VALUES (pF)

TOLERANCES

0.030" x 0.030" (±0.003") x 0.010" (±0.001")

33 - 100

TOLERANCE(S)

2.5%, 5%, 10%, 20%

100

MSCC-4

SIZE

CAPACIT

ACITANCE VALUES

CAPACITANCE VALUES (pF)

0.040" x 0.040" (±0.003") x 0.010" (±0.001")

100

110

120

130

180

200

220

56 - 220

150

160

WORKING VOLTAGE (V)

MSCC 2

WORKING VOLTAGE vs CAPACITANCE

250

225

200

175

150

125

100

4.7

TOLERANCES

TOLERANCE(S)

2.5%, 5%, 10%, 20%

MSCC-5

6.8

12 15 18

22 27

CAPACITANCE (pF)

SIZE

CAPACIT

ACITANCE VALUES

CAPACITANCE VALUES (pF)

WORKING VOLTAGE (V)

250

225

200

175

150

125

100

MSCC 3

WORKING VOLTAGE vs CAPACITANCE

0.055" x 0.055" (±0.003") x 0.010" (±0.001")

150

160

180

200

270

300

330

360

470

510

560

620

820

910

1000

150 - 1000

220

390

680

240

430

750

TOLERANCES

TOLERANCE(S)

2.5%, 5%, 10%, 20%

DAT

COMMON SERIES DATA

47 51 56 62 68

CAPACITANCE (pF)

91 100

WORKING VOLTAGE (V)

250

225

200

175

150

125

100

MSCC 4

WORKING VOLTAGE vs CAPACITANCE

100

120

CAPACITANCE (pF)

150

180

220

SUBSTRATE

DIELECTRIC

PAD

BOND PAD

BACKSIDE

T.C.C.

OPERATING TEMPERATURE

OPERATING TEMPERATURE RANGE

DISSIPA

FACTOR

DISSIPATION FACTOR

INSULATION RESISTANCE

RESISTANCE

MOISTURE RESISTANCE

THERMAL SHOCK

TEMPERATURE

HIGH TEMPERATURE EXPOSURE

SHORT TERM OVERLOAD

STABILITY

250

225

200

175

150

125

100

150 180

MSCC 5

WORKING VOLTAGE vs CAPACITANCE

220 270 330 390 470 560 680 820 1000

CAPACITANCE (pF)

SILICON

SILICON OXIDE

STANDARD;

GOLD STANDARD; ALUMINUM OPTIONAL

SUITABLE

ATT

TTA

GOLD, SUITABLE FOR EUTECTIC OR CONDUCTIVE EPOXY ATTATCH

+45ppm/°C, ±25ppm/°C

-55°C TO +150°C

1Vrms,

1KHz, 1Vrms, 25°C, 0.1%

1MHz, 50Vrms, 25°C, 1000 MIN.

50Vrms,

VOLT

@ WORKING VOLTAGE, 10

Ω

MIL-STD 202, METHOD 106,

∆

GREATER

±1pF OR 2%

∆

C MAX., WHICHEVER IS GREATER

107F,

MIL-STD 202, METHOD 107F,

∆

±0.5pF MAX., MSI TYPICAL ±0.1pF

150°C, 100 HRS.,

∆

GREATER

±0.5pF OR 1%

∆

C MAX., WHICHEVER IS GREATER

1.5X

VOLT

1.5X WORKING VOLTAGE, 5 SEC.,

∆

GREATER

±0.5pF OR 1%

∆

C MAX., WHICHEVER IS GREATER

70°C,

VOLT

1000 HRS., 70°C, @ WORKING VOLTAGE

∆

±2.5%

GREATER

±2.5pF OR ±2.5% MAX.

∆

C, WHICHEVER IS GREATER

XXXXX

CAPACIT

ACITANCE VALUE

CAPACITANCE VALUE

5-Digit Number: First 4 Digits

Are Significant

With "R" As Decimal Point

When Required.

5th Digit Represents

Number of Zeros.

CHIP

CAPACITORS

WORKING VOLTAGE (V)

DESIGNATION

PART NUMBER DESIGNATION

MSCC

SERIES

SIZE

TYPE

TOL.

OPTION

±0.5p

*A =±0.5 p F

E = Aluminum Pads

H = 2.5%

G = Gold Pads

K = 10%

M = 20%

* Use for MSCC-2

4.7pF to 10pF

MINI-SYSTEMS, INC.

THIN FILM DIVISION

DAVID

ATTLEBORO,

20 DAVID ROAD, N. ATTLEBORO, MA 02760

508-695-0203 FAX: 508-695-6076

DCN TF 114-F-0306

EXAMPLE: MSCC5SA-510R0H-E = 0.055" x 0.055", Silicon Substrate,

510pF,

Tol.,

510pF, ±2.5% Tol., Aluminum Pads

Recommended Resources

LCD drive circuit (HD44780U) a

Adjustable voltage stabilized power supply composed of MC7805 and TL431

555 flow-type lantern control circuit

±5V and ±12V regulated power supply for computers composed of MPC1000 and LM320

IGBT UCE voltage monitoring principle

I want to make a device that can affect wired signals.: Is there anything that can affect the video signal, or the wireless device that can affect the wired signal of computer cable TV, etc.?...; 静水深远 MCU

Recently, many friends have discussed SMD welding. Let me show you a video from abroad.: Hope it helps everyone [flash] [url=http://player.youku.com/player.php/sid/XMTAzNzUwMzAw/v.swf]http://player.youku.com/player.php/sid/ XMTAzNzUwMzAw/v.swf[/url] [/flash] [flash] [url=http://player.you...; 飞雪008 MCU

de1 flash burning problem: Hello friends, I have done an experiment recently, using ALTERA's DE1 board, quartus and nios are both version 7.2. I burned the SOF file first, and then used Flash Programm to burn the NIOS program a...; haozi963 Embedded System

Hardware Engineer's Manual (Huawei Internal Reference): Hardware Engineer's Manual (Huawei Internal Reference)...; 程序天使 DSP and ARM Processors

An important representative enterprise in 70 chip sub-sectors in China!: An important representative enterprise in 70 chip sub-sectors in China!my country's integrated circuit market maintains rapid development, and the proportion of integrated circuit design continues to ...; 太白金星 Domestic Chip Exchange

RSL10 problem SWD idcod cannot be obtained solution and small pit sharing: The moment I got the board, I first thought it was small and suitable for embedding. I spent a while looking for the programming port, but later I found it in the schematic diagram and chose to jumper...; lehuijie onsemi and Avnet IoT Innovation Design Competition

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components