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MCM6206NP25

Description
IC,SRAM,32KX8,CMOS,DIP,28PIN,PLASTIC
Categorystorage    storage   
File Size389KB,6 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MCM6206NP25 Overview

IC,SRAM,32KX8,CMOS,DIP,28PIN,PLASTIC

MCM6206NP25 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
package instructionDIP, DIP28,.3
Reach Compliance Codeunknown
Maximum access time25 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T28
JESD-609 codee0
length34.67 mm
memory density262144 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height4.57 mm
Maximum standby current0.02 A
Minimum standby current4.5 V
Maximum slew rate0.14 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
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