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NX8563LA533-CC

Description
Laser Diode Module Emitter, 1530nm Min, 1562nm Max, SC-UPC Connector, Butterfly, Panel Mount, HERMETICAL SEALED PACKAGE-14
CategoryWireless rf/communication    Optical fiber   
File Size131KB,8 Pages
ManufacturerNEC Electronics
Download Datasheet Parametric View All

NX8563LA533-CC Overview

Laser Diode Module Emitter, 1530nm Min, 1562nm Max, SC-UPC Connector, Butterfly, Panel Mount, HERMETICAL SEALED PACKAGE-14

NX8563LA533-CC Parametric

Parameter NameAttribute value
MakerNEC Electronics
package instructionHERMETICAL SEALED PACKAGE-14
Reach Compliance Codeunknown
body width12.7 mm
body height7.8 mm
Body length or diameter20.83 mm
Built-in featuresTEC, THERMISTOR
Communication standardsITU-T
Connection TypeSC-UPC CONNECTOR
maximum descent time0.12 ns
Fiber optic equipment typesLASER DIODE MODULE EMITTER
Installation featuresPANEL MOUNT
Number of channels1
Maximum operating wavelength1562 nm
Minimum operating wavelength1530 nm
Nominal operating wavelength1546 nm
Package formBUTTERFLY
Rise Time0.12 ns
Supply current125 mA
Maximum supply voltage2 V
Minimum supply voltage0.9 V
surface mountNO
Transmission typeDIGITAL
DATA SHEET
LASER DIODE
NX8563LA Series
1 550 nm InGaAsP MQW-DFB LASER DIODE MODULE
2.5 Gb/s DIRECTLY MODULATION LIGHT SOURCE FOR DWDM APPLICATIONS
DESCRIPTION
The NX8563LA Series is a 1 550 nm Multiple Quantum Well (MQW)
structured Distributed Feed-Back (DFB) laser diode module with Single Mode
Fiber.
It is designed as directly modulation light source and ideal for optical
transmission systems. The device is available for Dense Wavelength Division
Multiplexing (DWDM) wavelengths based on ITU-T recommendations,
enabling a wide range of applications.
FEATURES
• Peak output power
P
f
= 10 mW MIN.
• Available for DWDM wavelengths based on ITU-T recommendations
(100 GHz grid, please refer to the
ORDERING INFORMATION)
• Internal thermo-electric cooler and isolator
• Hermetically sealed 14-pin butterfly package
• Single mode fiber pigtail
• Wide operation temperature range
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PL10428EJ02V0DS (2nd edition)
Date Published September 2005 CP(K)
Printed in Japan
The mark
shows major revised points.
NEC Compound Semiconductor Devices, Ltd. 2003, 2005
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