Intel
®
Core™2 Extreme Processor
X6800
Δ
and Intel
®
Core™2 Duo
Desktop Processor E6000
Δ
and
Δ
Series
E4000
Datasheet
—on 65 nm Process in the 775-land LGA Package and supporting Intel
®
64
Architecture and supporting Intel
®
Virtualization Technology
±
March 2008
Document Number: 313278-008
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING
TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT
INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Δ
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different
processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in
clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular
feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/
processor_number for details.
Intel
®
64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64. Processor
will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software
configurations. See http://www.intel.com/technology/intel64/index.htm for more information including details on which processors support Intel 64, or
consult with your system vendor for more information.
No computer system can provide absolute security under all conditions. Intel
®
Trusted Execution Technology (Intel
®
TXT) is a security technology under
development by Intel and requires for operation a computer system with Intel
®
Virtualization Technology, a Intel Trusted Execution Technology-enabled
Intel processor, chipset, BIOS, Authenticated Code Modules, and an Intel or other Intel Trusted Execution Technology compatible measured virtual
machine monitor. In addition, Intel Trusted Execution Technology requires the system to contain a TPMv1.2 as defined by the Trusted Computing Group
and specific software for some uses.
±Intel
®
Virtualization Technology requires a computer system with an enabled Intel
®
processor, BIOS, virtual machine monitor (VMM) and, for some
uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations
and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check
with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
The Intel
®
Core™2 Duo desktop processor E6000 and E4000 series and Intel
®
Core™2 Extreme processor X6800 may contain design defects or errors
known as errata which may cause the product to deviate from published specifications.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Pentium, Intel Core, Core Inside, Intel Inside, Intel Leap ahead, Intel SpeedStep, and the Intel logo are trademarks of Intel Corporation in the U.S.
and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2006–2008 Intel Corporation.
2
Datasheet
Contents
1
Introduction
............................................................................................................ 11
1.1
Terminology ..................................................................................................... 12
1.1.1 Processor Terminology ............................................................................ 12
1.2
References ....................................................................................................... 14
Electrical Specifications
........................................................................................... 15
2.1
Power and Ground Lands.................................................................................... 15
2.2
Decoupling Guidelines ........................................................................................ 15
2.2.1 VCC Decoupling ..................................................................................... 15
2.2.2 Vtt Decoupling ....................................................................................... 15
2.2.3 FSB Decoupling...................................................................................... 16
2.3
Voltage Identification ......................................................................................... 16
2.4
Market Segment Identification (MSID) ................................................................. 18
2.5
Reserved, Unused, and TESTHI Signals ................................................................ 18
2.6
Voltage and Current Specification ........................................................................ 19
2.6.1 Absolute Maximum and Minimum Ratings .................................................. 19
2.6.2 DC Voltage and Current Specification ........................................................ 20
2.6.3 V
CC
Overshoot ....................................................................................... 24
2.6.4 Die Voltage Validation ............................................................................. 24
2.7
Signaling Specifications...................................................................................... 25
2.7.1 FSB Signal Groups.................................................................................. 25
2.7.2 CMOS and Open Drain Signals ................................................................. 27
2.7.3 Processor DC Specifications ..................................................................... 27
2.7.3.1 GTL+ Front Side Bus Specifications ............................................. 28
2.7.4 Clock Specifications ................................................................................ 29
2.7.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 29
2.7.6 FSB Frequency Select Signals (BSEL[2:0])................................................. 29
2.7.7 Phase Lock Loop (PLL) and Filter .............................................................. 30
2.7.8 BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30
2.7.9 BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32
2.8
PECI DC Specifications ....................................................................................... 33
Package Mechanical Specifications
.......................................................................... 35
3.1
Package Mechanical Drawing............................................................................... 35
3.1.1 Processor Component Keep-Out Zones ...................................................... 39
3.1.2 Package Loading Specifications ................................................................ 39
3.1.3 Package Handling Guidelines.................................................................... 39
3.1.4 Package Insertion Specifications............................................................... 40
3.1.5 Processor Mass Specification .................................................................... 40
3.1.6 Processor Materials................................................................................. 40
3.1.7 Processor Markings................................................................................. 40
3.1.8 Processor Land Coordinates ..................................................................... 43
Land Listing and Signal Descriptions
....................................................................... 45
4.1
Processor Land Assignments ............................................................................... 45
4.2
Alphabetical Signals Reference ............................................................................ 68
Thermal Specifications and Design Considerations
.................................................. 77
5.1
Processor Thermal Specifications ......................................................................... 77
5.1.1 Thermal Specifications ............................................................................ 77
5.1.2 Thermal Metrology ................................................................................. 84
5.2
Processor Thermal Features ................................................................................ 84
5.2.1 Thermal Monitor..................................................................................... 84
5.2.2 Thermal Monitor 2 .................................................................................. 85
5.2.3 On-Demand Mode .................................................................................. 86
2
3
4
5
Datasheet
3
5.3
5.4
5.2.4 PROCHOT# Signal ..................................................................................87
5.2.5 THERMTRIP# Signal ................................................................................87
Thermal Diode...................................................................................................88
Platform Environment Control Interface (PECI) ......................................................90
5.4.1 Introduction ...........................................................................................90
5.4.1.1 Key Difference with Legacy Diode-Based Thermal
Management ............................................................................90
5.4.2 PECI Specifications .................................................................................92
5.4.2.1 PECI Device Address..................................................................92
5.4.2.2 PECI Command Support .............................................................92
5.4.2.3 PECI Fault Handling Requirements ...............................................92
5.4.2.4 PECI GetTemp0() Error Code Support ..........................................92
6
Features
..................................................................................................................93
6.1
Power-On Configuration Options ..........................................................................93
6.2
Clock Control and Low Power States .....................................................................93
6.2.1 Normal State .........................................................................................94
6.2.2 HALT and Extended HALT Powerdown States ..............................................94
6.2.2.1 HALT Powerdown State ..............................................................94
6.2.2.2 Extended HALT Powerdown State ................................................95
6.2.3 Stop Grant and Extended Stop Grant States ...............................................95
6.2.3.1 Stop Grant State .......................................................................95
6.2.3.2 Extended Stop Grant State .........................................................96
6.2.4 Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop
State, and Stop Grant Snoop State ...........................................................96
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................96
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop
State .......................................................................................96
®
SpeedStep
®
Technology .............................................................96
6.3
Enhanced Intel
Boxed Processor Specifications................................................................................99
7.1
Mechanical Specifications .................................................................................. 100
7.1.1 Boxed Processor Cooling Solution Dimensions........................................... 100
7.1.2 Boxed Processor Fan Heatsink Weight ..................................................... 101
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip
Assembly............................................................................................. 101
7.2
Electrical Requirements .................................................................................... 101
7.2.1 Fan Heatsink Power Supply .................................................................... 101
7.3
Thermal Specifications...................................................................................... 103
7.3.1 Boxed Processor Cooling Requirements.................................................... 103
7.3.2 Fan Speed Control Operation (Intel
®
Core2 Extreme Processor
X6800 Only) ........................................................................................ 105
7.3.3 Fan Speed Control Operation (Intel
®
Core2 Duo Desktop Processor
E6000 and E4000 Series Only) ............................................................... 105
Balanced Technology Extended (BTX) Boxed Processor Specifications
................... 107
8.1
Mechanical Specifications .................................................................................. 108
8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor
Cooling Solution Dimensions .................................................................. 108
8.1.2 Boxed Processor Thermal Module Assembly Weight ................................... 110
8.1.3 Boxed Processor Support and Retention Module (SRM) .............................. 111
8.2
Electrical Requirements .................................................................................... 112
8.2.1 Thermal Module Assembly Power Supply .................................................. 112
8.3
Thermal Specifications...................................................................................... 114
8.3.1 Boxed Processor Cooling Requirements.................................................... 114
8.3.2 Variable Speed Fan ............................................................................... 114
Debug Tools Specifications
.................................................................................... 117
9.1
Logic Analyzer Interface (LAI) ........................................................................... 117
9.1.1 Mechanical Considerations ..................................................................... 117
9.1.2 Electrical Considerations ........................................................................ 117
7
8
9
4
Datasheet
Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
V
CC
Static and Transient Tolerance ............................................................................. 23
V
CC
Overshoot Example Waveform ............................................................................. 24
Differential Clock Waveform ...................................................................................... 31
Differential Clock Crosspoint Specification ................................................................... 31
Differential Measurements......................................................................................... 31
Differential Clock Crosspoint Specification ................................................................... 32
Processor Package Assembly Sketch ........................................................................... 35
Processor Package Drawing Sheet 1 of 3 ..................................................................... 36
Processor Package Drawing Sheet 2 of 3 ..................................................................... 37
Processor Package Drawing Sheet 3 of 3 ..................................................................... 38
Processor Top-Side Markings Example for the Intel
®
Core™2 Duo Desktop
Processor E6000 Series with 4 MB L2 Cache with 1333 MHz FSB..................................... 40
Processor Top-Side Markings Example for the Intel
®
Core™2 Duo Desktop
Processors E6000 Series with 4 MB L2 Cache with 1066 MHz FSB ................................... 41
Processor Top-Side Markings Example for the Intel
®
Core™2 Duo Desktop
Processors E6000 Series with 2 MB L2 Cache ............................................................... 41
Processor Top-Side Markings Example for the Intel
®
Core™2 Duo Desktop
Processors E4000 Series with 2 MB L2 Cache ............................................................... 42
Processor Top-Side Markings for the Intel
®
Core™2 Extreme Processor X6800 ................. 42
Processor Land Coordinates and Quadrants (Top View) ................................................. 43
land-out Diagram (Top View – Left Side) ..................................................................... 46
land-out Diagram (Top View – Right Side) ................................................................... 47
Thermal Profile 1 ..................................................................................................... 79
Thermal Profile 2 ..................................................................................................... 80
Thermal Profile 3 ..................................................................................................... 81
Thermal Profile 4 ..................................................................................................... 82
Thermal Profile 5 ..................................................................................................... 83
Case Temperature (TC) Measurement Location ............................................................ 84
Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 86
Processor PECI Topology ........................................................................................... 90
Conceptual Fan Control on PECI-Based Platforms ......................................................... 91
Conceptual Fan Control on Thermal Diode-Based Platforms............................................ 91
Processor Low Power State Machine ........................................................................... 94
Mechanical Representation of the Boxed Processor ....................................................... 99
Space Requirements for the Boxed Processor (Side View)............................................ 100
Space Requirements for the Boxed Processor (Top View)............................................. 100
Space Requirements for the Boxed Processor (Overall View) ........................................ 101
Boxed Processor Fan Heatsink Power Cable Connector Description ................................ 102
Baseboard Power Header Placement Relative to Processor Socket ................................. 103
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................. 104
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)................. 104
Boxed Processor Fan Heatsink Set Points................................................................... 106
Mechanical Representation of the Boxed Processor with a Type I TMA ........................... 109
Mechanical Representation of the Boxed Processor with a Type II TMA .......................... 110
Requirements for the Balanced Technology Extended (BTX) Type I Keep-out
Volumes ............................................................................................................... 111
Requirements for the Balanced Technology Extended (BTX) Type II Keep-out
Volume................................................................................................................. 112
Assembly Stack Including the Support and Retention Module ....................................... 113
Boxed Processor TMA Power Cable Connector Description ............................................ 114
Balanced Technology Extended (BTX) Mainboard Power Header Placement
(hatched area) ...................................................................................................... 115
Boxed Processor TMA Set Points............................................................................... 117
Datasheet
5
京公网安备 11010802033920号
EEWORLD
