W681310WG datasheet, PDF - EEWORLD Datasheet

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W681310WG: DescriptionIC,PCM CODEC,SINGLE,TSSOP,20PIN,PLASTIC; CategoryWireless rf/communication Telecom circuit; File Size294KB，38 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W681310WG Overview

IC,PCM CODEC,SINGLE,TSSOP,20PIN,PLASTIC

W681310WG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	TSSOP
package instruction	TSSOP, TSSOP20,.25
Contacts	20
Reach Compliance Code	unknow
Law of compression and extension	A/MU-LAW
filter	YES
Maximum gain tolerance	1.6 dB
JESD-30 code	R-PDSO-G20
length	6.5 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	20
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP20,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum slew rate	0.005 mA
Nominal supply voltage	3 V
surface mount	YES
Telecom integrated circuit types	PCM CODEC
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	4.4 mm

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W681310

3V SINGLE-CHANNEL VOICEBAND CODEC

Data Sheet

-1-

Publication Release Date: April 2007

Revision B14

W681310

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM .............................................................................................................................. 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 6

6. PIN DESCRIPTION ............................................................................................................................. 7

7. FUNCTIONAL DESCRIPTION............................................................................................................ 8

7.1. Transmit Path ................................................................................................................................ 8

7.2. Receive Path ................................................................................................................................. 9

7.3. Power Management....................................................................................................................... 9

7.3.1. Analog and Digital Supply ..................................................................................................... 10

7.3.2. Analog Ground Reference Bypass .......................................................................................10

7.3.3. Analog Ground Reference Voltage Outpt .............................................................................10

7.4. PCM INTERFACE ....................................................................................................................... 10

7.4.1. Long Frame Sync.................................................................................................................. 11

7.4.2. Short Frame Sync ................................................................................................................. 11

7.4.3. General Circuit Interface (GCI) ............................................................................................. 11

7.4.4. Interchip Digital Link (IDL)..................................................................................................... 12

7.4.5. System Timing ...................................................................................................................... 12

8. TIMING DIAGRAMS.......................................................................................................................... 13

9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 20

9.1. Absolute Maximum Ratings ......................................................................................................... 20

9.2. Operating Conditions ................................................................................................................... 20

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 21

10.1. General Parameters .................................................................................................................. 21

10.2. Analog Signal Level and Gain Parameters ...............................................................................22

10.3. Analog Distortion and Noise Parameters ..................................................................................23

10.4. Analog Input and Output Amplifier Parameters.........................................................................24

10.5. DIGITAL I/O ............................................................................................................................... 26

10.5.1.

μ-Law

Encode Decode Characteristics...............................................................................26

10.5.2. A-Law Encode Decode Characteristics ..............................................................................27

10.5.3. PCM Codes for Zero and Full Scale ...................................................................................28

10.5.4. PCM Codes for 0dBm0 Output ...........................................................................................28

11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 29

12. PACKAGE SPECIFICATION .......................................................................................................... 31

-4-

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Description	IC,PCM CODEC,SINGLE,TSSOP,20PIN,PLASTIC	IC,PCM CODEC,SINGLE,SSOP,20PIN,PLASTIC	IC,PCM CODEC,SINGLE,SSOP,20PIN,PLASTIC	IC,PCM CODEC,SINGLE,SOP,20PIN,PLASTIC	IC,PCM CODEC,SINGLE,SSOP,20PIN,PLASTIC	IC,PCM CODEC,SINGLE,SSOP,20PIN,PLASTIC	IC,PCM CODEC,SINGLE,SSOP,20PIN,PLASTIC
Is it Rohs certified?	conform to	-	conform to	conform to	incompatible	incompatible	-
Maker	Winbond Electronics Corporation	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	-
Parts packaging code	TSSOP	-	SSOP	SOIC	SSOP	SOIC	-
package instruction	TSSOP, TSSOP20,.25	-	SSOP, SSOP20,.3	SOP, SOP20,.4	0.209 INCH, PLASTIC, SSOP-20	0.300 INCH, PLASTIC, SOP-20	-
Contacts	20	-	20	20	20	20	-
Reach Compliance Code	unknow	-	unknow	unknow	_compli	_compli	-
Law of compression and extension	A/MU-LAW	-	A/MU-LAW	A/MU-LAW	A/MU-LAW	A/MU-LAW	-
filter	YES	-	YES	YES	YES	YES	-
Maximum gain tolerance	1.6 dB	-	1.6 dB	1.6 dB	1.6 dB	1.6 dB	-
JESD-30 code	R-PDSO-G20	-	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	-
length	6.5 mm	-	7.2 mm	12.8 mm	7.2 mm	12.8 mm	-
Number of functions	1	-	1	1	1	1	-
Number of terminals	20	-	20	20	20	20	-
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-
Maximum operating temperature	85 °C	-	85 °C	85 °C	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TSSOP	-	SSOP	SOP	SSOP	SOP	-
Encapsulate equivalent code	TSSOP20,.25	-	SSOP20,.3	SOP20,.4	SSOP20,.3	SOP20,.4	-
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	-
Peak Reflow Temperature (Celsius)	260	-	260	260	NOT SPECIFIED	NOT SPECIFIED	-
power supply	3/5 V	-	3/5 V	3/5 V	3/5 V	3/5 V	-
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	1.2 mm	-	2 mm	2.65 mm	2 mm	2.65 mm	-
Maximum slew rate	0.005 mA	-	0.005 mA	0.005 mA	0.005 mA	0.005 mA	-
Nominal supply voltage	3 V	-	3 V	3 V	3 V	3 V	-
surface mount	YES	-	YES	YES	YES	YES	-
Telecom integrated circuit types	PCM CODEC	-	PCM CODEC	PCM CODEC	PCM CODEC	PCM CODEC	-
Temperature level	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal form	GULL WING	-	GULL WING	GULL WING	GULL WING	GULL WING	-
Terminal pitch	0.65 mm	-	0.65 mm	1.27 mm	0.65 mm	1.27 mm	-
Terminal location	DUAL	-	DUAL	DUAL	DUAL	DUAL	-
Maximum time at peak reflow temperature	40	-	40	40	NOT SPECIFIED	NOT SPECIFIED	-
width	4.4 mm	-	5.3 mm	7.5 mm	5.3 mm	7.5 mm	-

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