L8C2011KMB25 datasheet, PDF - EEWORLD Datasheet

L8C2011KMB25: DescriptionFIFO, 512X9, 25ns, Asynchronous, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32; Categorystorage storage; File Size542KB，12 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L8C2011KMB25 Overview

FIFO, 512X9, 25ns, Asynchronous, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	QFJ
package instruction	QCCN,
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	25 ns
Other features	RETRANSMIT
period time	35 ns
JESD-30 code	R-CQCC-N32
length	14 mm
memory density	4608 bit
memory width	9
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512X9
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.048 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.43 mm

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