L6116
DEVICES INCORPORATED
2K x 8 Static RAM (Low Power)
L6116
DEVICES INCORPORATED
2K x 8 Static RAM (Low Power)
DESCRIPTION
The
L6116
is a high-performance, low-
power CMOS Static RAM. The
storage circuitry is organized as 2048
words by 8 bits per word. The 8 Data
In and Data Out signals share I/O
pins. These devices are available in
three speeds with maximum access
times from 15 ns to 25 ns.
Inputs and outputs are TTL compat-
ible. Operation is from a single +5 V
power supply. Power consumption
for the L6116 is 425 mW (typical) at
25 ns. Dissipation drops to 60 mW
(typical) for the L6116 and 50 mW
(typical) for the L6116-L when the
memory is deselected.
Two standby modes are available.
Proprietary Auto-Powerdown™
circuitry reduces power consumption
automatically during read or write
accesses which are longer than the
minimum access time or when the
memory is deselected. In addition,
data may be retained in inactive
storage with a supply voltage as low
as 2 V. The L6116 and L6116-L
consume only 30 µW and 15 µW
(typical) respectively, at 3 V, allowing
effective battery backup operation.
The L6116 provides asynchronous
(unclocked) operation with matching
access and cycle times. An active-low
Chip Enable and a three-state I/O bus
with a separate Output Enable control
simplify the connection of several
chips for increased storage capacity.
Memory locations are specified on
address pins A
0
through A
10
. Reading
from a designated location is
accomplished by presenting an
address and driving CE and OE LOW,
while WE remains HIGH. The data in
the addressed memory location will
then appear on the Data Out pins
within one access time. The output
pins stay in a high-impedance state
when CE or OE is HIGH, or WE is
LOW.
Writing to an addressed location is
accomplished when the active-low CE
and WE inputs are both LOW. Either
signal may be used to terminate the
write operation. Data In and Data Out
signals have the same polarity.
Latchup and static discharge pro-
tection are provided on-chip. The
L6116 can withstand an injection
current of up to 200 mA on any pin
without damage.
128 x 16 x 8
MEMORY
ARRAY
FEATURES
q
2K x 8 Static RAM with Chip Select
Powerdown, Output Enable
q
Auto-Powerdown™ Design
q
Advanced CMOS Technology
q
High Speed — to 15 ns maximum
q
Low Power Operation
Active:
425 mW typical at 25 ns
Standby (typical):
400 µW (L6116)
200 µW (L6116-L)
q
Data Retention at 2 V for Battery
Backup Operation
q
DESC SMD No.
5962-84036 — L6116
5962-89690 — L6116
5962-88740 — L6116-L
q
Available 100% Screened to
MIL-STD-883, Class B
q
Plug Compatible with IDT6116,
Cypress CY7C128/CY6116
q
Package Styles Available:
• 24-pin Plastic DIP
• 24-pin CerDIP
• 24-pin Plastic SOJ
• 24-pin Ceramic Flatpack
• 28-pin Ceramic LCC
• 32-pin Ceramic LCC
L6116 B
LOCK
D
IAGRAM
ROW
ADDRESS
7
CE
WE
OE
4
COLUMN ADDRESS
CONTROL
COLUMN SELECT
& COLUMN SENSE
ROW SELECT
8
I/O
7-0
16K Static RAMs
1
03/21/95–LDS.6116-F
L6116
DEVICES INCORPORATED
2K x 8 Static RAM (Low Power)
NOTES
1. Maximum Ratings indicate stress specifi-
cations only. Functional operation of these
products at values beyond those indicated
in the Operating Conditions table is not
implied. Exposure to maximum rating con-
ditions for extended periods may affect re-
liability of the tested device.
2. The products described by this specifica-
tion include internal circuitry designed to
protect the chip from damaging substrate
injection currents and accumulations of
static charge. Nevertheless, conventional
precautions should be observed during
storage, handling, and use of these circuits
in order to avoid exposure to excessive elec-
trical stress values.
3. This product provides hard clamping of
transient undershoot. Input levels below
ground will be clamped beginning at –0.6 V.
A current in excess of 100 mA is required to
reach –2.0 V. The device can withstand in-
definite operation with inputs as low as –3 V
subject only to power dissipation and bond
wire fusing constraints.
4. Tested with GND
≤
V
OUT
≤
V
CC
. The
device is disabled, i.e., CE =
V
CC
.
5. A series of normalized curves is available
to supply the designer with typical DC and
AC parametric information for Logic Devices
Static RAMs. These curves may be used to
determine device characteristics at various
temperatures and voltage levels.
6. Tested with all address and data inputs
changing at the maximum cycle rate. The
device is continuously enabled for writing,
i.e., CE
≤
V
IL
, WE
≤
V
IL
. Input pulse levels
are 0 to 3.0 V.
7. Tested with outputs open and all address
and data inputs changing at the maximum
read cycle rate. The device is continuously
disabled, i.e., CE
≥
V
IH
.
8. Tested with outputs open and all address
and data inputs stable. The device is con-
tinuously disabled, i.e., CE =
V
CC
. Input
levels are within 0.2 V of
V
CC
or GND.
9. Data retention operation requires that
V
CC
never drop below 2.0 V. CE must be
≥
V
CC
– 0.2 V. All other inputs must meet
V
IN
≥
V
CC
– 0.2 V or
V
IN
≤
0.2 V to ensure
full powerdown. For low power version (if
applicable), this requirement applies only to
CE and WE; there are no restrictions on data
and address.
10. These parameters are guaranteed but
not 100% tested.
11. Test conditions assume input transition
times of less than 3 ns, reference levels of
1.5 V, output loading for specified
I
OL
and
I
OH
plus 30 pF (Fig. 1a), and input pulse
levels of 0 to 3.0 V (Fig. 2).
12. Each parameter is shown as a minimum
or maximum value. Input requirements are
specified from the point of view of the exter-
nal system driving the chip. For example,
t
AVEW
is specified as a minimum since the
external system must supply at least that
much time to meet the worst-case require-
ments of all parts. Responses from the inter-
nal circuitry are specified from the point of
view of the device. Access time, for ex-
ample, is specified as a maximum since
worst-case operation of any device always
provides data within that time.
13. WE is high for the read cycle.
14. The chip is continuously selected (CE
low).
15. All address lines are valid prior-to or
coincident-with the CE transition to active.
16. The internal write cycle of the memory
is defined by the overlap of CE active and
WE low. All three signals must be active to
initiate a write. Any signal can terminate a
write by going inactive. The address, data,
and control input setup and hold times
should be referenced to the signal that be-
comes active last or becomes inactive first.
17. If WE goes low before or concurrent
with the latter of CE going active, the output
remains in a high impedance state.
18. If CE goes inactive before or concurrent
with WE going high, the output remains in
a high impedance state.
19. Powerup from
I
CC2
to
I
CC1
occurs as a
result of any of the following conditions:
a. Falling edge of CE.
b. Falling edge of WE (CE active).
c. Transition on any address line (CE
active).
d. Transition on any data line (CE, and WE
active).
The device automatically powers down
from
I
CC1
to
I
CC2
after
t
PD
has elapsed from
any of the prior conditions. This means that
power dissipation is dependent on only
cycle rate, and is not on Chip Select pulse
width.
+5 V
OUTPUT
R
2
255
Ω
R
1
480
Ω
20. At any given temperature and voltage
condition, output disable time is less than
output enable time for any given device.
21. Transition is measured ±200 mV from
steady state voltage with specified loading
in Fig. 1b. This parameter is sampled and
not 100% tested.
22. All address timings are referenced from
the last valid address line to the first transi-
tioning address line.
23. CE or WE must be inactive during ad-
dress transitions.
24. This product is a very high speed device
and care must be taken during testing in
order to realize valid test information. In-
adequate attention to setups and proce-
dures can cause a good part to be rejected as
faulty. Long high inductance leads that
cause supply bounce must be avoided by
bringing the
V
CC
and ground planes di-
rectly up to the contactor fingers. A 0.01 µF
high frequency capacitor is also required
between
V
CC
and ground. To avoid signal
reflections, proper terminations must be
used.
F
IGURE
1a.
R
1
480
Ω
+5 V
OUTPUT
INCLUDING
JIG AND
SCOPE
30 pF
R
2
255
Ω
F
IGURE
1b.
INCLUDING
JIG AND
SCOPE
5 pF
F
IGURE
2.
+3.0 V
10%
90%
90%
10%
<3 ns
GND
<3 ns
16K Static RAMs
5
03/21/95–LDS.6116-F
Automotive Electronics
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