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X7900: DescriptionCore2 Duo Processors and Core2 Extreme Processors for Platforms Based on Mobile 965 Express Chipset Family; File Size1MB，87 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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X7900 Overview

Core2 Duo Processors and Core2 Extreme Processors for Platforms Based on Mobile 965 Express Chipset Family

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Intel® Core™2 Duo Processors and

Intel® Core™2 Extreme Processors

for Platforms Based on Mobile Intel®

965 Express Chipset Family

Datasheet

January 2008

Document Number: 316745-005

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING

TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

Legal Lines and Disclaimers

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE

FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics

of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for

conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with

this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published

specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check

with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Enhanced Intel SpeedStep® Technology for specified units of this processor available Q2/06. See the Processor Spec Finder at http://

processorfinder.intel.com or contact your Intel representative for more information.

Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM) and, for some

uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations

and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

This device is protected by U.S. patent numbers 5,315,448 and 6,516,132, and other intellectual property rights. The use of Macrovision's copy

protection technology in the device must be authorized by Macrovision and is intended for home and other limited pay-per-view uses only, unless

otherwise authorized in writing by Macrovision. Reverse engineering or disassembly is prohibited.

64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications

enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel® 64 architecture-enabled BIOS.

Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information.

Intel, Pentium, Intel Core, Intel Core 2, Intel SpeedStep and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

Contents

Introduction

.............................................................................................................. 7

1.1

Terminology ....................................................................................................... 8

1.2

References ......................................................................................................... 9

Low Power Features

................................................................................................ 11

2.1

Clock Control and Low Power States .................................................................... 11

2.1.1 Core Low Power State Descriptions ........................................................... 13

2.1.2 Package Low Power State Descriptions ...................................................... 15

2.2

Enhanced Intel SpeedStep® Technology .............................................................. 18

2.2.1 Dynamic FSB Frequency Switching ........................................................... 19

2.2.2 Intel® Dynamic Acceleration Technology ................................................... 19

2.3

Extended Low Power States ................................................................................ 19

2.4

FSB Low Power Enhancements ............................................................................ 20

2.5

VID-x .............................................................................................................. 21

2.6

Processor Power Status Indicator (PSI-2) Signal .................................................... 21

Electrical Specifications

........................................................................................... 23

3.1

Power and Ground Pins ...................................................................................... 23

3.2

FSB Clock (BCLK[1:0]) and Processor Clocking ...................................................... 23

3.3

Voltage Identification ......................................................................................... 23

3.4

Catastrophic Thermal Protection .......................................................................... 26

3.5

Reserved and Unused Pins.................................................................................. 26

3.6

FSB Frequency Select Signals (BSEL[2:0])............................................................ 27

3.7

FSB Signal Groups............................................................................................. 27

3.8

CMOS Signals ................................................................................................... 29

3.9

Maximum Ratings.............................................................................................. 29

3.10 Processor DC Specifications ................................................................................ 30

Package Mechanical Specifications and Pin Information

.......................................... 41

4.1

Package Mechanical Specifications ....................................................................... 41

4.2

Processor Pinout and Pin List .............................................................................. 49

4.3

Alphabetical Signals Reference ............................................................................ 69

Thermal Specifications and Design Considerations

.................................................. 77

5.1

Thermal Specifications ....................................................................................... 80

5.1.1 Thermal Diode ....................................................................................... 81

5.1.2 Thermal Diode Offset .............................................................................. 83

5.1.3 Intel® Thermal Monitor........................................................................... 84

5.1.4 Digital Thermal Sensor............................................................................ 86

5.1.5 Out of Specification Detection .................................................................. 87

5.1.6 PROCHOT# Signal Pin ............................................................................. 87

Datasheet

Figures

Core Low Power States..............................................................................................12

Package Low Power States.........................................................................................13

Active VCC and ICC Loadline Intel Core 2 Duo Processors - Standard Voltage,

Low Voltage and Ultra Low Voltage and Intel Core 2 Extreme Processors |

(PSI# Not Asserted) .................................................................................................36

Deeper Sleep VCC and ICC Loadline Intel Core 2 Duo Processors -

Standard Voltage and Intel Core 2 Extreme Processors (PSI# Asserted)...........................37

Deeper Sleep VCC and ICC Loadline Intel Core 2 Duo Processor -

Low Voltage and Ultra Low Voltage (PSI# Asserted) ......................................................38

4-MB and Fused 2-MB Micro-FCPGA Processor Package Drawing (Sheet 1 of 2) .................42

4-MB and Fused 2-MB Micro-FCPGA Processor Package Drawing (Sheet 2 of 2) .................43

2-MB Micro-FCPGA Processor Package Drawing (Sheet 1 of 2) ........................................44

2-MB Micro-FCPGA Processor Package Drawing (Sheet 2 of 2) ........................................45

4-MB and Fused 2-MB Micro-FCBGA Processor Package Drawing (Sheet 1 of 2).................46

4-MB and Fused 2-MB Micro-FCBGA Processor Package Drawing (Sheet 2 of 2).................47

2-MB Micro-FCBGA Processor Package Drawing (Sheet 1 of 2) ........................................48

2-MB Micro-FCBGA Processor Package Drawing (Sheet 2 of 2) ........................................49

Tables

Coordination of Core Low Power States at the Package Level ..........................................13

Voltage Identification Definition ..................................................................................23

BSEL[2:0] Encoding for BCLK Frequency......................................................................27

FSB Pin Groups ........................................................................................................28

Processor Absolute Maximum Ratings..........................................................................29

Voltage and Current Specifications for the Intel Core 2 Duo Processors -

Standard Voltage......................................................................................................30

Voltage and Current Specifications for the Intel Core 2 Duo Processors -

Low Voltage.............................................................................................................32

Voltage and Current Specifications for the Intel Core 2 Duo -Ultra Low

Voltage Processors ...................................................................................................33

Voltage and Current Specifications for the Intel Core 2 Extreme Processors ......................34

FSB Differential BCLK Specifications ............................................................................38

AGTL+ Signal Group DC Specifications ........................................................................39

CMOS Signal Group DC Specifications..........................................................................40

Open Drain Signal Group DC Specifications ..................................................................40

The Coordinates of the Processor Pins as Viewed from the Top of the Package

(Sheet 1 of 2) ..........................................................................................................50

The Coordinates of the Processor Pins as Viewed from the Top of the Package

(Sheet 2 of 2) ..........................................................................................................51

Pin Listing by Pin Name .............................................................................................53

Pin Listing by Pin Number ..........................................................................................60

Signal Description.....................................................................................................69

Power Specifications for the Intel Core 2 Duo Processor - Standard Voltage ......................77

Power Specifications for the Intel Core 2 Duo Processor - Low Voltage .............................78

Power Specifications for the Intel Core 2 Duo Processor - Ultra Low Voltage .....................79

Power Specifications for the Intel Core 2 Extreme Processor ...........................................80

Thermal Diode Interface ............................................................................................81

Thermal Diode Parameters Using Diode Model ..............................................................82

Thermal Diode Parameters Using Transistor Model ........................................................83

Thermal Diode ntrim and Diode Correction Toffset ........................................................84

Datasheet

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