NMC27C16Q55/883 datasheet, PDF

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NMC27C16Q55/883: DescriptionIC,EPROM,2KX8,CMOS,DIP,24PIN,CERAMIC; Categorystorage storage; File Size483KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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NMC27C16Q55/883 Overview

IC,EPROM,2KX8,CMOS,DIP,24PIN,CERAMIC

NMC27C16Q55/883 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknow
Maximum access time	550 ns
I/O type	COMMON
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	16384 bi
Memory IC Type	OTP ROM
memory width	8
Number of terminals	24
word count	2048 words
character code	2000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

NMC27C16Q55/883 Related Products

	NMC27C16Q55/883	NMC27C16Q45/883	NMC27C16Q55/883C	NMC27C16Q55/883B	NMC27C16BQ-35	NMC27C16BQE-35
Description	IC,EPROM,2KX8,CMOS,DIP,24PIN,CERAMIC	IC,EPROM,2KX8,CMOS,DIP,24PIN,CERAMIC	IC,EPROM,2KX8,CMOS,DIP,24PIN,CERAMIC	IC,EPROM,2KX8,CMOS,DIP,24PIN,CERAMIC	IC,EPROM,2KX8,CMOS,DIP,24PIN,CERAMIC	IC,EPROM,2KX8,CMOS,DIP,24PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	unknow	unknow	unknow	unknow	unknown	unknown
Maximum access time	550 ns	450 ns	550 ns	550 ns	350 ns	350 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	16384 bi	16384 bi	16384 bi	16384 bi	16384 bit	16384 bit
memory width	8	8	8	8	8	8
Number of terminals	24	24	24	24	24	24
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	85 °C
organize	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	-	-
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	MIL-STD-883 Class C	38535Q/M;38534H;883B	-	-
Base Number Matches	1	1	1	1	-	-

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