4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20
| Parameter Name | Attribute value |
| package instruction | DIP, |
| Reach Compliance Code | unknow |
| External data bus width | 4 |
| JESD-30 code | R-GDIP-T20 |
| length | 24.51 mm |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum slew rate | 130 mA |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
| Base Number Matches | 1 |
| IDM2911ADC | IDM2909ADC | IDM2909ADM | IDM2909ADM/883 | IDM2911ADM | IDM2911ADM/883 | |
|---|---|---|---|---|---|---|
| Description | 4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20 | 4-BIT, MICROPROGRAM SEQUENCER, CDIP28, HERMETIC SEALED, DIP-28 | 4-BIT, MICROPROGRAM SEQUENCER, CDIP28, HERMETIC SEALED, DIP-28 | 4-BIT, MICROPROGRAM SEQUENCER, CDIP28, HERMETIC SEALED, DIP-28 | 4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20 | 4-BIT, MICROPROGRAM SEQUENCER, CDIP20, HERMETIC SEALED, DIP-20 |
| package instruction | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
| Reach Compliance Code | unknow | unknow | unknown | unknown | unknow | unknow |
| External data bus width | 4 | 4 | 4 | 4 | 4 | 4 |
| JESD-30 code | R-GDIP-T20 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T20 | R-GDIP-T20 |
| Number of terminals | 20 | 28 | 28 | 28 | 20 | 20 |
| Maximum operating temperature | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | - | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.08 mm | 5.08 mm |
| Maximum slew rate | 130 mA | 130 mA | 130 mA | 130 mA | 130 mA | 130 mA |
| Maximum supply voltage | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 7.62 mm | 15.24 mm | 15.24 mm | 15.24 mm | 7.62 mm | 7.62 mm |
| uPs/uCs/peripheral integrated circuit type | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
| Maker | - | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| ECCN code | - | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |