SKIIP192GH170-272CTVU datasheet, PDF

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SKIIP192GH170-272CTVU: DescriptionHalf Bridge Based Peripheral Driver, 188A; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size99KB，3 Pages; ManufacturerSEMIKRON; Websitehttp://www.semikron.com

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SKIIP192GH170-272CTVU Overview

Half Bridge Based Peripheral Driver, 188A

SKIIP192GH170-272CTVU Parametric

Parameter Name	Attribute value
Maker	SEMIKRON
package instruction	,
Reach Compliance Code	unknown
ECCN code	EAR99
Built-in protection	TRANSIENT; OVER CURRENT; THERMAL
Interface integrated circuit type	HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 code	R-XXMA-X
Number of functions	1
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
Output current flow direction	SOURCE AND SINK
Nominal output peak current	188 A
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
Maximum supply voltage	15.6 V
Minimum supply voltage	14.4 V
Nominal supply voltage	15 V
Supply voltage 1-max	30 V
Mains voltage 1-minute	20 V
Supply voltage1-Nom	24 V
surface mount	NO
Temperature level	OTHER
Terminal form	UNSPECIFIED
Terminal location	UNSPECIFIED

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SKiiP 192 GH170 - 272 CTV

Absolute Maximum Ratings

Symbol

V

isol 4)

T

op

,T

stg

Conditions

AC, 1min

Operating / stor. temperature

1)

Values

4000

-25...+85

1700

1200

150

-40...+150

150

300

1440

10

18

30

20,0

75

Units

V

°C

V

A

°C

A

kAs

2

V

kHz

kV/µs

IGBT and Inverse Diode

V

CES

V

CC 5)

Operating DC link voltage

I

C

IGBT

3)

T

j

IGBT + Diode

I

F

Diode

I

FM

Diode, t

p

< 1 ms

I

FSM

Diode, T

j

= 150 °C, 10ms; sin

2

I t (Diode) Diode, T

j

= 150 °C, 10ms

Driver

V

S1

Stabilized Power Supply

V

S2

Non-stabilized Power Supply

f

smax

Switching frequency

dV/dt

Primary to secondary side

SKiiPPACK

®

SK integrated intelligent

Power PACK

single phase bridge

SKiiP

7,9)

192 GH170 - 272 CTV

Preliminary Data

Case S2

Characteristics

Symbol

IGBT

11)

V

(BR)CES

I

CES

V

TO

r

T

V

Cesat

V

Cesat

E

on

+ E

off

C

CHC

L

CE

Conditions

1)

min.

≥V

CES

−

typ.

−

10

−

0,8

7,5

−

max.

−

1

−

1,77

23,6

5,1

3,85

127/195

−

2,60

2,90

18

0,90

8,1

0,129

0,375

43

Units

V

mA

V

mΩ

V

mJ

nF

nH

V

mJ

V

mΩ

K/W

K/KW

mA

µs

A

°C

V

Driver without supply

V

GE

= 0,

T

j

= 25 °C

T

j

= 125 °C

V

CE

= V

CES

T

j

= 125 °C

T

j

= 125 °C

I

C

= 140A,

T

j

= 125 °C

I

C

= 140A,

T

j

= 25 °C

V

CC

=900/1200V, I

C

=150A

T

j

= 125 °C

per Phase, AC side

Top, Bottom

T

j

= 125 °C

T

j

= 25 °C

T

j

= 125 °C

Inverse Diode

2)

V

F

= V

EC

I

F

= 140A;

V

F

= V

EC

I

F

= 140A;

E

on

+ E

off

I

F

= 150A;

V

TO

T

j

= 125 °C

r

T

j

= 125 °C

Features

•

Short circuit protection, due to

evaluation of current sensor

signals

•

Isolated power supply

•

Low thermal impedance

•

Optimal thermal management

with integrated heatsink

•

Pressure contact technology

with increased power cycling

capability, compact design

•

Low stray inductance

•

High power, small losses

•

Over-temperature protection

1)

2)

3)

4)

Thermal Characteristics

R

thjs10)

per IGBT

10)

R

thjs

per Diode

6,10)

R

thsa

P16 heatsink; see case S2

Driver

I

S1

Supply current 15V-supply

I

S2

Supply current 24V-supply

t

interlock-driver

Interlock-time

SKiiPPACK protection

I

TRIPSC

Short circuit protection

I

TRIPLG

Ground fault protection

T

TRIP

Over-temp. protection

9)

U

DCTRIP

U

DC

-protection

Mechanical Data

M1

DC terminals, SI Units

M2

AC terminals, SI Units

©by

SEMIKRON

5)

6)

7)

230+250*f

s

/f

smax

+3,5*I

AC

/A

170+170*f

s

/f

smax

+2,6*I

AC

/A

2,3

188

43

115

1225

4

8

−

0898

6

10

9)

10)

T

heatsink

= 25 °C, unless

otherwise specified

CAL = Controlled Axial Lifetime

Technology (soft and fast)

without driver

Driver input to DC link /

AC output to DC link / AC

output to heatsink

with Semikron-DC link (low

inductance)

other heatsinks on request

C - Integrated current sensors

T - Temperature protection

V - 15 V or 24 V power supply

options available for driver:

U - DC link voltage sense

F – Fiber optic connector

“

s

” referenced to temperature

sensor

Nm

B 7

−

63

SKIIP192GH170-272CTVU Related Products

	SKIIP192GH170-272CTVU	SKIIP192GH170-272CTVF
Description	Half Bridge Based Peripheral Driver, 188A	Half Bridge Based Peripheral Driver, 188A
Maker	SEMIKRON	SEMIKRON
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Built-in protection	TRANSIENT; OVER CURRENT; THERMAL	TRANSIENT; OVER CURRENT; THERMAL
Interface integrated circuit type	HALF BRIDGE BASED PERIPHERAL DRIVER	HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 code	R-XXMA-X	R-XXMA-X
Number of functions	1	1
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-25 °C	-25 °C
Output current flow direction	SOURCE AND SINK	SOURCE AND SINK
Nominal output peak current	188 A	188 A
Package body material	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified
Maximum supply voltage	15.6 V	15.6 V
Minimum supply voltage	14.4 V	14.4 V
Nominal supply voltage	15 V	15 V
Supply voltage 1-max	30 V	30 V
Mains voltage 1-minute	20 V	20 V
Supply voltage1-Nom	24 V	24 V
surface mount	NO	NO
Temperature level	OTHER	OTHER
Terminal form	UNSPECIFIED	UNSPECIFIED
Terminal location	UNSPECIFIED	UNSPECIFIED

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