S-29255AFEG datasheet, PDF - EEWORLD Datasheet

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S-29255AFEG: DescriptionEEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8; Categorystorage storage; File Size224KB，17 Pages; ManufacturerABLIC; Environmental Compliance

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S-29255AFEG Overview

EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8

S-29255AFEG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ABLIC
Parts packaging code	SOIC
package instruction	LSOP,
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	DATA RETENTION: 10 YEARS
Maximum clock frequency (fCLK)	2 MHz
Data retention time - minimum	10
JESD-30 code	R-PDSO-G8
JESD-609 code	e2
length	5.2 mm
memory density	2048 bit
Memory IC Type	EEPROM
memory width	16
Number of functions	1
Number of terminals	8
word count	128 words
character code	128
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128X16
Package body material	PLASTIC/EPOXY
encapsulated code	LSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.7 mm
Serial bus type	MICROWIRE
Maximum supply voltage (Vsup)	6.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver (Sn/Ag)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	10
width	4.4 mm
Maximum write cycle time (tWC)	10 ms

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Contents

Features ...........................................................1

Pin Assignment ................................................1

Block Diagram..................................................1

Instruction Set ..................................................2

Absolute Maximum Ratings .............................2

Recommended Operating Conditions..............2

Pin Capacitance ...............................................3

DC Electrical Characteristics............................3

AC Electrical Characteristics............................4

Operation .........................................................5

Three-wire Interface

•DI-DO

Direct Connecting...........................8

Ordering Information ........................................9

Characteristics ...............................................10

Dimensions ....................................................14

Rewriting Times ...............................................2

S-29255AFEG Related Products

	S-29255AFEG	S-29355AFEG	S-29255ACAG	S-29255ADPG	S-29355ACAG
Description	EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8	EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8	EEPROM, 128X16, Serial, CMOS, DIE	EEPROM, 128X16, Serial, CMOS, PDIP8, DIP-8	EEPROM, 256X16, Serial, CMOS, DIE
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Maker	ABLIC	ABLIC	ABLIC	ABLIC	ABLIC
Parts packaging code	SOIC	SOIC	DIE	DIP	DIE
package instruction	LSOP,	LSOP,	DIE,	DIP,	DIE,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Other features	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS
Maximum clock frequency (fCLK)	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz
Data retention time - minimum	10	10	10	10	10
JESD-30 code	R-PDSO-G8	R-PDSO-G8	X-XUUC-N	R-PDIP-T8	X-XUUC-N
memory density	2048 bit	4096 bit	2048 bit	2048 bit	4096 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	16	16	16	16	16
Number of functions	1	1	1	1	1
word count	128 words	256 words	128 words	128 words	256 words
character code	128	256	128	128	256
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	128X16	256X16	128X16	128X16	256X16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	LSOP	LSOP	DIE	DIP	DIE
Package shape	RECTANGULAR	RECTANGULAR	UNSPECIFIED	RECTANGULAR	UNSPECIFIED
Package form	SMALL OUTLINE, LOW PROFILE	SMALL OUTLINE, LOW PROFILE	UNCASED CHIP	IN-LINE	UNCASED CHIP
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Serial bus type	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE
Maximum supply voltage (Vsup)	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	NO LEAD	THROUGH-HOLE	NO LEAD
Terminal location	DUAL	DUAL	UPPER	DUAL	UPPER
Maximum time at peak reflow temperature	10	10	10	10	10
Maximum write cycle time (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms
Contacts	8	8	-	8	-
length	5.2 mm	5.2 mm	-	9.3 mm	-
Number of terminals	8	8	-	8	-
Maximum seat height	1.7 mm	1.7 mm	-	4.5 mm	-
Terminal pitch	1.27 mm	1.27 mm	-	2.54 mm	-
width	4.4 mm	4.4 mm	-	7.62 mm	-

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