MD2202-16-V3-P datasheet, PDF - EEWORLD Datasheet

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MD2202-16-V3-P: DescriptionMemory IC; Categorystorage storage; File Size306KB，29 Pages; ManufacturerM-Systems Corp

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Memory IC

MD2202-16-V3-P Parametric

Parameter Name	Attribute value
Maker	M-Systems Corp
package instruction	,
Reach Compliance Code	unknown

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DiskOnChip 2000 DIP

From 16MByte to 1GByte

Data Sheet, March 2006

Highlights

DiskOnChip 2000 DIP is a member of

M-Systems’ family of DiskOnChip flash disk

products. It is available in densities of 16MByte

to 1GByte.

DiskOnChip 2000 DIP features:

Single-chip plug-n-play flash disk

Low power, single 3.3V or 5V power

supply

16MByte (MB) to 1GByte (GB) density

Simple, easy-to-integrate interface

8KB sized memory window

Boot OS capability

Proprietary TrueFFS

technology for full

hard-disk emulation, high data reliability

and maximum flash lifetime

Software tools for programming,

duplicating, testing, and debugging

Reliability

TrueFFS Software

On-the-fly Reed-Solomon Error Detection

Code/Error Correction Code (EDC/ECC)

Guaranteed data integrity, even after power

failure

Transparent bad-block management

Dynamic and static wear-leveling

Full hard-disk read/write emulation for

transparent file system management

Identical software for all DiskOnChip

capacities

Patented methods to extend flash lifetime,

including:

Dynamic virtual mapping

Dynamic and static wear-leveling

Support for all major OSs, including:

VxWorks, Windows CE/.NET, Linux,

Windows NT/XP, QNX and others.

Operates with TrueFFS Software

Development Kit (SDK) in OS-less

environment.

RoHS Support

RoHS version available (16MB-96MB)

Data Sheet, Rev. 3.9

91-SR-002-42-8L

DiskOnChip 2000 DIP

ABLE OF

ONTENTS

1. Introduction ............................................................................................................................... 3

2. Product Overview ...................................................................................................................... 4

2.1

2.2

2.3

2.4

3.1

3.2

3.3

3.4

3.5

Product Description ............................................................................................................ 4

I/O Operation ...................................................................................................................... 5

Pin Diagram........................................................................................................................ 5

Signal Descriptions............................................................................................................. 6

Overview............................................................................................................................. 7

System Interface................................................................................................................. 7

Boot Block .......................................................................................................................... 8

Error Detection Code/Error Correction Code (EDC/ECC) .................................................. 8

Flash Control ...................................................................................................................... 8

3. Theory of Operation .................................................................................................................. 7

4. Operating Modes ....................................................................................................................... 9

5. TrueFFS Technology............................................................................................................... 10

5.1

General Description.......................................................................................................... 10

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

Built-In Operating System Support..................................................................................... 11

TrueFFS Software Development Kit (SDK)........................................................................ 11

File Management................................................................................................................ 11

Bad-Block Management ..................................................................................................... 11

Wear-Leveling .................................................................................................................... 11

Error Detection/Correction.................................................................................................. 12

Special Features through I/O Control (IOCTL) Mechanism ............................................... 13

Compatibility ....................................................................................................................... 13

5.2

Power Failure Management ............................................................................................. 12

5.2.1

5.2.2

5.2.3

5.3

6.1

6.2

7.1

7.2

7.3

8KB Memory Window ....................................................................................................... 14

Introduction....................................................................................................................... 15

Boot Procedure in PC-Compatible Platforms ................................................................... 15

Design Environment ......................................................................................................... 17

System Interface............................................................................................................... 17

Connecting Signals........................................................................................................... 18

6. Booting from DiskOnChip 2000 ............................................................................................. 15

7. Design Considerations ........................................................................................................... 17

Data Sheet, Rev. 3.9

91-SR-002-42-8L

DiskOnChip 2000 DIP

7.4

Platform-Specific Issues ................................................................................................... 18

7.4.1

7.4.2

7.4.3

Wait State ........................................................................................................................... 18

Big and Little Endian Systems............................................................................................ 18

Working with 8/16/32-Bit Systems...................................................................................... 19

8. Product Specifications ........................................................................................................... 20

8.1

Environmental Specifications ........................................................................................... 20

8.1.1

8.1.2

8.1.3

8.1.4

Temperature Ranges ......................................................................................................... 20

DiskOnChip Assembly........................................................................................................ 20

Humidity.............................................................................................................................. 20

Shock and Vibration ........................................................................................................... 20

Absolute Maximum Ratings................................................................................................ 20

Capacitance........................................................................................................................ 21

DC Electrical Characteristics over Operating Range ......................................................... 21

AC Operating Conditions.................................................................................................... 22

Read Cycle Timing ............................................................................................................. 23

Write Cycle Timing ............................................................................................................. 24

8.2

Electrical Specifications.................................................................................................... 20

8.2.1

8.2.2

8.2.3

8.2.4

8.3

Timing Specifications........................................................................................................ 23

8.3.1

8.3.2

8.4

Mechanical Dimensions.................................................................................................... 25

9. Ordering Information............................................................................................................... 26

How to Contact Us ........................................................................................................................ 27

Data Sheet, Rev. 3.9

91-SR-002-42-8L

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