|
IDT7317L55J |
IDT7317L40GB |
IDT7317L65GB |
IDT7317L75G |
IDT7317L20J |
IDT7317L35G |
IDT7317L35J |
IDT7317L90GB |
IDT7317L25GB |
IDT7317L75J |
| Description |
Multiplier, 16-Bit, CMOS, PQCC84, PLASTIC, LCC-84 |
Multiplier, 16-Bit, CMOS, CPGA84, PGA-84 |
Multiplier, 16-Bit, CMOS, CPGA84, PGA-84 |
Multiplier, 16-Bit, CMOS, CPGA84, PGA-84 |
Multiplier, 16-Bit, CMOS, PQCC84, PLASTIC, LCC-84 |
Multiplier, 16-Bit, CMOS, CPGA84, PGA-84 |
Multiplier, 16-Bit, CMOS, PQCC84, PLASTIC, LCC-84 |
Multiplier, 16-Bit, CMOS, CPGA84, PGA-84 |
Multiplier, 16-Bit, CMOS, CPGA84, PGA-84 |
Multiplier, 16-Bit, CMOS, PQCC84, PLASTIC, LCC-84 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Parts packaging code |
LCC |
PGA |
PGA |
PGA |
LCC |
PGA |
LCC |
PGA |
PGA |
LCC |
| package instruction |
PLASTIC, LCC-84 |
PGA-84 |
PGA-84 |
PGA-84 |
PLASTIC, LCC-84 |
PGA-84 |
PLASTIC, LCC-84 |
PGA-84 |
PGA-84 |
PLASTIC, LCC-84 |
| Contacts |
84 |
84 |
84 |
84 |
84 |
84 |
84 |
84 |
84 |
84 |
| Reach Compliance Code |
not_compliant |
_compli |
_compli |
not_compliant |
not_compliant |
_compli |
_compli |
_compli |
not_compliant |
not_compliant |
| boundary scan |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| maximum clock frequency |
18.18 MHz |
25 MHz |
15.38 MHz |
13.33 MHz |
50 MHz |
28.57 MHz |
28.57 MHz |
11.11 MHz |
40 MHz |
13.33 MHz |
| External data bus width |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
| JESD-30 code |
S-PQCC-J84 |
S-CPGA-P84 |
S-CPGA-P84 |
S-CPGA-P84 |
S-PQCC-J84 |
S-CPGA-P84 |
S-PQCC-J84 |
S-CPGA-P84 |
S-CPGA-P84 |
S-PQCC-J84 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| length |
29.2862 mm |
30.6705 mm |
30.6705 mm |
30.6705 mm |
29.2862 mm |
30.6705 mm |
29.2862 mm |
30.6705 mm |
30.6705 mm |
29.2862 mm |
| low power mode |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| Number of terminals |
84 |
84 |
84 |
84 |
84 |
84 |
84 |
84 |
84 |
84 |
| Maximum operating temperature |
70 °C |
125 °C |
125 °C |
70 °C |
70 °C |
70 °C |
70 °C |
125 °C |
125 °C |
70 °C |
| Output data bus width |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
| Package body material |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
PLASTIC/EPOXY |
| encapsulated code |
QCCJ |
PGA |
PGA |
PGA |
QCCJ |
PGA |
QCCJ |
PGA |
PGA |
QCCJ |
| Encapsulate equivalent code |
LDCC84,1.2SQ |
PGA84M,11X11 |
PGA84M,11X11 |
PGA84M,11X11 |
LDCC84,1.2SQ |
PGA84M,11X11 |
LDCC84,1.2SQ |
PGA84M,11X11 |
PGA84M,11X11 |
LDCC84,1.2SQ |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
CHIP CARRIER |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
CHIP CARRIER |
GRID ARRAY |
CHIP CARRIER |
GRID ARRAY |
GRID ARRAY |
CHIP CARRIER |
| power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
4.572 mm |
3.937 mm |
3.937 mm |
3.937 mm |
4.572 mm |
3.937 mm |
4.572 mm |
3.937 mm |
3.937 mm |
4.572 mm |
| Maximum slew rate |
52.72 mA |
110 mA |
52.28 mA |
33.32 mA |
180 mA |
94.28 mA |
94.28 mA |
26.66 mA |
200 mA |
33.32 mA |
| Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
NO |
NO |
NO |
YES |
NO |
YES |
NO |
NO |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
MILITARY |
MILITARY |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
MILITARY |
MILITARY |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
| Terminal form |
J BEND |
PIN/PEG |
PIN/PEG |
PIN/PEG |
J BEND |
PIN/PEG |
J BEND |
PIN/PEG |
PIN/PEG |
J BEND |
| Terminal pitch |
1.27 mm |
2.54 mm |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
1.27 mm |
2.54 mm |
2.54 mm |
1.27 mm |
| Terminal location |
QUAD |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
QUAD |
PERPENDICULAR |
QUAD |
PERPENDICULAR |
PERPENDICULAR |
QUAD |
| width |
29.2862 mm |
30.6705 mm |
30.6705 mm |
30.6705 mm |
29.2862 mm |
30.6705 mm |
29.2862 mm |
30.6705 mm |
30.6705 mm |
29.2862 mm |
| uPs/uCs/peripheral integrated circuit type |
DSP PERIPHERAL, MULTIPLIER |
DSP PERIPHERAL, MULTIPLIER |
DSP PERIPHERAL, MULTIPLIER |
DSP PERIPHERAL, MULTIPLIER |
DSP PERIPHERAL, MULTIPLIER |
DSP PERIPHERAL, MULTIPLIER |
DSP PERIPHERAL, MULTIPLIER |
DSP PERIPHERAL, MULTIPLIER |
DSP PERIPHERAL, MULTIPLIER |
DSP PERIPHERAL, MULTIPLIER |
| Maker |
IDT (Integrated Device Technology) |
- |
- |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
| ECCN code |
- |
3A001.A.2.C |
3A001.A.2.C |
- |
3A001.A.3 |
3A991.A.2 |
3A991.A.2 |
3A001.A.2.C |
3A001.A.2.C |
- |
| Peak Reflow Temperature (Celsius) |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
- |