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MCM63Z836TQ8

Description
256K x 36 and 512K x 18 Bit ZBT Fast Static RAM
Categorystorage    storage   
File Size480KB,36 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MCM63Z836TQ8 Overview

256K x 36 and 512K x 18 Bit ZBT Fast Static RAM

MCM63Z836TQ8 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time8 ns
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density9437184 bi
Memory IC TypeZBT SRAM
memory width36
Number of functions1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX36
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
MOTOROLA
Freescale Semiconductor, Inc.
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MCM63Z836/D
Product Preview
256K x 36 and 512K x 18 Bit
ZBT
r
Fast Static RAM
MCM63Z836
MCM63Z918
Freescale Semiconductor, Inc...
The ZBT RAM is an 8M–bit synchronous fast static RAM designed to provide
Zero Bus Turnaround
r
. The ZBT RAM allows 100% use of bus cycles during
back–to–back read/write and write/read cycles. The MCM63Z836 (organized as
256K words by 36 bits) and the MCM63Z918 (organized as 512K words by 18
bits) are fabricated in Motorola’s high performance silicon gate CMOS tech-
nology. This device integrates input registers, an output register, a 2–bit address
counter, and high speed SRAM onto a single monolithic circuit for reduced parts
count in communication applications. Synchronous design allows precise cycle
control with the use of an external positive–edge–triggered clock (CK). CMOS
circuitry reduces the overall power consumption of the integrated functions for
greater reliability.
Addresses (SA), data inputs (DQ), and all control signals except output enable
(G) and linear burst order (LBO) are clock (CK) controlled through positive–
edge–triggered noninverting registers.
Write cycles are internally self–timed and are initiated by the rising edge of the
clock (CK) input. This feature eliminates complex off–chip write pulse generation
and provides increased timing flexibility for incoming signals. Write data is
supplied to the memory one cycle after the write sequence initiation for the flow–
through device, and two cycles after the write sequence initiation for the pipelined
device.
For flow–through read cycles, the SRAM allows output data to simply flow freely from the memory
array. For pipelined read cycles, the SRAM output data is temporarily stored by an edge–triggered
output register and then released to the output buffers at the next rising edge of clock (CK).
The MCM63Z836 and MCM63Z918 operate from a 3.3 V core power supply and all outputs oper-
ate on a 2.5 V or 3.3 V power supply. All inputs and outputs are JEDEC Standard JESD8–A and
JESD8–5 compatible.
3.3 V
±5%
Core Power Supply, 2.5 V or 3.3 V I/O Supply
MCM63Z836 / 918–7 = 7 ns Flow–Through Access / 2.6 ns Pipelined Access (225 MHz)
MCM63Z836 / 918–8 = 8 ns Flow–Through Access / 3 ns Pipelined Access (200 MHz)
MCM63Z836 / 918–8.5 = 8.5 ns Flow–Through Access / 3.5 ns Pipelined Access (166 MHz)
Selectable Read/Write Functionality (Flow–Through/Pipelined)
Selectable Burst Sequencing Order (Linear/Interleaved)
Internally Self–Timed Write Cycle
Two–Cycle Deselect (Pipelined)
Byte Write Control
ADV Controlled Burst
Simplified JTAG
100–Pin TQFP and 119–Bump PBGA Packages
TQ PACKAGE
TQFP
CASE 983A–01
ZP PACKAGE
PBGA
CASE 999–02
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc., and the architecture is supported by
Micron Technology, Inc. and Motorola, Inc.
This document contains information on a new product under development. Motorola reserves the right to change or discontinue this product without notice.
REV 4
12/20/99
©
Motorola, Inc. 1999
MOTOROLA FAST SRAM
For More Information On This Product,
Go to: www.freescale.com
MCM63Z836•MCM63Z918
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