CERAMIC CAPACITOR ARRAY
FEATURES
•
•
•
Four individual capacitors inside
one 1206 monolithic structure
Saves board and inventory space
One placement instead of four - less costly
•
•
•
Easier to handle and solder than 4 smaller chips
Tape and reel per EIA 481-1
RoHS Compliant
CAPACITOR OUTLINE DRAWING
T
L
CL
BW
W
P/2
Ref
P
BW1
TABLE 1
EIA DIMENSIONS – MILLIMETERS (INCHES)
Size
Code
1632
Length
L
3.2 (0.126)
±
0.2 (0.008)
Width
W
1.6 (.063)
±
0.2 (.008)
Thickness
T (max.)
0.7 - 1.35
(0.027 - 0.053)
Bandwidth
BW
Bandwidth
BW1
Pitch
P
0.40 (0.016)
0.1 - 0.5
0.8 (0.031)
±
0.2 (0.008) (0.004 - 0.020)
±
0.1 (0.004)
CERAMIC ARRAY ORDERING INFORMATION
C
1632
C
103
K
5
R
A
C
END METALLIZATION
C-Standard
(Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over T
emperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%)
VOLTAGE
5 = 50v; 3 = 25v; 4 = 16v; 8=10v
CERAMIC
EIA SIZE CODE
Ceramic chip array
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9pF (Example: 2.2pF = 229
.
CAPACITANCE TOLERANCE
K –
±10%:
M –
±20%
Standard Tolerances
Contact factory for any special requirements.
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
85
Ceramic Surface Mount
Notes:
1. Metric is controlling - English for reference only.
2. Pitch (P) tolerances are non-cumulative along the package.
3. Thickness (T) depends on capacitance.
CERAMIC CHIP ARRAY
TABLE 2A
C0G DIELECTRIC – CAPACITANCE RANGE
Capacitance
Values (pF)
KEMET Part Number
Capacitance
Tolerance
1632 CERAMIC ARRAY
LAND PATTERN LAYOUT
100V
200V
10V
16V
25V
50V
6 Places
P
X
8 Places
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
C1632C100(1)(2)GAC
C1632C120(1)(2)GAC
C1632C150(1)(2)GAC
C1632C180(1)(2)GAC
C1632C220(1)(2)GAC
C1632C270(1)(2)GAC
C1632C330(1)(2)GAC
C1632C390(1)(2)GAC
C1632C470(1)(2)GAC
C1632C560(1)(2)GAC
C1632C680(1)(2)GAC
C1632C820(1)(2)GAC
C1632C101(1)(2)GAC
C1632C121(1)(2)GAC
C1632C151(1)(2)GAC
C1632C181(1)(2)GAC
C1632C221(1)(2)GAC
C1632C271(1)(2)GAC
C1632C331(1)(2)GAC
C1632C391(1)(2)GAC
C1632C471(1)(2)GAC
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
100
120
150
180
220
270
330
390
470
560
680
820
G
Z
C
Y
Additional pad dimension information is available in
KEMET Technical Bulletin F-2100.
(1) To complete the KEMET part number, insert the alpha code for the tolerance desired.
K =
±10%
and M =
±20%
– standard tolerance. Contact factory for any special requirements.
(2) To complete the KEMET part number, insert appropriate number for voltage desired:
"5" = 50 volts, "3" = 25 volts, "4" = 16 volts, and "8" = 10 volts.
LAND PATTERN DIMENSIONS - CERAMIC CHIP
CAPACITOR ARRAYS - MM
Reflow Solder
Dimension
Z
3216
2.80
100V 200V
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined
tolerances
TABLE 2B
X7R DIELECTRIC – CAPACITANCE RANGE
Capacitance
Values (pF)
KEMET Part Number
Capacitance
Tolerance
G
0.40
X Y(ref) C(ref) P(ref)
0.80
0.52 1.20 1.60
10V
16V
25V
50V
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
10,000
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
68,000
82,000
100,000
C1632C331(1)(2)RAC
C1632C391(1)(2)RAC
C1632C471(1)(2)RAC
C1632C561(1)(2)RAC
C1632C681(1)(2)RAC
C1632C821(1)(2)RAC
C1632C102(1)(2)RAC
C1632C122(1)(2)RAC
C1632C152(1)(2)RAC
C1632C182(1)(2)RAC
C1632C222(1)(2)RAC
C1632C272(1)(2)RAC
C1632C332(1)(2)RAC
C1632C392(1)(2)RAC
C1632C472(1)(2)RAC
C1632C562(1)(2)RAC
C1632C682(1)(2)RAC
C1632C822(1)(2)RAC
C1632C103(1)(2)RAC
C1632C123(1)(2)RAC
C1632C153(1)(2)RAC
C1632C183(1)(2)RAC
C1632C223(1)(2)RAC
C1632C273(1)(2)RAC
C1632C333(1)(2)RAC
C1632C393(1)(2)RAC
C1632C473(1)(2)RAC
C1632C563(1)(2)RAC
C1632C683(1)(2)RAC
C1632C823(1)(2)RAC
C1632C104(1)(2)RAC
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
331
391
471
561
(1) To complete the KEMET part number, insert the alpha code for the tolerance desired:
K =
±10%
and M =
±20%
– standard tolerances. Contact factory for any special requirements.
(2) To complete the KEMET part number, insert appropriate number for voltage desired:
"5" = 50 volts, "3" = 25 volts, "4" = 16 volts,
and "8" = 10 volts.
86
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
g
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
®
T
ME
KE
Embossment
8mm
±.30
(.315
±.012")
or
12mm
±.30
(.472
±.012")
178mm (7.00")
or
330mm (13.00")
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
* Punched paper carrier used for 0402 and 0603 case size.
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Grid
Grid
placement
courtyard
Placement
Reflow Solder
Dimension
0402
0603
0805
1206
1210
1812
1825
2220
2225
Z
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
G
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
X Y(ref) C(ref)
0.74 0.93 1.21
1.08 1.05 1.73
1.60 1.30 2.00
2.00 1.50 3.00
2.90 1.50 3.00
3.70 1.80 4.10
6.90 1.80 4.10
5.50 1.85 5.15
6.80 1.85 5.15
Z
3.18
3.70
4.90
4.90
G
Wave Solder
X
0.80
1.10
1.40
2.00
Y(ref) Smin
1.25
1.50
1.70
1.70
1.93
2.20
3.20
3.20
Not Recommended
Courtyard
C
C
0.68
0.70
1.50
1.50
X
X
Not Recommended
G
G
Y
Z
Z
Y
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
93
Packaging
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Performance Notes
1. Cover Tape Break Force:
1.0 Kg Minimum.
2. Cover Tape Peel Strength:
The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 Newton to 1.0 Newton (10g to 100g)
12 mm
0.1 Newton to 1.3 Newton (10g to 130g)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier
tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape
shall be pulled at a velocity of 300 ±10 mm/minute.
3. Reel Sizes:
Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")
reels (with C-7280). Note that 13” reels are preferred.
4. Labeling:
Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.
Refer to EIA-556.
Embossed Carrier Tape Configuration:
Figure 1
Table 1 — EMBOSSED TAPE DIMENSIONS
(Metric will govern)
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
and
12 mm
D
0
E
P
0
4.0 ±0.10
(0.157 ±0.004)
P
2
2.0 ±0.05
(0.079 ±0.002)
T Max
0.600
(0.024)
T
1
Max
0.100
(0.004)
1.5
1.75 ±0.10
+0.10 -0.0
(0.059
(0.069 ±0.004)
+0.004, -0.0)
Pitch
Single
(4 mm)
B
1
Max.
Note 1
4.4
(0.173)
12 mm
Double
(8 mm)
8.2
(0.323)
D
1
Min.
Note 2
1.0
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
F
3.5 ±0.05
P
1
4.0 ±0.10
R Min.
Note 3
25.0
T
2
Max
2.5
(0.098)
W
8.0 ±0.30
(.315 ±0.012)
A
0
B
0
K
0
Note 4
(0.039) (0.138 ±0.002)
1.5
5.5 ±0.05
(0.059) (0.217 ±0.002)
(0.157 ±0.004) (0.984)
8.0 ±0.10
30.0
(0.315 ±0.004) (1.181)
4.6
12.0 ±0.30
(0.181) (0.472 ±0.012)
NOTES
1. B1 dimension is a reference dimension for tape feeder clearance only.
2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location and hole location shall be applied independent of each other.
3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)
4. The cavity defined by A
0
,
B
0
,
and K
0
shall be configured to surround the part with sufficient clearance such that the chip does not pro-
trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical
restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm
maximum in the pocket (not applicable to vertical clearance.)
94
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Embossed Carrier Tape Configuration (cont.)
20°
Sketch D:
Tape Camber (Top View)
1mm (0.039) Max.
250mm (9.843)
Allowable camber to be 1 mm/250 mm.
1mm (0.039) Max.
400mm (15.75) Min.
Figure 2:
Tape Leader
& Trailer
Dimensions
(Metric
Dimensions
Will Govern)
Figure 3:
Reel Dimensions (Metric Dimensions will govern)
Table 2 – REEL DIMENSIONS (Metric will govern)
Tape Size
8 mm
A Max
330.0
(12.992)
B* Min
1.5
(0.059)
C
13.0 ± 0.20
(0.512 ± 0.008)
D* Min
20.2
(0.795)
N Min
50.0
(1.969)
See
Note 3
Table 1
W
1
8.4
+1.5, -0.0
(0.331
+0.059, -0.0)
12.4
+2.0, -0.0
(0.488
+0.078, -0.0)
W
2
Max
14.4
(0.567)
W
3
7.9 Min
(0.311)
10.9 Max
(0.429)
11.9 Min
(0.469)
15.4 Max
(0.606)
12 mm
330.0
(12.992)
1.5
(0.059)
13.0 ± 0.20
(0.512 ± 0.008)
20.2
(0.795)
18.4
(0.724)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
95
Packaging
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