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P4C198AL-35JC

Description
Standard SRAM, 16KX4, 35ns, CMOS, PDSO24
Categorystorage    storage   
File Size598KB,9 Pages
ManufacturerPyramid Semiconductor Corporation
Websitehttp://www.pyramidsemiconductor.com/
Download Datasheet Parametric Compare View All

P4C198AL-35JC Overview

Standard SRAM, 16KX4, 35ns, CMOS, PDSO24

P4C198AL-35JC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPyramid Semiconductor Corporation
package instructionSOJ, SOJ24,.34
Reach Compliance Codeunknown
Maximum access time35 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-J24
JESD-609 codee0
memory density65536 bit
Memory IC TypeSTANDARD SRAM
memory width4
Number of terminals24
word count16384 words
character code16000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16KX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOJ
Encapsulate equivalent codeSOJ24,.34
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum standby current0.00015 A
Minimum standby current2 V
Maximum slew rate0.1 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationDUAL

P4C198AL-35JC Related Products

P4C198AL-35JC P4C198L-20LC P4C198-17CC P4C198-17JC P4C198-17LC P4C198-55CM P4C198A-55CM P4C198AL-20CC P4C198AL-35CC
Description Standard SRAM, 16KX4, 35ns, CMOS, PDSO24 Standard SRAM, 16KX4, 20ns, CMOS, CQCC28 Standard SRAM, 16KX4, 17ns, CMOS, CDIP24 Standard SRAM, 16KX4, 17ns, CMOS, PDSO24 Standard SRAM, 16KX4, 17ns, CMOS, CQCC28 Standard SRAM, 16KX4, 55ns, CMOS, CDIP24 Standard SRAM, 16KX4, 55ns, CMOS, CDIP24 Standard SRAM, 16KX4, 20ns, CMOS, CDIP24 Standard SRAM, 16KX4, 35ns, CMOS, CDIP24
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation
package instruction SOJ, SOJ24,.34 QCCN, LCC28,.35X.55 DIP, DIP24,.3 SOJ, SOJ24,.34 QCCN, LCC28,.35X.55 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 35 ns 20 ns 17 ns 17 ns 17 ns 55 ns 55 ns 20 ns 35 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-J24 R-XQCC-N28 R-XDIP-T24 R-PDSO-J24 R-XQCC-N28 R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-XDIP-T24
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 4 4 4 4 4 4 4 4 4
Number of terminals 24 28 24 24 28 24 24 24 24
word count 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words
character code 16000 16000 16000 16000 16000 16000 16000 16000 16000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 125 °C 125 °C 70 °C 70 °C
organize 16KX4 16KX4 16KX4 16KX4 16KX4 16KX4 16KX4 16KX4 16KX4
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code SOJ QCCN DIP SOJ QCCN DIP DIP DIP DIP
Encapsulate equivalent code SOJ24,.34 LCC28,.35X.55 DIP24,.3 SOJ24,.34 LCC28,.35X.55 DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE CHIP CARRIER IN-LINE SMALL OUTLINE CHIP CARRIER IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.00015 A 0.00015 A 0.015 A 0.015 A 0.015 A 0.02 A 0.02 A 0.00015 A 0.00015 A
Minimum standby current 2 V 2 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 2 V 2 V
Maximum slew rate 0.1 mA 0.1 mA 0.125 mA 0.125 mA 0.125 mA 0.12 mA 0.12 mA 0.1 mA 0.1 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO YES YES NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL MILITARY MILITARY COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND NO LEAD THROUGH-HOLE J BEND NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL QUAD DUAL DUAL QUAD DUAL DUAL DUAL DUAL
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