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74AUP1G97_10

Description
SPECIALTY LOGIC CIRCUIT, PDSO6
Categorysemiconductor    logic   
File Size155KB,22 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

74AUP1G97_10 Overview

SPECIALTY LOGIC CIRCUIT, PDSO6

74AUP1G97_10 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals6
Maximum operating temperature125 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage0.8000 V
Rated supply voltage1.1 V
Processing package description1 × 1.45 MM, 0.50 MM HEIGHT, Plastic, MO-252, SOT-886, SON-6
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
CraftsmanshipCMOS
packaging shapeRectangle
Package SizeSMALL OUTLINE, VERY THIN PROFILE
surface mountYes
Terminal formNO
Terminal spacing0.5000 mm
terminal coatingtin
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
Temperature levelAUTOMOTIVE
seriesAUP/ULP/V
Logic circuit typelogic circuit
74AUP1G97
Low-power configurable multiple function gate
Rev. 6 — 10 January 2011
Product data sheet
1. General description
The 74AUP1G97 provides configurable multiple functions. The output state is determined
by eight patterns of 3-bit input. The user can choose the logic functions MUX, AND, OR,
NAND, NOR, inverter and buffer. All inputs can be connected to V
CC
or GND.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
The 74AUP1G97 has Schmitt trigger inputs making it capable of transforming slowly
changing input signals into sharply defined, jitter-free output signals.
The inputs switch at different points for positive and negative-going signals. The difference
between the positive voltage V
T+
and the negative voltage V
T−
is defined as the input
hysteresis voltage V
H
.
2. Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
ESD protection:
HBM JESD22-A114F exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; I
CC
= 0.9
μA
(maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V
CC
I
OFF
circuitry provides partial power-down mode operation
Multiple package options
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C

74AUP1G97_10 Related Products

74AUP1G97_10 74AUP1G97GN 74AUP1G97GF 74AUP1G97 74AUP1G97GM 74AUP1G97GS 74AUP1G97_11
Description SPECIALTY LOGIC CIRCUIT, PDSO6 SPECIALTY LOGIC CIRCUIT, PDSO6 SPECIALTY LOGIC CIRCUIT, PDSO6 SPECIALTY LOGIC CIRCUIT, PDSO6 SPECIALTY LOGIC CIRCUIT, PDSO6 SPECIALTY LOGIC CIRCUIT, PDSO6 SPECIALTY LOGIC CIRCUIT, PDSO6
Number of functions 1 1 1 - 1 1 1
Number of terminals 6 6 6 - 6 6 6
Maximum operating temperature 125 Cel 125 °C 125 °C - 125 °C 125 °C 125 Cel
Minimum operating temperature -40 Cel -40 °C -40 °C - -40 °C -40 °C -40 Cel
surface mount Yes YES YES - YES YES Yes
Terminal form NO NO LEAD NO LEAD - NO LEAD NO LEAD NO
Terminal location pair DUAL DUAL - DUAL DUAL pair
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
series AUP/ULP/V AUP/ULP/V AUP/ULP/V - AUP/ULP/V AUP/ULP/V AUP/ULP/V
Is it Rohs certified? - conform to conform to - conform to conform to -
Maker - NXP NXP - NXP NXP -
Parts packaging code - SON SON - SON SON -
package instruction - 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6 - VSON, 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6 -
Contacts - 6 6 - 6 6 -
Reach Compliance Code - unknow compli unknow compli unknow -
JESD-30 code - R-PDSO-N6 S-PDSO-N6 - R-PDSO-N6 S-PDSO-N6 -
JESD-609 code - e3 e3 - e3 e3 -
length - 1 mm 1 mm - 1.45 mm 1 mm -
Logic integrated circuit type - LOGIC CIRCUIT LOGIC CIRCUIT - LOGIC CIRCUIT LOGIC CIRCUIT -
Humidity sensitivity level - 1 1 - 1 1 -
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code - SON VSON - VSON VSON -
Package shape - RECTANGULAR SQUARE - RECTANGULAR SQUARE -
Package form - SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE -
Peak Reflow Temperature (Celsius) - 260 260 - 260 260 -
Certification status - Not Qualified Not Qualified - Not Qualified Not Qualified -
Maximum seat height - 0.35 mm 0.5 mm - 0.5 mm 0.35 mm -
Maximum supply voltage (Vsup) - 3.6 V 3.6 V - 3.6 V 3.6 V -
Minimum supply voltage (Vsup) - 0.8 V 0.8 V - 0.8 V 0.8 V -
Nominal supply voltage (Vsup) - 1.1 V 1.1 V - 1.1 V 1.1 V -
technology - CMOS CMOS - CMOS CMOS -
Terminal surface - TIN Tin (Sn) - Tin (Sn) TIN -
Terminal pitch - 0.3 mm 0.35 mm - 0.5 mm 0.35 mm -
Maximum time at peak reflow temperature - 30 30 - 30 30 -
width - 0.9 mm 1 mm - 1 mm 1 mm -

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