73
Spartan-6 FPGA Data Sheet:
DC and Switching Characteristics
DS162 (v1.9) August 23, 2010
Advance Product Specification
Spartan-6 FPGA Electrical Characteristics
Spartan®-6 LX FPGAs are available in -3, -2, and -1L speed grades, with -3 having the highest performance. Spartan-6 LXT
FPGAs are available in -4, -3, and -2 speed grades, with -4 having the highest performance. Spartan-6 FPGA DC and AC
characteristics are specified for both commercial and industrial grades. Except the operating temperature range or unless
otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing
characteristics of a -2 speed grade industrial device are the same as for a -2 speed grade commercial device). However, only
selected speed grades and/or devices might be available in the industrial range. The -3N speed grade, designated for
Spartan-6 devices that do not support memory controller block (MCB) functionality, has identical timing characteristics to the
-3 speed grade.
All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters
included are common to popular designs and typical applications.
This Spartan-6 FPGA data sheet, part of an overall set of documentation on the Spartan-6 family of FPGAs, is available on
the Xilinx website.
All specifications are subject to change without notice.
Spartan-6 FPGA DC Characteristics
Table 1:
Absolute Maximum Ratings
(1)
Symbol
V
CCINT
V
CCAUX
V
CCO
V
BATT
V
FS
V
REF
Description
Internal supply voltage relative to GND
Auxiliary supply voltage relative to GND
Output drivers supply voltage relative to GND
Key memory battery backup supply (XC6SLX75, XC6SLX75T, XC6SLX100, XC6SLX100T,
XC6SLX150, and XC6SLX150T only)
External voltage supply for eFUSE programming (XC6SLX75, XC6SLX75T, XC6SLX100,
XC6SLX100T, XC6SLX150, and XC6SLX150T only)
(2)
Input reference voltage
DC
Commercial 20% overshoot duration
All user and dedicated
I/Os
Industrial
I/O input voltage or voltage
applied to 3-state output,
relative to GND
(4)
Restricted to
maximum of 100 user
I/Os
Industrial
8% overshoot duration
(5)
DC
20% overshoot duration
4% overshoot duration
(5)
20% overshoot duration
Commercial 15% overshoot duration
(5)
10% overshoot duration
20% overshoot duration
10% overshoot duration
8% overshoot duration
(5)
–0.5 to 1.32
–0.5 to 3.75
–0.5 to 3.75
–0.5 to 4.05
–0.5 to 3.75
–0.5 to 3.75
–0.60 to 4.10
–0.75 to 4.25
–0.75 to 4.40
–0.60 to 3.95
–0.75 to 4.15
–0.75 to 4.40
–0.75 to 4.35
–0.75 to 4.40
–0.75 to 4.45
–0.75 to 4.25
–0.75 to 4.35
–0.75 to 4.40
Units
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
IN
and V
TS(3)
© 2009–2010 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other
countries. All other trademarks are the property of their respective owners.
DS162 (v1.9) August 23, 2010
Advance Product Specification
www.xilinx.com
1
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
Table 1:
Absolute Maximum Ratings
(1)
(Cont’d)
Symbol
T
STG
Description
Storage temperature (ambient)
Maximum soldering temperature
(6)
(TQG144, CPG196, CSG225, CSG324, CSG484, and FTG256)
–65 to 150
+260
+250
+220
+125
Units
°C
°C
°C
°C
°C
T
SOL
Maximum soldering temperature
(6)
(Pb-free packages: FGG484, FGG676, and FGG900)
Maximum soldering temperature
(6)
(Pb packages: FT256, FG484, FG676, and FG900)
Maximum junction temperature
(6)
T
j
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to
Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. When programming eFUSE, V
FS
≤
V
CCAUX
. Requires up to 40 mA current. For read mode, V
FS
can be between GND and 3.45 V.
3. I/O absolute maximum limit applied to DC and AC signals. Overshoot duration is the percentage of a data period that the I/O is stressed beyond
3.45V.
4. For I/O operation, refer to the
Spartan-6 FPGA SelectIO Resources User Guide.
5. Maximum percent overshoot duration to meet 4.40V maximum.
6. For soldering guidelines and thermal considerations, see
Spartan-6 FPGA Packaging and Pinout Specification.
Table 2:
Recommended Operating Conditions
(1)
Symbol
Description
Internal supply voltage relative to GND,
T
j
= 0°C to +85°C
V
CCINT
Temperature
Range
Commercial
Speed
Grade
-4, -3, -2
Memory
Controller
Block
(2)
Performance
standard
extended
Min
1.14
1.2
0.95
1.14
1.2
0.95
Typ
1.2
1.23
1.0
1.2
1.23
1.0
Max
1.26
1.26
1.05
1.26
1.26
1.05
Units
V
V
V
V
V
V
-1L
Internal supply voltage relative to GND,
T
j
= –40°C to +100°C
Industrial
-3, -2
standard
standard
extended
-1L
Auxiliary supply voltage relative to GND
when V
CCAUX
= 2.5V, T
j
= 0°C to +85°C
Auxiliary supply voltage relative to GND
when V
CCAUX
= 2.5V, T
j
= –40°C to
+100°C
Auxiliary supply voltage relative to GND
when V
CCAUX
= 3.3V, T
j
= 0°C to +85°C
Auxiliary supply voltage relative to GND
when V
CCAUX
= 3.3V, T
j
= –40°C to
+100°C
Output supply voltage relative to GND,
T
j
= 0°C to +85°C
Output supply voltage relative to GND,
T
j
= –40°C to +100°C
Input voltage relative to GND, T
j
= 0°C to
+85°C
Input voltage relative to GND, T
j
= –40°C
to +100°C
Input voltage relative to GND, PCI I/O
standard, T
j
= 0°C to +85°C
Input voltage relative to GND, PCI I/O
standard, T
j
= –40°C to +100°C
Commercial
Industrial
-4, -3, -2,
-1L
-3, -2, -1L
standard
N/A
N/A
2.375
2.5
2.625
V
V
CCAUX(3)
Commercial
Industrial
-4, -3, -2,
-1L
-3, -2, -1L
N/A
N/A
3.15
3.3
3.45
V
Commercial
Industrial
Commercial
Industrial
Commercial
Industrial
V
CCO(4)(5)(6)
-4, -3, -2,
-1L
-3, -2, -1L
-4, -3, -2,
-1L
-3, -2, -1L
-4, -3, -2,
-1L
(7)
-3, -2,
-1L
(7)
N/A
N/A
N/A
N/A
N/A
N/A
1.1
–
3.45
V
–0.5
–0.5
–0.5
–0.5
–
–
–
–
4.0
3.95
V
CCO
+
0.5
V
CCO
+
0.5
V
V
V
V
V
IN
DS162 (v1.9) August 23, 2010
Advance Product Specification
www.xilinx.com
2
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
Table 2:
Recommended Operating Conditions
(1)
(Cont’d)
Symbol
Description
Maximum current through pin using PCI
I/O standard when forward biasing the
clamp diode.
Temperature
Range
Commercial
Industrial
Commercial
Speed
Grade
-4, -3, -2,
-1L
(7)
-3, -2,
-1L
(7)
-4, -3, -2,
-1L
Memory
Controller
Block
(2)
Performance
N/A
N/A
N/A
Min
Typ
Max
Units
–
–
–
–
10
10
mA
mA
I
IN
(8)
V
BATT(9)
Battery voltage relative to GND, T
j
= 0°C
to +85°C
(XC6SLX75, XC6SLX75T, XC6SLX100,
XC6SLX100T, XC6SLX150, and
XC6SLX150T only)
Battery voltage relative to GND,
T
j
= –40°C to +100°C (XC6SLX75,
XC6SLX75T, XC6SLX100,
XC6SLX100T, XC6SLX150, and
XC6SLX150T only)
Industrial
-3, -2, -1L
N/A
1.0
–
3.6
V
Notes:
1. All voltages are relative to ground.
2. See
Interface Performances for Memory Interfaces
in
Table 25.
The standard V
CCINT
voltage range applies to designs not using an MCB, or to devices
that do not support MCB functionality including the LX4 device, the TQG144 and CPG196 packages, and the -3N speed grade.
3.
Recommended maximum voltage droop for V
CCAUX
is 10 mV/ms.
4. Configuration data is retained even if V
CCO
drops to 0V.
5. Includes V
CCO
of 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V.
6. For PCI systems, the transmitter and receiver should have common supplies for V
CCO
.
7. Devices with a -1L speed grade do not support Xilinx PCI IP.
8. Do not exceed a total of 100 mA per bank.
9. V
BATT
is required to maintain the battery backed RAM (BBR) AES key when V
CCAUX
is not applied. Once V
CCAUX
is applied, V
BATT
can be
unconnected. When BBR is not used, Xilinx recommends connecting to V
CCAUX
or GND. However, V
BATT
can be unconnected.
Table 3:
eFUSE Programming Conditions
(1)
Symbol
V
FS(2)
I
FS
V
CCAUX
V
CCINT
t
j
External voltage supply
V
FS
supply current
Auxiliary supply voltage relative to GND
Description
Min
3.2
–
3.2
1129
1.14
15
Typ
3.3
–
3.3
1140
1.2
–
Max
3.4
40
3.45
1151
1.26
85
Units
V
mA
V
Ω
V
°C
R
FUSE(3)
External resistor from R
FUSE
pin to GND
Internal supply voltage relative to GND
Temperature range
Notes:
1. These specifications apply during programming of the eFUSE AES key. Programming is only supported through JTAG.The AES key is only supported
in the following devices: XC6SLX75, XC6SLX75T, XC6SLX100, XC6SLX100T, XC6SLX150, and XC6SLX150T.
2. When programming eFUSE, V
FS
must be less than or equal to V
CCAUX
. When not programming or when eFUSE is not used, Xilinx recommends
connecting V
FS
to GND. However, V
FS
can be between GND and 3.45 V.
3. An R
FUSE
resistor is required when programming the eFUSE AES key. When not programming or when eFUSE is not used, Xilinx recommends
connecting the R
FUSE
pin to V
CCAUX
or GND. However, R
FUSE
can be unconnected.
DS162 (v1.9) August 23, 2010
Advance Product Specification
www.xilinx.com
3
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
Table 4:
DC Characteristics Over Recommended Operating Conditions
Symbol
V
DRINT
V
DRAUX
I
REF
I
L
Description
Data retention V
CCINT
voltage (below which configuration data might be lost)
Data retention V
CCAUX
voltage (below which configuration data might be lost)
V
REF
leakage current per pin
Input or output leakage current per pin (sample-tested)
Leakage current on pins during hot
socketing with FPGA unpowered
Die input capacitance at the pad
Pad pull-up (when selected) @ V
IN
= 0V, V
CCO
= 3.3V or V
CCAUX
= 3.3V
Pad pull-up (when selected) @ V
IN
= 0V, V
CCO
= 2.5V or V
CCAUX
= 2.5V
All pins except PROGRAM_B, DONE, and
JTAG pins when HSWAPEN = 1
PROGRAM_B, DONE, and JTAG pins, or other
pins when HSWAPEN = 0
Min
0.8
2.0
–10
–10
–20
Typ
–
–
–
–
–
I
HS
+ I
RPU
Max
–
–
10
10
20
Units
V
V
µA
µA
µA
µA
I
HS
C
IN
–
200
120
60
40
12
200
140
–
–
23
39
56
–
–
–
–
–
–
–
–
–
100
25
50
75
10
500
350
200
150
100
550
400
150
–
55
72
109
pF
µA
µA
µA
µA
µA
µA
µA
nA
Ω
Ω
Ω
Ω
I
RPU
Pad pull-up (when selected) @ V
IN
= 0V, V
CCO
= 1.8V
Pad pull-up (when selected) @ V
IN
= 0V, V
CCO
= 1.5V
Pad pull-up (when selected) @ V
IN
= 0V, V
CCO
= 1.2V
Pad pull-down (when selected) @ V
IN
= V
CCO
, V
CCAUX
= 3.3V
Pad pull-down (when selected) @ V
IN
= V
CCO
, V
CCAUX
= 2.5V
Battery supply current
Resistance of optional input differential termination circuit, V
CCAUX
= 3.3V
Thevenin equivalent resistance of programmable input termination
(UNTUNED_SPLIT_25)
I
RPD
I
BATT(1)
R
DT(2)
R
IN_TERM(4)
Thevenin equivalent resistance of programmable input termination
(UNTUNED_SPLIT_50)
Thevenin equivalent resistance of programmable input termination
(UNTUNED_SPLIT_75)
Notes:
1. Maximum value specified for worst case process at 25°C. XC6SLX75, XC6SLX75T, XC6SLX100, XC6SLX100T, XC6SLX150, and XC6SLX150T
only.
2. Refer to IBIS models for R
DT
variation and for values at V
CCAUX
= 2.5V.
3. V
CCO2
is not required for data retention. The minimum V
CCO2
for power-on reset and configuration is 1.65V.
4. Termination resistance to a V
CCO
/2 level.
DS162 (v1.9) August 23, 2010
Advance Product Specification
www.xilinx.com
4
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
Quiescent Current
Typical values for quiescent supply current are specified at nominal voltage, 25°C junction temperatures (T
j
). Quiescent
supply current is specified by speed grade for Spartan-6 devices. Xilinx recommends analyzing static power consumption
using the XPOWER™ Estimator (XPE) tool (download at
http://www.xilinx.com/power)
for conditions other than those
specified in
Table 5.
Table 5:
Typical Quiescent Supply Current
Symbol
I
CCINTQ
Description
Quiescent V
CCINT
supply current
Device
XC6SLX4
XC6SLX9
XC6SLX16
XC6SLX25
XC6SLX25T
XC6SLX45
XC6SLX45T
XC6SLX75
XC6SLX75T
XC6SLX100
XC6SLX100T
XC6SLX150
XC6SLX150T
Speed Grade
-4
N/A
N/A
N/A
N/A
11.0
N/A
15.0
N/A
29.0
N/A
36.0
N/A
51.0
N/A
N/A
N/A
N/A
2.0
N/A
3.0
N/A
4.0
N/A
5.0
N/A
7.0
-3
4.0
4.0
6.0
11.0
11.0
15.0
15.0
29.0
29.0
36.0
36.0
51.0
51.0
1.0
1.0
2.0
2.0
2.0
3.0
3.0
4.0
4.0
5.0
5.0
7.0
7.0
-2
4.0
4.0
6.0
11.0
11.0
15.0
15.0
29.0
29.0
36.0
36.0
51.0
51.0
1.0
1.0
2.0
2.0
2.0
3.0
3.0
4.0
4.0
5.0
5.0
7.0
7.0
-1L
2.4
2.4
4.0
6.6
N/A
9.0
N/A
17.4
N/A
21.6
N/A
31.0
N/A
1.0
1.0
2.0
2.0
N/A
3.0
N/A
4.0
N/A
5.0
N/A
7.0
N/A
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
I
CCOQ
Quiescent V
CCO
supply current
XC6SLX4
XC6SLX9
XC6SLX16
XC6SLX25
XC6SLX25T
XC6SLX45
XC6SLX45T
XC6SLX75
XC6SLX75T
XC6SLX100
XC6SLX100T
XC6SLX150
XC6SLX150T
DS162 (v1.9) August 23, 2010
Advance Product Specification
www.xilinx.com
5
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