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S29WS064R0PBHW010

Description
Flash, 4MX16, 80ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84
Categorystorage    storage   
File Size2MB,83 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
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S29WS064R0PBHW010 Overview

Flash, 4MX16, 80ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84

S29WS064R0PBHW010 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeBGA
package instructionVFBGA, BGA84,10X12,32
Contacts84
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time80 ns
Other featuresBOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B84
length11.6 mm
memory density67108864 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size4,127
Number of terminals84
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA84,10X12,32
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
power supply1.8 V
Programming voltage1.8 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1 mm
Department size8K,32K
Maximum standby current0.00007 A
Maximum slew rate0.066 mA
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
switch bitYES
typeNOR TYPE
width8 mm
S29WS064R
64 Megabit (4M x 16-bit), CMOS 1.8 Volt-Only
Simultaneous Read/Write, Burst-mode MirrorBit
®
Flash Memory
Data Sheet
(Advance Information)
S29WS064R Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S29WS064R_00
Revision
05
Issue Date
July 22, 2011

S29WS064R0PBHW010 Related Products

S29WS064R0PBHW010 S29WS064R0SBHW003 S29WS064R0SBHW010 S29WS064R0SBHW013 S29WS064R0PBHW000 S29WS064R0PBHW003 S29WS064R0PBHW013 S29WS064R0SBHW000
Description Flash, 4MX16, 80ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84 Flash, 4MX16, 80ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84 Flash, 4MX16, 80ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84 Flash, 4MX16, 80ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84 Flash, 4MX16, 80ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84 Flash, 4MX16, 80ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84 Flash, 4MX16, 80ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84 Flash, 4MX16, 80ns, PBGA84, 11.60 X 8 MM, LEAD FREE, FBGA-84
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Maker SPANSION SPANSION SPANSION SPANSION SPANSION SPANSION SPANSION SPANSION
Parts packaging code BGA BGA BGA BGA BGA BGA BGA BGA
package instruction VFBGA, BGA84,10X12,32 11.60 X 8 MM, LEAD FREE, FBGA-84 VFBGA, BGA84,10X12,32 11.60 X 8 MM, LEAD FREE, FBGA-84 11.60 X 8 MM, LEAD FREE, FBGA-84 11.60 X 8 MM, LEAD FREE, FBGA-84 VFBGA, BGA84,10X12,32 11.60 X 8 MM, LEAD FREE, FBGA-84
Contacts 84 84 84 84 84 84 84 84
Reach Compliance Code unknown unknown unknown unknown unknow unknow unknow unknow
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 80 ns 80 ns 80 ns 80 ns 80 ns 80 ns 80 ns 80 ns
Other features BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
startup block BOTTOM TOP BOTTOM BOTTOM TOP TOP BOTTOM TOP
command user interface YES YES YES YES YES YES YES YES
Universal Flash Interface YES YES YES YES YES YES YES YES
Data polling YES YES YES YES YES YES YES YES
JESD-30 code R-PBGA-B84 R-PBGA-B84 R-PBGA-B84 R-PBGA-B84 R-PBGA-B84 R-PBGA-B84 R-PBGA-B84 R-PBGA-B84
length 11.6 mm 11.6 mm 11.6 mm 11.6 mm 11.6 mm 11.6 mm 11.6 mm 11.6 mm
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bi 67108864 bi 67108864 bi 67108864 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1 1
Number of departments/size 4,127 4,127 4,127 4,127 4,127 4,127 4,127 4,127
Number of terminals 84 84 84 84 84 84 84 84
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000 4000000 4000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -25 °C -25 °C -25 °C -25 °C -25 °C -25 °C -25 °C -25 °C
organize 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16 4MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA VFBGA VFBGA VFBGA VFBGA VFBGA VFBGA VFBGA
Encapsulate equivalent code BGA84,10X12,32 BGA84,10X12,32 BGA84,10X12,32 BGA84,10X12,32 BGA84,10X12,32 BGA84,10X12,32 BGA84,10X12,32 BGA84,10X12,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Programming voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ready/busy YES YES YES YES YES YES YES YES
Maximum seat height 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Department size 8K,32K 8K,32K 8K,32K 8K,32K 8K,32K 8K,32K 8K,32K 8K,32K
Maximum standby current 0.00007 A 0.00007 A 0.00007 A 0.00007 A 0.00007 A 0.00007 A 0.00007 A 0.00007 A
Maximum slew rate 0.066 mA 0.07 mA 0.07 mA 0.07 mA 0.066 mA 0.066 mA 0.066 mA 0.07 mA
Maximum supply voltage (Vsup) 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER OTHER OTHER OTHER OTHER OTHER
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
switch bit YES YES YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm
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