P4C198AL-55DM datasheet, PDF - EEWORLD Datasheet

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P4C198AL-55DM: DescriptionStandard SRAM, 16KX4, 55ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24; Categorystorage storage; File Size262KB，10 Pages; ManufacturerPyramid Semiconductor Corporation; Websitehttp://www.pyramidsemiconductor.com/

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P4C198AL-55DM Overview

Standard SRAM, 16KX4, 55ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24

P4C198AL-55DM Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Pyramid Semiconductor Corporation
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	55 ns
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	31.75 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of terminals	24
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX4
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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	P4C198AL-55DM	P4C198L-55DM	P4C198L-55DMB	P4C198L-55LM	P4C198L-55LMB	P4C198AL-55DMB	P4C198-55DM	P4C198-55LM	P4C198A-35PC	P4C198A-55DM
Description	Standard SRAM, 16KX4, 55ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24	Standard SRAM, 16KX4, 55ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24	Standard SRAM, 16KX4, 55ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24	Standard SRAM, 16KX4, 55ns, CMOS, CQCC28, 0.350 X 0.550 INCH, HERMETIC SEALED, CERAMIC, LCC-28	Standard SRAM, 16KX4, 55ns, CMOS, CQCC28, 0.350 X 0.550 INCH, HERMETIC SEALED, CERAMIC, LCC-28	Standard SRAM, 16KX4, 55ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24	Standard SRAM, 16KX4, 55ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24	Standard SRAM, 16KX4, 55ns, CMOS, CQCC28, 0.350 X 0.550 INCH, HERMETIC SEALED, CERAMIC, LCC-28	Standard SRAM, 16KX4, 35ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24	Standard SRAM, 16KX4, 55ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation
Parts packaging code	DIP	DIP	DIP	QLCC	QLCC	DIP	DIP	QLCC	DIP	DIP
package instruction	DIP,	DIP,	DIP,	QCCN,	QCCN,	DIP,	DIP,	QCCN,	DIP,	DIP,
Contacts	24	24	24	28	28	24	24	28	24	24
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	EAR99	3A001.A.2.C
Maximum access time	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns	35 ns	55 ns
JESD-30 code	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-CQCC-N28	R-CQCC-N28	R-GDIP-T24	R-GDIP-T24	R-CQCC-N28	R-PDIP-T24	R-GDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	31.75 mm	31.75 mm	31.75 mm	13.97 mm	13.97 mm	31.75 mm	31.75 mm	13.97 mm	31.9405 mm	31.75 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	24	24	24	28	28	24	24	28	24	24
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-55 °C
organize	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	QCCN	QCCN	DIP	DIP	QCCN	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	1.905 mm	1.905 mm	5.08 mm	5.08 mm	1.905 mm	4.318 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES	NO	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	8.89 mm	8.89 mm	7.62 mm	7.62 mm	8.89 mm	7.62 mm	7.62 mm

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