EDI8L24512V12AC datasheet, PDF

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EDI8L24512V12AC: DescriptionSRAM Module, 512KX24, 12ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68; Categorystorage storage; File Size204KB，5 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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EDI8L24512V12AC Overview

SRAM Module, 512KX24, 12ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68

EDI8L24512V12AC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	White Electronic Designs Corporation
package instruction	PLASTIC, MO-47AE, LCC-68
Reach Compliance Code	unknown
Maximum access time	12 ns
I/O type	COMMON
JESD-30 code	S-PQCC-J68
JESD-609 code	e0
length	24.2316 mm
memory density	12582912 bit
Memory IC Type	SRAM MODULE
memory width	24
Number of functions	1
Number of terminals	68
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX24
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum standby current	0.03 A
Minimum standby current	3.14 V
Maximum slew rate	0.54 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	24.2316 mm

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Description	SRAM Module, 512KX24, 12ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX24, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX24, 17ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX24, 20ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX24, 15ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	PLASTIC, MO-47AE, LCC-68	PLASTIC, MO-47AE, LCC-68	PLASTIC, MO-47AE, LCC-68	PLASTIC, MO-47AE, LCC-68	PLASTIC, MO-47AE, LCC-68
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Maximum access time	12 ns	20 ns	17 ns	20 ns	15 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68
JESD-609 code	e0	e0	e0	e0	e0
length	24.2316 mm	24.2316 mm	24.2316 mm	24.2316 mm	24.2316 mm
memory density	12582912 bit	12582912 bit	12582912 bit	12582912 bit	12582912 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	24	24	24	24	24
Number of functions	1	1	1	1	1
Number of terminals	68	68	68	68	68
word count	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	85 °C	85 °C
organize	512KX24	512KX24	512KX24	512KX24	512KX24
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ	LDCC68,1.0SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm
Maximum standby current	0.03 A	0.03 A	0.03 A	0.03 A	0.03 A
Minimum standby current	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V
Maximum slew rate	0.54 mA	0.48 mA	0.48 mA	0.48 mA	0.54 mA
Maximum supply voltage (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	24.2316 mm	24.2316 mm	24.2316 mm	24.2316 mm	24.2316 mm
Maker	White Electronic Designs Corporation	White Electronic Designs Corporation	-	White Electronic Designs Corporation	White Electronic Designs Corporation

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