05153
LC0408FC3.3C
thru
LC0408FC36C
LOW CAPACITANCE FLIP CHIP ARRAY
APPLICATIONS
✔
Cellular Phones
✔
Personal Digital Assistant (PDA)
✔
Notebook Computers
✔
SMART Cards
IEC COMPATIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
0402 CHIP SHOWN
FEATURES
✔
ESD Protection > 25 kilovolts
✔
Available in Voltages Ranging From 3.3V to 36V
✔
200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔
Low Clamping Voltage
✔
Bidirectional Configuration & Monolithic Structure
✔
Protects 4 to 7 Lines
✔
Low Capacitance
✔
Low Leakage Current
✔
RoHS Compliant
MECHANICAL CHARACTERISTICS
✔
Standard EIA Chip Size: 0408
✔
Weight 0.73 milligrams (Approximate)
✔
Available in Lead-Free Plating
✔
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔
Consult Factory for Leaded Device Availability
✔
Flammability Rating UL 94V-0
✔
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔
Device Marking On Reel
✔
Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
05153.R7 2/07
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LC0408FC36C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS
@ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
T
A
T
STG
VALUE
200
-55 to 150
-55 to 150
UNITS
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
7.0
11.0
13.2
19.8
25.4
37.2
70.0
@ 25°C Unless Otherwise Specified
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
µA
75*
10**
1
1
1
1
1
TYPICAL
CAPACITANCE
V
WM
VOLTS
LC0408FC3.3C
LC0408FC05C
LC0408FC08C
LC0408FC12C
LC0408FC15C
LC0408FC24C
LC0408FC36C
3.3
5.9
8.0
12.0
15.0
24.0
36.0
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
40.0
@8/20µs
V
C
@ I
PP
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
80.0V @ 2.5A
@0V, 1 MHz
C
pF
70
35
32
30
25
20
18
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2:
*Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
I
PP
- Peak Pulse Current - % of I
PP
P
PP
- Peak Pulse Current - Watts
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
1,000
200W, 8/20µs Waveform
100
e
-t
t
d
= t I /2
PP
10
0.01
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
0
5
10
15
t - Time - µs
20
25
30
05153.R7 2/07
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GRAPHS
100
80
% Of Rated Power
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20µs
60
40
20
Average Power
0
0
25
50
75
100
125
T
A
- Ambient Temperature - °C
150
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR LC0408FC05C
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0408FC05C
14
12
10
8
6
4
2
0
0
5
10
I
PP
- Peak Pulse Current - Amps
15
20
05153.R7 2/07
V
C
- Clamping Voltage - Volts
3
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LC0408FC36C
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T
P
Ramp-up
Temperature - °C
Ramp-down
T
L
T
SMAX
155°
T
SMIN
140°
T
S
- Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
05153.R7 2/07
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LC0408FC36C
0408 PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
DIM
A
B
C
E
SIDE
PACKAGE DIMENSIONS
MILLIMETERS
0.56 NOM
0.86 NOM
0.99 ± 0.0254
0.15 SQ
2.0 ± 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
I
0.406 NOM
INCHES
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.079 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
TOP
F
G
H
A
B
C
E
F
H
G
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
END
I
MOUNTING PAD LAYOUT - Option 1
DIM
D
C
A
DIE
SOLDER
BUMP
PAD DIMENSIONS
MILLIMETERS
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
A
C
D
E
F
G
H
I
NOTE:
E
H
G
1.
Preferred:
Using 0.1mm (0.004”) stencil.
I
SOLDER PADS
SOLDER PRINT 0.010” - 0.012” DIA.
SOLDER
MASK
05153.R7 2/07
5
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Microcontroller MCU
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