Serial IO/Communication Controller, Hybrid, CQIP90,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Marconi Electronic Devices Inc |
| package instruction | QIP, QUIP90B,1.1/1.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XQIP-P90 |
| JESD-609 code | e0 |
| Number of terminals | 90 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | QIP |
| Encapsulate equivalent code | QUIP90B,1.1/1.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5,+-12 V |
| Certification status | Not Qualified |
| Maximum slew rate | 315 mA |
| surface mount | NO |
| technology | HYBRID |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| CT2526 | CT2527 | CT2527-FP | CT2526-FP | CT2525-FP | CT2525 | |
|---|---|---|---|---|---|---|
| Description | Serial IO/Communication Controller, Hybrid, CQIP90, | Serial IO/Communication Controller, Hybrid, CQIP90, | Serial IO/Communication Controller, Hybrid, CDFP88, | Serial IO/Communication Controller, Hybrid, CDFP88, | Serial IO/Communication Controller, Hybrid, CDFP88, | Serial IO/Communication Controller, Hybrid, CQIP90, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | QIP, QUIP90B,1.1/1.3 | QIP, QUIP90B,1.1/1.3 | DFP, FL88,1.6 | DFP, FL88,1.6 | DFP, FL88,1.6 | QIP, QUIP90B,1.1/1.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XQIP-P90 | R-XQIP-P90 | R-XDFP-F88 | R-XDFP-F88 | R-XDFP-F88 | R-XQIP-P90 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 90 | 90 | 88 | 88 | 88 | 90 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QIP | QIP | DFP | DFP | DFP | QIP |
| Encapsulate equivalent code | QUIP90B,1.1/1.3 | QUIP90B,1.1/1.3 | FL88,1.6 | FL88,1.6 | FL88,1.6 | QUIP90B,1.1/1.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | FLATPACK | FLATPACK | FLATPACK | IN-LINE |
| power supply | 5,+-12 V | 5 V | 5 V | 5,+-12 V | 5,+-15 V | 5,+-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 315 mA | 610 mA | 610 mA | 315 mA | 260 mA | 260 mA |
| surface mount | NO | NO | YES | YES | YES | NO |
| technology | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG | PIN/PEG | FLAT | FLAT | FLAT | PIN/PEG |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD |
| Maker | Marconi Electronic Devices Inc | - | - | Marconi Electronic Devices Inc | Marconi Electronic Devices Inc | Marconi Electronic Devices Inc |
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