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IDM2911ADC

Description
4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size337KB,10 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

IDM2911ADC Overview

4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20

IDM2911ADC Parametric

Parameter NameAttribute value
package instructionDIP,
Reach Compliance Codeunknow
External data bus width4
JESD-30 codeR-GDIP-T20
length24.51 mm
Number of terminals20
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum slew rate130 mA
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
uPs/uCs/peripheral integrated circuit typeBIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Base Number Matches1

IDM2911ADC Related Products

IDM2911ADC IDM2909ADC IDM2909ADM IDM2909ADM/883 IDM2911ADM IDM2911ADM/883
Description 4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20 4-BIT, MICROPROGRAM SEQUENCER, CDIP28, HERMETIC SEALED, DIP-28 4-BIT, MICROPROGRAM SEQUENCER, CDIP28, HERMETIC SEALED, DIP-28 4-BIT, MICROPROGRAM SEQUENCER, CDIP28, HERMETIC SEALED, DIP-28 4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20 4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20
package instruction DIP, DIP, DIP, DIP, DIP, DIP,
Reach Compliance Code unknow unknow unknown unknown unknow unknow
External data bus width 4 4 4 4 4 4
JESD-30 code R-GDIP-T20 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-GDIP-T20 R-GDIP-T20
Number of terminals 20 28 28 28 20 20
Maximum operating temperature 70 °C 70 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - - -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DIP DIP DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 5.715 mm 5.715 mm 5.715 mm 5.08 mm 5.08 mm
Maximum slew rate 130 mA 130 mA 130 mA 130 mA 130 mA 130 mA
Maximum supply voltage 5.25 V 5.25 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.75 V 4.75 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO
technology TTL TTL TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL MILITARY MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
width 7.62 mm 15.24 mm 15.24 mm 15.24 mm 7.62 mm 7.62 mm
uPs/uCs/peripheral integrated circuit type BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Maker - - Texas Instruments Texas Instruments Texas Instruments Texas Instruments
ECCN code - - 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
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