FBI2.5A4S1.......FBI2.5M4S1
2.5 Amp. Glass Passivated Bridge Rectifier
Dimensions in mm.
20
3.5
Plastic
Case
Voltage
50 to 1000 V.
Current
2.5 A.
®
_
0.8
+ 0.05
+
• Glass Passivated Junction Chips.
L
4
4
4
suffix
–4
1
0.5
•
UL recognized under component index file
number E130180.
•
Lead and polarity identifications.
•
Case: Molded Plastic.
•
Ideal for printed circuit board (P
.C.B.).
•
The plastic material carries U/L recognition 94 V-O.
13.5
7
• Mounting Instructions
•
High temperature soldering guaranteed: 260 ºC – 10 sc.
•
Recommended mounting torque: 8 Kg.cm.
Maximum Ratings, according to IEC publication No. 134
FBI2.5A FBI2.5B FBI2.5D FBI2.5G FBI2.5J FBI2.5K FBI2.5M
4S1
4S1
4S1
4S1
4S1
4S1
4S1
V
RRM
V
RMS
I
F(AV)
I
FSM
I
2
t
V
DIS
T
j
T
stg
Peak recurrent reverse voltage (V)
Maximum RMS voltage (V)
Max. Average forward current with heatsink
without heatsink
8.3 ms. peak forward surge current
(Jedec Method)
50
35
100
70
200
140
400
280
600
420
800
560
1000
700
4.5 A at 65 ºC
2.5 A at 25 ºC
100 A
15 A
2
sec
1500 V
– 55 to + 150 °C
– 55 to +150 ºC
Rating for fusing ( t<8.3 ms.)
Dielectric strength
(terminals to case, AC 1 min.)
Operating temperature range
Storage temperature range
Electrical Characteristics at Tamb = 25°C
V
F
I
R
R
th (j-c)
R
th (j-a)
Max. forward voltage drop per element at I
F
= 2.5 A
Max. reverse current per element at V
RRM
MAXIMUM THERMAL RESISTANCE
Junction-Case. With Heatsink.
Junction-Ambient. Without Heatsink.
1.0 V
5 A
12 ºC/W
40 ºC/W
Jan - 00
FBI2.5 - 4S1
Characteristic Curves
TYPICAL FORWARD CHARACTERISTIC
Tamb = 25° C
FORWARD CURRENT DERATING CURVE
10
5
heatsink
Tc
Tc
_
+
4
on glass-epoxi substrate
1.0
3
sine wave
R-load
on heatsink
_
+
P.C.B.
soldering land 5 mm ø
sine wave
R-load
free in air
2
0.1
1
0
0.6
1.0
1.4
V
F
, instantaneous forward voltage (V)
0
0
25
50
75 100 125 150 175
Tamb, ambient temperature (°C)
MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
100
75
50
25
0
1
10
Number of cycles at 60 Hz.
100
Jan - 00