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330: DescriptionMULTICOMP - 330 - LAMP; INCANDESCENT; MIDGET FLANGE; 14V; 1.12W; CategoryLED optoelectronic/LED; File Size2MB，82 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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MULTICOMP - 330 - LAMP; INCANDESCENT; MIDGET FLANGE; 14V; 1.12W

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Intel

Celeron

D Processor 3xx

∆

Sequence

Datasheet

– On 90 nm Process in the 478-pin Package

June 2005

Document Number: 302353-005

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING

APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Celeron

D processors 3xx sequence on 90 nm process and in the 478-pin package may contain design defects or errors known as errata

which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across

different processor families. See www.intel.com/products/processor_number for details.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Celeron, Intel Xeon, Intel NetBurst and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in

the United States and other countries.

*Other names and brands may be claimed as the property of others.

∆

Datasheet

Contents

Introduction

................................................................................................................11

1.1

1.2

Terminology.........................................................................................................11

1.1.1 Processor Packaging Terminology.........................................................12

References ..........................................................................................................13

FSB and GTLREF ...............................................................................................15

Power and Ground Pins ......................................................................................15

Decoupling Guidelines ........................................................................................15

2.3.1 V

Decoupling ......................................................................................16

2.3.2 FSB GTL+ Decoupling ...........................................................................16

2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking....................................16

Voltage Identification ...........................................................................................17

2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................18

Reserved, Unused, and TESTHI Pins.................................................................19

FSB Signal Groups..............................................................................................20

Asynchronous GTL+ Signals...............................................................................21

Test Access Port (TAP) Connection....................................................................21

FSB Frequency Select Signals (BSEL[1:0]) ........................................................22

Absolute Maximum and Minimum Ratings ..........................................................22

Processor DC Specifications...............................................................................23

Overshoot Specification...............................................................................28

2.12.1 Die Voltage Validation ............................................................................29

GTL+ FSB Specifications ....................................................................................30

Package Mechanical Drawing .............................................................................31

Processor Component Keep-Out Zones .............................................................34

Package Loading Specifications .........................................................................34

Package Handling Guidelines .............................................................................35

Package Insertion Specifications ........................................................................35

Processor Mass Specification .............................................................................35

Processor Materials.............................................................................................35

Processor Markings.............................................................................................36

Processor Pinout Coordinates.............................................................................37

Processor Pin Assignments ................................................................................39

Alphabetical Signals Reference ..........................................................................54

Processor Thermal Specifications.......................................................................63

5.1.1 Thermal Specifications ...........................................................................63

5.1.2 Thermal Metrology .................................................................................64

Processor Thermal Features...............................................................................65

5.2.1 Thermal Monitor .....................................................................................65

5.2.2 On-Demand Mode..................................................................................65

Electrical Specifications

........................................................................................15

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

Package Mechanical Specifications

.................................................................31

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

Pin Listing and Signal Descriptions

.................................................................39

4.1

4.2

Thermal Specifications and Design Considerations

.................................63

5.1

5.2

Datasheet

5.2.3

5.2.4

5.2.5

5.2.6

PROCHOT# Signal Pin .......................................................................... 66

THERMTRIP# Signal Pin ....................................................................... 66

CONTROL

and Fan Speed Reduction (Optional) ................................... 67

Thermal Diode........................................................................................ 67

Features

....................................................................................................................... 69

6.1

6.2

Power-On Configuration Options ........................................................................ 69

Clock Control and Low Power States.................................................................. 69

6.2.1 Normal State—State 1 ........................................................................... 69

6.2.2 AutoHALT Powerdown State—State 2 .................................................. 70

6.2.3 Stop-Grant State—State 3 ..................................................................... 71

6.2.4 HALT/Grant Snoop State—State 4 ........................................................ 71

6.2.5 Sleep State—State 5.............................................................................. 72

Mechanical Specifications................................................................................... 74

7.1.1 Boxed Processor Cooling Solution Dimensions ..................................... 74

7.1.2 Boxed Processor Fan Heatsink Weight.................................................. 75

7.1.3 Boxed Processor Retention Mechanism and Heatsink

Attach Clip Assembly ............................................................................. 75

Electrical Requirements ...................................................................................... 76

7.2.1 Fan Heatsink Power Supply ................................................................... 76

Thermal Specifications........................................................................................ 77

7.3.1 Boxed Processor Cooling Requirements ............................................... 77

7.3.2 Variable Speed Fan ............................................................................... 79

Logic Analyzer Interface (LAI)............................................................................. 81

8.1.1 Mechanical Considerations .................................................................... 81

8.1.2 Electrical Considerations........................................................................ 81

Boxed Processor Specifications

....................................................................... 73

7.1

7.2

7.3

Debug Tools Specifications

................................................................................. 81

8.1

Datasheet

Figures

2-1

2-2

2-3

3-1

3-2

3-3

3-4

3-5

3-6

4-1

4-2

5-1

6-1

7-1

7-2

7-3

7-4

7-5

7-6

7-7

7-8

Phase Lock Loop (PLL) Filter Requirements ......................................................18

Static and Transient Tolerance....................................................................25

Overshoot Example Waveform....................................................................29

Processor Package Assembly Sketch.................................................................31

Processor Package Drawing (Sheet 1 of 2) ........................................................32

Processor Package Drawing (Sheet 2 of 2) ........................................................33

Processor Top-Side Marking Example (with Processor Number) .......................36

Processor Top-Side Marking Example................................................................36

Processor Pinout Coordinates (Top View) ..........................................................37

Pinout Diagram (Top View—Left Side) ...............................................................40

Pinout Diagram (Top View—Right Side) .............................................................41

Case Temperature (TC) Measurement Location.................................................64

Stop Clock State Machine ...................................................................................70

Mechanical Representation of the Boxed Intel

Celeron

D Processor .............73

Requirements for the Boxed Processor (Side View) ...........................................74

Space Requirements for the Boxed Processor (Top View).................................74

Boxed Processor Fan Heatsink Power Cable Connector Description.................76

Baseboard Power Header Placement Relative to Processor Socket..................77

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View) 78

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View) 78

Boxed Processor Fan Heatsink Set Points .........................................................79

Datasheet

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