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MCM63Z819TQ15

Description
IC,SYNC SRAM,256KX18,CMOS,QFP,100PIN,PLASTIC
Categorystorage    storage   
File Size374KB,20 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MCM63Z819TQ15 Overview

IC,SYNC SRAM,256KX18,CMOS,QFP,100PIN,PLASTIC

MCM63Z819TQ15 Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codeunknown
ECCN code3A991
Maximum access time15 ns
Other featuresFLOW-THROUGH ARCHITECTURE
JESD-30 codeR-PQFP-G100
length20 mm
memory density4718592 bit
Memory IC TypeZBT SRAM
memory width18
Number of functions1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX18
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm
MOTOROLA
Freescale Semiconductor, Inc.
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MCM63Z737/D
128K x 36 and 256K x 18 Bit
Flow–Through ZBT™ RAM
Synchronous Fast Static RAM
MCM63Z737
MCM63Z819
Freescale Semiconductor, Inc...
The ZBT RAM is a 4M–bit synchronous fast static RAM designed to provide
Zero Bus Turnaround™. The ZBT RAM allows 100% use of bus cycles during
back–to–back read/write and write/read cycles. The MCM63Z737 (organized as
128K words by 36 bits) and the MCM63Z819 (organized as 256K words by 18
bits) are fabricated in Motorola’s high performance silicon gate CMOS
R,
technology. This device integrates input registers, a 2–bit address counter, and
TO
high speed SRAM onto a single monolithic circuit for reduced parts count in
UC
communication applications. Synchronous design allows precise cycle control
ND
with the use of an external clock (CK). CMOS circuitry reduces the overall power
CO
I
consumption of the integrated functions for greater reliability.
M
Addresses (SA), data inputs (DQ), and all control signals except output enable
SE
(G) and linear burst order (LBO) are clock (CK) controlled through positive–
LE
edge–triggered noninverting registers.
A
Write cycles are internally self–timed and are initiated by
C
rising edge of the
the
ES
clock (CK) input. This feature eliminates complex off–chip write pulse generation
and provides increased timing flexibility for incoming signals.
RE
F
For read cycles, a flow–through SRAM allows output data to simply flow freely
Y
B
from the memory array.
I
C.
N
TQ PACKAGE
TQFP
CASE 983A–01
E
3.3 V LVTTL and LVCMOS Compatible
IV
10 ns Access / 12 ns Cycle (83 MHz)
MCM63Z737/MCM63Z819–10 =
CH
MCM63Z737/MCM63Z819–11 = 11 ns Access / 15 ns Cycle (66 MHz)
AR
MCM63Z737/MCM63Z819–15 = 15 ns Access / 20 ns Cycle (50 MHz)
Selectable Burst Sequencing Order (Linear/Interleaved)
Internally Self–Timed Write Cycle
Single–Cycle Deselect
Byte Write Control
ADV Controlled Burst
100–Pin TQFP Package
D
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc., and the architecture is supported by
Micron Technology, Inc. and Motorola, Inc.
REV 5
1/14/00
©
Motorola, Inc. 2000
MOTOROLA FAST SRAM
For More Information On This Product,
Go to: www.freescale.com
MCM63Z737
D
MCM63Z819
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