NXP Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing
FEATURES
•
One pin digital volume control (for each channel)
•
Volume setting with up/down pulses
•
Auto repeat function on volume setting
•
Headphone sensing
•
Maximum gain set by selection pin
•
Low sensitivity for EMC radiation
•
Internal feedback resistors
•
Flexibility in use
•
Few external components
•
Low saturation voltage of output stage
•
Standby mode controlled by CMOS compatible levels
•
Low standby current
•
No switch-on/switch-off plops
•
High supply voltage ripple rejection
•
Protected against electrostatic discharge
•
Outputs short-circuit safe to ground, V
DD
and across the
load
•
Thermally protected.
APPLICATIONS
•
Portable consumer products
•
Notebook computers
•
Communication equipment.
ORDERING INFORMATION
TYPE
NUMBER
TDA8552T
TDA8552TS
PACKAGE
NAME
SO20
DESCRIPTION
TDA8552T; TDA8552TS
GENERAL DESCRIPTION
The TDA8552T is a two channel audio power amplifier that
provides an output power of 2
×
1.4 W into an 8
Ω
load
using a 5 V power supply. The circuit contains two BTL
power amplifiers, two digital volume controls and
standby/mute logic. Volume and balance of the amplifiers
are controlled using two digital input pins which can be
driven by simple push-buttons or by a microcontroller.
Using the selection pin (GAINSEL) the maximum gain can
be set at 20 or 30 dB. The headphone sense input (HPS)
can be used to detect if a headphone is plugged into the
jack connector. If a headphone is plugged into the jack
connector the amplifier switches from the BTL to the SE
mode and the BTL loudspeakers are switched off. This
also results in a reduction of quiescent current
consumption.
The TDA8552T is contained in a 20-pin small outline
package. For the TDA8552TS, which is contained in a
20-pin very small outline package, the maximum output
power is limited by the maximum allowed ambient
temperature. More information can be found in Section
“Thermal design considerations”. The SO20 package has
the four corner leads connected to the die pad so that the
thermal behaviour can be improved by the PCB layout.
VERSION
SOT163-1
SOT266-1
plastic small outline package; 20 leads; body width 7.5 mm
SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm
2002 Jan 04
2
NXP Semiconductors
Product specification
2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing
PINNING
SYMBOL
GND1
OUT2+
V
DD1
HPS
MODE
PIN
(1)
1
2
3
4
5
DESCRIPTION
ground 1, substrate/leadframe
positive loudspeaker terminal
output channel 2
supply voltage 1
digital input for headphone
sensing
digital trinary input for mode
selection (standby, mute and
operating)
digital trinary input for volume
control channel 1
digital trinary input for volume
control channel 2
supply voltage 2
negative loudspeaker terminal
output channel 2
ground 2, substrate/leadframe
ground 3, substrate/leadframe
positive loudspeaker terminal
output channel 1
supply voltage 3
digital input for gain selection
audio input channel 2
half supply voltage, decoupling
ripple rejection
audio input channel 1
supply voltage 4
negative loudspeaker terminal
output channel 1
ground 4, substrate/leadframe
handbook, halfpage
TDA8552T; TDA8552TS
GND1 1
OUT2+ 2
VDD1 3
HPS 4
MODE 5
20 GND4
19 OUT1−
18 VDD4
17 IN1
16 SVR
UP/DOWN1
UP/DOWN2
V
DD2
OUT2−
GND2
GND3
OUT1+
V
DD3
GAINSEL
IN2
SVR
IN1
V
DD4
OUT1−
GND4
Note
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
TDA8552T
UP/DOWN1 6
UP/DOWN2 7
VDD2 8
OUT2− 9
GND2 10
MGM610
15 IN2
14 GAINSEL
13 VDD3
12 OUT1+
11 GND3
Fig.2 Pin configuration.
1. For the SO20 (SOT163-1) package only: the ground
pins 1, 10, 11 and 20 are mechanically connected to
the leadframe and electrically to the substrate of the
die. On the PCB the ground pins can be connected to
a copper area to decrease the thermal resistance.
2002 Jan 04
5
DSP and ARM Processors
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