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IS25C16-2GLI

Description
EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8
Categorystorage    storage   
File Size472KB,18 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance  
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IS25C16-2GLI Overview

EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8

IS25C16-2GLI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeSOIC
package instructionSOP,
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum clock frequency (fCLK)10 MHz
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.9 mm
memory density16384 bit
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals8
word count2048 words
character code2000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.73 mm
Serial bus typeSPI
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3.9 mm
Maximum write cycle time (tWC)5 ms
IS25C16
16K-BIT SPI SERIAL
ELECTRICALLY ERASABLE PROM
Preliminary Information
February 2009
FEATURES
• Serial Peripheral Interface (SPI) Compatible
— Supports SPI Modes 0 (0,0) and 3 (1,1)
• Wide-voltage Operation
— Vcc = 1.8V to 5.5V
• Low power CMOS
— Operating current less than 1 mA (1.8V)
— Standby current less than 1 µA (1.8V)
• Block Write Protection
— Protect 1/4, 1/2, or Entire Array
• 16-byte page write mode
— Partial page writes allowed
• 10 MHz Clock Rate (5V)
• Self timed write cycles (5 ms Typical)
• High-reliability
— Endurance: 1 million cycles per byte
— Data retention: 100 years
• Industrial and Automotive temperature ranges
• Packages: SOIC/SOP, TSSOP, DFN and CSP
DESCRIPTION
The IS25C16 is a 16Kbit (2048 x 8) electrically erasable
PROM devices that use the Serial Peripheral Interface
(SPI) for communications.
This EEPROM operates in a wide voltage range of 1.8V
to 5.5V to be compatible with most application voltages.
ISSI designed this device to be a practical, low-power SPI
EEPROM solution. The device is offered in lead-free, RoHS,
halogen free or Green. The available package types are
8-pin SOIC, TSSOP, DFN and CSP.
The functional features of the IS25C16 allow them to
be among the most advanced serial non-volatile memo-
ries available. Each device has a Chip-Select (CS)
pin, and a 3-wire interface of Serial Data In (SI), Se-
rial Data Out (SO), and Serial Clock (SCK). While the
3-wire interface of the IS25C16 provides for high-speed
access, a
HOLD
pin allows the memories to ignore the
interface in a suspended state; later the
HOLD
pin re-
activates communication without re-initializing the serial
sequence. A Status Register facilitates a flexible write
protection mechanism, and a device-ready bit (RDY).
Copyright © 2008 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for critical medical or surgical equip-
ment, aerospace systems, or for other applications planned to support or sustain life. It is the customer's obligation to optimize the design in their own products for the best
performance and optimization on the functionality and etc. ISSI assumes no liability arising out of the application or use of any information, products or services described
herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and prior placing orders for products.
Integrated Silicon Solution, Inc.
Preliminary Information
01/26/09
Rev. 00A
1

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Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code SOIC SOIC SON TSSOP CSP TSSOP
package instruction SOP, SOP, VSON, TSSOP, DIE, TSSOP,
Contacts 8 8 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 10 MHz 5 MHz 10 MHz 10 MHz 10 MHz 5 MHz
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-XDSO-N8 R-PDSO-G8 R-XUUC-N8 R-PDSO-G8
JESD-609 code e3 e3 e3 e3 e1 e3
memory density 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 125 °C 85 °C 85 °C 85 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
encapsulated code SOP SOP VSON TSSOP DIE TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH UNCASED CHIP SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Serial bus type SPI SPI SPI SPI SPI SPI
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 2.5 V 1.8 V 1.8 V 1.8 V 2.5 V
Nominal supply voltage (Vsup) 2.5 V 5 V 2.5 V 2.5 V 2.5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL AUTOMOTIVE INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) Matte Tin (Sn) - annealed Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed
Terminal form GULL WING GULL WING NO LEAD GULL WING NO LEAD GULL WING
Terminal location DUAL DUAL DUAL DUAL UPPER DUAL
Maximum time at peak reflow temperature 40 40 40 40 40 40
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
Is it lead-free? Lead free Lead free - Lead free - Lead free
length 4.9 mm 4.9 mm 3 mm 4.4 mm - 4.4 mm
Humidity sensitivity level 3 3 1 1 - 1
Maximum seat height 1.73 mm 1.73 mm 0.8 mm 1.2 mm - 1.2 mm
Terminal pitch 1.27 mm 1.27 mm 0.5 mm 0.65 mm - 0.65 mm
width 3.9 mm 3.9 mm 2 mm 3 mm - 3 mm
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