EEWORLDEEWORLDEEWORLD

Part Number

Search

BZT52-C3V9-7

Description
3.9V, 0.5W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, PLASTIC PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size107KB,3 Pages
ManufacturerDiodes
Websitehttp://www.diodes.com/
Download Datasheet Parametric View All

BZT52-C3V9-7 Overview

3.9V, 0.5W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, PLASTIC PACKAGE-2

BZT52-C3V9-7 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerDiodes
package instructionR-PDSO-G2
Contacts2
Reach Compliance Codeunknown
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeR-PDSO-G2
JESD-609 codee0
Maximum knee impedance500 Ω
Humidity sensitivity levelNOT SPECIFIED
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)235
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage3.9 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature10
Voltage temperatureCoeff-Max
Maximum voltage tolerance5.13%
Working test current5 mA
BZT52C2V0 - BZT52C39
SURFACE MOUNT ZENER DIODE
SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1
BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16
BZT52C18 BZT52C20 BZT52C22 BZT52C24 BZT52C27 BZT52C30 BZT52C33 BZT52C36 BZT52C39
Features
·
·
·
·
·
·
·
·
·
·
·
·
·
·
Planar Die Construction
500mW Power Dissipation on Ceramic PCB
General Purpose, Medium Current
Ideally Suited for Automated Assembly
Processes
Available in Lead Free Version
SOD-123
Dim
A
H
G
D
Min
3.55
2.55
1.40
0.25
Max
3.85
2.85
1.70
1.35
0.10
J
B
C
D
E
G
Mechanical Data
Case: SOD-123, Plastic
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020A
Terminals: Solderable per MIL-STD-202,
Method 208
Also Available in Lead Free Plating
(Matte Tin Finish). Please See
Ordering Information, Note 5, on Page 2
Polarity: Cathode Band
Marking: See Below
Weight: 0.01 grams (approx.)
Ordering Information: See Page 2
A
B
0.55 Typical
0.11 Typical
C
E
H
J
a
All Dimensions in mm
Maximum Ratings
Forward Voltage (Note 2)
Power Dissipation (Note 1)
@ T
A
= 25°C unless otherwise specified
Symbol
@ I
F
= 10mA
V
F
P
d
R
qJA
T
j,
T
STG
Value
0.9
500
305
-65 to +150
Unit
V
mW
°C/W
°C
Characteristic
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Notes:
1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm
2
.
2. Short duration test pulse used to minimize self-heating effect.
Marking Information
XX
Date Code Key
Year
Code
Month
Code
1998
J
Jan
1
1999
K
Feb
2
2000
L
March
3
XX = Product Type Marking Code (See Page 2)
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
2001
M
Apr
4
YM
2002
N
May
5
2003
P
Jun
6
2004
R
Jul
7
2005
S
Aug
8
2006
T
Sep
9
2007
U
Oct
O
2008
V
Nov
N
2009
W
Dec
D
DS18004 Rev. 21 - 2
1 of 3
www.diodes.com
BZT52C2V0 - BZT52C39
Looking for MSP430G2452 serial communication case
I am a novice in MSP, and I hope the experts can give me an MSP430g2452 serial communication case, such as sending a character or string to the serial port assistant....
1314de浪漫 Microcontroller MCU
Samsung A8 U-Ken S5PC100 Preview
[img]http://blog.mcuol.com/User/Urbetter/Album/2010-4-273bc94af8-1272-4525-add9-32de368ac8c0.jpg[/img][img]http://blog.mcuol.com/User/Urbetter/Album/2010-4-279ca7b9cc-d08c-488e-aa7d-322e134a8194.jpg[/...
outwoods Embedded System
Urgent!!! How to decompress the eboot.bin file!!!
After the eboot.bin file is burned into the system, it will be compressed into the eboot.nb0 file. I now need to know which file and which function the code for this compression process is in! Does an...
xw0326 Embedded System
Some problems with nested make
[size=4] In some large projects, we will put our source files of different modules or different functions in different directories. We can write a Makefile for each directory, which is helpful to make...
Jacktang DSP and ARM Processors
Industrial control engineer group 70677754 - exchange development experience, solve engineering problems, and find cooperation opportunities. Non-professionals are not allowed to join.
Industrial control design group——70677754, only experts are allowed to join. Please indicate your level and direction. This group aims to exchange development experience, solve engineering problems, a...
yang_0799 Embedded System
Doesn't the EK140P have an EIM interface?
[color=#000080]A: We are using the EK140P core board, which is connected to the FPGA through the EIM interface of imx6. A dual-port RAM is built inside the FPGA. [/color] [color=#000080]It is a bit di...
明远智睿Lan Integrated technical exchanges

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1027  1514  1767  2678  810  21  31  36  54  17 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号