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BC859CR13

Description
Transistor
CategoryDiscrete semiconductor    The transistor   
File Size94KB,2 Pages
ManufacturerDIOTEC
Websitehttp://www.diotec.com/
Download Datasheet Parametric View All

BC859CR13 Overview

Transistor

BC859CR13 Parametric

Parameter NameAttribute value
MakerDIOTEC
package instruction,
Reach Compliance Codecompliant
BC856 ... BC860
BC856 ... BC860
PNP
Surface Mount General Purpose Si-Epi-Planar Transistors
Si-Epi-Planar Universaltransistoren für die Oberflächenmontage
Power dissipation – Verlustleistung
2.9
±0.1
0.4
3
1.3
1.1
PNP
250 mW
SOT-23
(TO-236)
0.01 g
Version 2011-11-07
Plastic case
Kunststoffgehäuse
±0.1
Type
Code
1
1.9
2
2.5 max
Weight approx. – Gewicht ca.
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
Dimensions - Maße [mm]
1=B
2=E
3=C
Maximum ratings (T
A
= 25°C)
Grenzwerte (T
A
= 25°C)
BC856
BC857
BC860
45 V
50 V
5V
250 mW
1
)
100 mA
200 mA
-55...+150°C
-55…+150°C
BC858
BC859
30 V
30 V
Collector-Emitter-volt. – Kollektor-Emitter-Spannung
Collector-Base-voltage – Kollektor-Basis-Spannung
Emitter-Base-voltage – Emitter-Basis-Spannung
Power dissipation – Verlustleistung
Collector current – Kollektorstrom (dc)
Peak Collector current – Kollektor-Spitzenstrom
Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
B open
E open
C open
- V
CEO
- V
CBO
- V
EBO
P
tot
- I
C
- I
CM
T
j
T
S
65 V
80 V
Characteristics (T
j
= 25°C)
Min.
DC current gain – Kollektor-Basis-Stromverhältnis
- V
CE
= 5 V, - I
C
= 10 µA
Group A
Group B
Group C
Group A
Group B
Group C
H
FE
h
FE
h
FE
H
FE
h
FE
h
FE
- V
CEsat
- V
CEsat
- V
BEsat
- V
BEsat
125
220
420
Kennwerte (T
j
= 25°C)
Typ.
90
150
270
180
290
520
700 mV
900 mV
Max.
250
475
800
300 mV
650 mV
- V
CE
= 5 V, - I
C
= 2 mA
Collector-Emitter saturation voltage – Kollektor-Sättigungsspannung
2
)
I
C
= 10 mA, I
B
= 0.5 mA
I
C
= 100 mA, I
B
= 5 mA
Base-Emitter saturation voltage – Basis-Sättigungsspannung
2
)
I
C
= 10 mA, I
B
= 0.5 mA
I
C
= 100 mA, I
B
= 5 mA
1
2
Mounted on P.C. board with 3 mm
2
copper pad at each terminal
Montage auf Leiterplatte mit 3 mm
2
Kupferbelag (Lötpad) an jedem Anschluss
Tested with pulses t
p
= 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen t
p
= 300 µs, Schaltverhältnis ≤ 2%
http://www.diotec.com/
© Diotec Semiconductor AG
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